Semiconductors

SEMICONDUCTORS ARTICLES



Micron begins STT-MRAM dev partnership at A*STAR

11/08/2011 

Micron and Singapore's A*STAR Data Storage Institute will collaborate on spin transfer torque magnetic random access memory (STT-MRAM) development, both investing in the R&D and collaborating on the projects, over the next 3 years.

Graphene doping doesn't need its own step when done on the edge

11/07/2011 

Georgia Institute of Technology (Georgia Tech) researchers compared graphene doping techniques for device interconnects and found that edge passivation is 1000x more effective than surface treatment.

Predicting plasma in wafer etch and deposition via quantum mechanics

11/07/2011 

Simulation work can play an important role in understanding fundamental plasma physics, and providing insights into process optimization and development in wafer etch and deposition. Quantemol and TEL authors discuss their simulations and observations.

STM completes 20nm chip tapeout with MENT design tools

11/07/2011 

Mentor Graphics Corporation (NASDAQ:MENT) completed a 20nm test chip tapeout with STMicroelectronics (NYSE:STM), overcoming low-power and double-patterning challenges.

2011 IC sales 2%: Who's overachieving, who's tanking

11/04/2011 

While everyone's now expecting 2011 to skid into low-single-digit growth (~2% or maybe lower), that overall metric hides some impressive individual results for a number of companies and a variety of reasons, notes IC Insights.

SEMATECH ISMI roundup: Fab diagnostics, energy consumption, ESH update

11/04/2011 

Key themes summed up from ISMI's Manufacturing Week (Oct. 17-21) included predicting and monitoring equipment health, optimizing WIP and maintenance scheduling, reducing energy consumption at both the tool and fab-wide level, and various areas of nanomaterial health/safety concerns.

300mm wafers buck soft silicon growth trend

11/04/2011 

"Silicon shipments for the most recent quarter are reflecting the general hesitancy of the market,

Improved post-etch metal and oxide residue removal yields

11/03/2011 

Avantor Performance Materials and SSMC Inc. compare the use of a semi-aqueous post-etch ash residue remover with an industry-standard HA-based residue removal chemistry. The semi-aqueous-based product was shown to reduce COO for manufacturing of low- and high-voltage logic devices, and increase yields.

Freescale Semiconductor CEO takes SIA lead

11/03/2011 

The Semiconductor Industry Association (SIA) elected Freescale Semiconductor CEO Rich Beyer as its 2012 chairman. This will be the SIA's 35th year.

BSI image sensors avoid distortion with Ziptronix bonding process

11/03/2011 

Ziptronix ZiBond direct bonding process contribute minimum distortion in backside illuminated (BSI) image sensors because of its low-temperature processing and high bond strength, the company reports.

MEMS alternatives for miniature auto-focus cameras

11/02/2011 

Dr. Giles Humpston, Tessera, presents the free, on-demand webcast Lens Tilt in Small Auto-Focus Cameras. Dr. Humpston covers the dominant auto-focus miniature camera technology today -- VCM -- and an improved technology based on MEMS, which is being commercialized now.

Liquid-borne sub-micrometer particle counting recommendation dispels common miconception

11/02/2011 

IEST-RP-CC042.1: Sizing and Counting of Submicrometer Liquid-Borne Particles Using Optical Discrete-Particle Counters, is now available from the Institute of Environmental Sciences and Technology. It dispels a common misconception among semiconductor, FPD, and data storage manufacturing users.

MOSAID taps Winpac to package fastest NAND Flash device

11/02/2011 

MOSAID launched the 256Gb HLNAND2 semiconductor memory device, operating at up to 800MB/s per channel for mass storage applications. Winpac will package and distribute HLNAND devices for MOSAID.

AFM attachment uses rare-earth magnets for conductive and magnetic microscopy

11/01/2011 

Asylum Research introduced the Variable Field Module2 (VFM2) for the MFP-3D AFM. It allows researchers to apply magnetic fields in conductive AFM experiments, magnetic force microscopy, and other applications.

ATMI pays $95M to bring SDS gas system manufacturing and sales in-house

11/01/2011 

ATMI has taken control of, and responsibility for, worldwide distribution of its proprietary Safe Delivery Source (SDS), gas storage and delivery system and related technologies from Matheson Tri-Gas.

450mm wafer platform from Crossing Automation offers a bridge gap solution

11/01/2011 

Crossing Automation Inc. introduced its Crossing Spartan 450mm Development Platform and Crossing Certon 450 Loadport. Crossing Automation's May Su discusses the product design, including single FOUP EFEM.

Semiconductor sales improve in Sept., suggest 2% growth for 2011

10/31/2011 

Global sales of semiconductors rose again slightly in September for the second consecutive month, providing "an optimistic" close to 3Q11 -- though the industry still struggles to find some visibility heading into the all-important seasonal year-end holiday consumer purchasing cycle.

Ushio achieves 30W EUV lithography output

10/31/2011 

USHIO INC.'s wholly owned subsidiary, XTREME technologies GmbH, achieved 30W output at an intermediate focus under a duty cycle of 100% for high-volume extreme ultraviolet (EUV) lithography.

GlobalFoundries names CEO: Manocha keeps the job

10/31/2011 

GLOBALFOUNDRIES named Ajit Manocha its permanent CEO, chosen by the foundry's Board of Directors. He had served as interim CEO since June 2011.

Spansion consolidates test and assembly ops

10/31/2011 

Spansion Inc. (NYSE:CODE) will consolidate its 2 semiconductor assembly and test services (SATS) operations, closing its facility in Kuala Lumpur, Malaysia, to reduce costs by about $30 million annually.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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