09/19/2011 

Applied Materials (AMAT) unveiled its Centura Tetra EUV advanced reticle etch system at the SPIE BACUS conference. Amitabh Sabharwal, GM, mask etch products, talks about the product's technical specs, and how it overcame EUV challenges.

09/19/2011 

Another sign of the times in Japan's semiconductor industry: a soaring yen and plunging DRAM prices are forcing Elpida Memory to offload much of its DRAM production to Taiwanese JV Rexchip.

09/16/2011 

Techcet's Michael A. Fury shares some bullet-point analyses from IC Insights' Fall Forecast Seminar in Sunnyvale, CA, where the firm offered its latest take on semiconductor sales, capex, and application growth for 2011 and 2012.

09/15/2011 

Techcet's Michael A. Fury reports from a NCAAVS CMP user group meeting in San Jose, CA, with the overall theme of CMP for the hard-disk drive industry: market outlooks for HDDs, different requirements and challenges vs. IC manufacturing, and new technologies and applications for CMP in patterned media.

09/15/2011 

Jim Walker, VP, Research of Semiconductor Manufacturing and Emerging Technologies, at Gartner, speaks with Solid State Technology about revising Gartner

09/15/2011 

Update: Video interviews with the award winners. Semiconductor Research Corporation (SRC) bestowed its Aristotle and Technical Excellence awards on teams researching TCAD IC simulation and test/validation methods on the IC fab line.

09/13/2011 

Dual-beam laser spike annealing (LSA) technology allows access to new temperature-time regimes and enables new CMOS logic applications for the 28nm node and beyond. J. Hebb et al, Ultratech, explain dual-beam LSA's use in long dwell time, and low-temperature applications.

09/13/2011 

Bruker Corporation will acquire Center for Tribology Inc. (CETR) for an undisclosed sum. CETR will become a separate Tribology and Indenting business in the Bruker Nano Surfaces division, joining the atomic force microscope (AFM) and stylus and optical metrology (SOM) businesses.

09/12/2011 

Brooks Instrument launched a new Safe Delivery System (SDS) option for its GF120 mass flow controllers. The GF120 SDS is a low-pressure drop mass flow controller that delivers sub-atmospheric SDS gases used in implant and etch processes.

09/12/2011 

University of Gothenburg and the Royal Institute of Technology (KTH) researchers demonstrated that spin waves propagated from magnetic nanocontacts, observing the dynamic properties via an advanced spin wave microscope. Magnonics potentially replaces microwave technology in many applications.

09/12/2011 

Fabricated silicon parts for semiconductor and LED equipment use made up a $310 million market in 2010, according to the Techcet Group. By 2014, the market will reach $412 million.

09/09/2011 

Gallium nitride (GaN) based devices are launching for applications in defense, wireless infrastructure, CATV, satellite and power electronics markets, according to the Strategy Analytics GaAs and Compound Semiconductor Technologies Service viewpoint.

09/09/2011 

Lam Research Corporation (NASDAQ:LRCX) will transition Martin B. Anstice to CEO with the new year. Anstice has spent 10+ years with LRCX, including his roles as president and COO (current), and CFO.

09/08/2011 

SEMI and the SEAJ gathered semiconductor manufacturing equipment sales and shipments data from over 100 global equipment companies for their Q2 report. While shipments (billings) rose 31% over Q2 2010, sales (bookings) fell 8% YOY.

09/08/2011 

Yann Gallais, Leti, shares updates from Leti, TSMC, and Mapper on maskless lithography tools, processes, and cost. Gallais reports from the IMAGINE workshop held September 6 in Tokyo.

09/07/2011 

EV Group (EVG) launched a new flagship model in the GEMINI FB fusion wafer bonding family. The GEMINI FB increases system throughput 26% to 18-20WPH with enhanced automation capabilities and low-temperature processing.

09/07/2011 

Ushio Inc. debuted a 200mm wafer full-field projection lithography tool UX4-3Di FFPL 200 for high-volume manufacturing of advanced LSI devices incorporating 3D integration technologies, such as TSVs and silicon interposers and bumps.

09/07/2011 

Mattson Technology received multiple follow-on orders for its SUPREMA photoresist strip systems from major customers fabs in Asia, Europe and the US for volume production of advanced logic, foundry and flash memory devices for 3Xnm and below technology nodes.

09/07/2011 

Unisem installed a V93000 Port Scale RF tester from Verigy, an Advantest Group company, at its European test development center in Wales. Unisem will test and develop wireless RF and complex mixed-signal semiconductors.

09/07/2011 

Noting caution in the markets, SEMI has revised its World Fab Forecast to a 23% year-on-year increase, down from the 31% growth forecast in May 2011. Capital expenditure will still increase to $41.1 billion in 2011.