Semiconductors

SEMICONDUCTORS ARTICLES



Plasma tool from Nordson MARCH handles 5 wafer sizes

07/07/2011 

Nordson MARCH introduced the FlexTRAK-WF low-cost, cassette-based automated plasma treatment system that handles five wafer sizes with minimal hardware change-over.

2011 Best of West award finalists announced

07/06/2011 

Solid State Technology and SEMI today announced the finalists for the 2011

AMAT debuts DRAM fab tools for denser transistors

07/06/2011 

Applied Materials debuted 3 systems for next-generation DRAM chip manufacturing: the Applied Centura DPN HDTM system to improve the gate insulator scaling; the Applied Endura HAR Cobalt PVD system for high-aspect-ratio contact structures; and the Applied Endura Versa XLR W PVD system for reduced gate stack resistance.

Avantor, SACHEM selective etch chemisty doubles as wafer cleaner

07/06/2011 

Avantor Performance Materials will launch the first in its new J.T.Baker SLCT Series of selective etch surface treatment chemistries, SLCT 128 sigma etchant, at SEMICON West. The product results from a partnership with etch specialist SACHEM.

EV Group joins Ga. Tech's 3D packaging center

07/06/2011 

EV Group will contribute its know-how and technology in temporary bonding and debonding, chip-to-wafer bonding, and lithography technology to the Georgia Tech's PRC's Silicon and Glass Interposer Industry (SiGI) Consortium research program.

Elpida begins sampling 8Gb DDR3 SDRAM

07/05/2011 

Elpida Memory is now sampling a new 8Gb TSV DRAM consisting of four 2Gb layers based on TSV stacking technology.

Applied heats up RTP for 2Xnm with backside wafer heating

07/01/2011 

Applied Materials' new Vantage Vulcan RTP tool switches the heating to the backside of the wafer, to improve heat distribution and uniformity, widen the temperature range, and shorten residence times -- all of which are important as process technologies shrink to and below the 2Xnm generation, the company says.

IBM promises more reliable multibit phase-change memory

07/01/2011 

Researchers at IBM say they have developed a phase-change memory (PCM) that mitigates drift and demonstrates long-term retention of bits stored, with reliability far closer to what will be needed for enterprise applications.

Semiconductor sputtering targets headed for 2012 market peak

07/01/2011 

The semiconductor sputtering target market is outgrowing semiconductor fab equipment as a whole, with double-digit growth through 2013. The skyrocketing price of tantalum is a major factor, but not the only one, says Techcet Group.

Semiconductor gases bounce back, wet chemicals on their way

06/30/2011 

Semiconductor wet chemicals saw 13% growth year-over-year in 2010, while the electronics fab gasses market grew 16%, according to 2 new reports from Techcet Group.

Semiconductor industry investing over $40 billion annually, says SEMI

06/30/2011 

The semiconductor industry will invest about $44 billion in production equipment globally in 2011, which industry organization SEMI calls a "record sum."

DuPont perfluoroelastomer parts won't erode in wafer processing

06/29/2011  DuPont Performance Polymers (DuPont) will introduce DuPont Kalrez 9300 and 9500 perfluoroelastomer parts for semiconductor wafer processing at Semicon West.

AMAT RTP heats wafer backside for better temp uniformity

06/29/2011 

Applied Materials Inc. (AMAT) launched the Applied Vantage Vulcan rapid thermal processing (RTP) system for wafer annealing. Backside heating with AMAT's honeycomb lamp reduces "hot spots," enabling 20nm transistor designs.

SEMICON West keynotes cover research, chip design, packaging

06/28/2011 

Tien Wu, ASE; Rama K. Shukla, Intel; and Luc Van den hove, imec, are the honored presenters for SEMICON West 2011.

CEA-Leti Annual Review: IDMs' top 3 challenges

06/28/2011 

At CEA-Leti's Annual Review, STMicroelectronics CTO Jean-Marc Chery reviewed the challenges facing IDM companies focused on SoC markets, and the three primary challenges for IDMs: FinFETs, EUV lithography, and 450mm.

CEA-Leti Annual Review: Update on maskless litho work

06/28/2011 

At CEA-Leti's Annual Review, Leti lithography program manager Serge Tedesco described the IMAGINE industrywide project to assess maskless multi e-beam technology, including the system's expected capabilities within two years.

CEA-Leti Annual Review: The heart of Europe's semiconductor industry challenges

06/28/2011 

At CEA-Leti's Annual Review, Leti CEO Laurent Malier noted how the important role that research and technology organizations should play in strengthening industry in Europe, and how their roles differ from groups in other regions.

Talkin' ecosystems, supply chain issues at IHS Summit

06/27/2011 

About a hundred people gathered at the San Jose Marriott on June 22 for the first IHS Global Design & Supply Chain Summit, where a series of speakers presented on everything from spending on consumer gadgets to telecom systems to fabs, lessons learned from the Japan disaster, and why the Pentagon is a poster child for counterfeit parts.

Lithography cost-of-ownership considerations

06/27/2011 

The semi industry faces major cost challenges in patterning advanced ICs in high volumes. A cost-effective solution remains elusive. David K. Lam, Multibeam Corporation, addresses lithography cost-of-ownership.

ALD tool applies self-assembled monolayers for MEMS/NEMS, says Cambridge NanoTech

06/27/2011 

Cambridge NanoTech added a Self-Assembled Monolayers (SAMs) capability in its line of Savannah Atomic Layer Deposition (ALD) systems, for use on MEMS, NEMS, electronics, and other devices.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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