Semiconductors

SEMICONDUCTORS ARTICLES



Solar cells combining silicon with perovskite have achieved record efficiency of 25.2 percent

06/11/2018  Researchers from EPFL and CSEM have combined silicon- and perovskite-based solar cells. The resulting efficiency of 25.2 percent is a record for this type of tandem cell. Their innovative yet simple manufacturing technique could be directly integrated into existing production lines, and efficiency could eventually rise above 30 percent.

Winbond extends performance of Serial NAND Flash memory with 1Gbit device with maximum data-transfer rate of 83MB/s

06/08/2018  Winbond’s new high-performance Serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s.

WIN Semiconductors releases 0.45µm GaN power process for 5G applications

06/08/2018  WIN Semiconductors Corp, the world?'s largest pure-play compound semiconductor foundry, has expanded its gallium nitride (GaN) process capabilities to include a 0.45?m-gate technology that supports current and future 5G applications.

imec demonstrates compact low-power 140GHz CMOS radar with on-chip antennas

06/07/2018  The achievement is an important step in the development of radar-based sensors for a myriad of smart intuitive applications, such as building security, remote health monitoring of car drivers, breathing and heart rate of patients, and gesture recognition for man-machine interaction.

Leading the world beyond Moore's Law to the AI era, six cognitive experts to keynote at SEMICON West

06/07/2018  With the rapid rise of AI providing overwhelming possibilities for industry growth, SEMICON West has been designed to help the microelectronics industry get a firm handle on how best to enable and take advantage of AI's potential.

Sales increase 20% year-to-year in April; double-digit annual growth projected for 2018

06/06/2018  Industry forecast projects sales will increase 12.4 percent in 2018 and 4.4 percent in 2019.

Led by Texas Instruments, the industrial semiconductor market grew nearly 12% in 2017

06/06/2018  Analog Devices jumped to second in the market share ranking, after its acquisition of Linear Technology.

Single molecular insulator pushes boundaries of current state of the art

06/06/2018  Breakthrough could pave the way for smaller transistors.

ROHM and GaN Systems join forces for GaN power semiconductors

06/06/2018  ROHM and GaN Systems announced their collaboration in the GaN (gallium nitride) Power Semiconductor business, with the goal of contributing to the continuing evolution of power electronics.

Applied Materials breakthrough accelerates chip performance in the big data and AI era

06/05/2018  Applied Materials, Inc. today announced a breakthrough in materials engineering that accelerates chip performance in the big data and AI era.

NXP brings standard packages to RF power

06/05/2018  New RF power transistors simplify design and manufacturing.

Exagan introduces unique intelligent GaN power solution

06/05/2018  Company showcases G-FET and G-DRIVE products for easy-to-design electrical converters and a small, highly efficient 65-watt USB PD 3.0 charger demonstration.

MIT researchers devise new way to make light interact with matter

06/04/2018  Reducing the wavelength of light could allow it to be absorbed or emitted by a semiconductor, study suggests.

Dow unveils two new silicone adhesives formulated to deliver processing options for device and displays assembly

06/04/2018  Dow Performance Silicones further enhanced design flexibilities and processing options for consumer device and display OEMs today with the addition of DOWSIL™ SE 9100 and DOWSIL™ SE 9160 Adhesives to its portfolio of one-part, room-temperature cure (RTV) silicone solutions.

Imec extends damascene metallization towards the 3nm technology node

06/04/2018  At this week’s 2018 IEEE International Interconnect Technology Conference (IITC 2018), imec will present 11 papers on advanced interconnects, ranging from extending Cu and Co damascene metallization, all the way to evaluating new alternatives such as Ru and graphene.

Worldwide semiconductor equipment billings in first quarter 2018 reach record $17B

06/04/2018  SEMI reported that worldwide semiconductor manufacturing equipment billings reached a historic quarterly high of US$17.0 billion for the first quarter of 2018, surging 59 percent in March to end the quarter with an all-time monthly high of $7.8 billion.

BISTel announces intelligent chamber matching application to help semiconductor manufacturers guard against events impacting yield

06/01/2018  BISTel, a provider of intelligent, real-time data management, advanced analytics and predictive solutions for smart manufacturing announced today an innovative new Chamber Matching (CM) application that enables semiconductor manufacturers to better guard against events that negatively impact yield.

Ernest E. Maddock to join UCT Board of Directors

06/01/2018  Ultra Clean Holdings, Inc. today announced that Ernest Maddock has joined the Board of Directors effective June 1, 2018.

BISTel unveils first intelligent applications for smart manufacturing

06/01/2018  New Dynamic Fault Detection (DFD) offers full trace analysis, overcomes limitations of legacy FDC systems to improve yield significantly.

Automotive IC market on pace for third consecutive record growth year

06/01/2018  18.5% forecast increase in 2018 driven by systems monitoring and control, safety, ADAS, convenience, and growth of autonomous driving. Continued rise of memory ASP adds to growth.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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