Semiconductors

SEMICONDUCTORS ARTICLES



Gartner reports worldwide sales of smartphones returned to growth in first quarter of 2018

05/31/2018  Global sales of smartphones to end users returned to growth in the first quarter of 2018 with a 1.3 percent increase over the same period in 2017, according to Gartner, Inc.

Top VCSEL makers choose ClassOne plating systems

05/31/2018  Solstice emerges as ideal choice for compound semiconductor manufacturing market.

Novel method to fabricate nanoribbons from speeding nano droplets

05/30/2018  An international team of researchers, affiliated with UNIST has discovered a novel method for the synthesis of ultrathin semiconductors.

TowerJazz & Gpixel announce world's smallest global shutter pixel

05/29/2018  TowerJazz, the global specialty foundry leader, and Gpixel, Inc., a fast-growing CMOS image sensor (CIS) provider focusing on professional applications, announced today that Gpixel's GMAX0505.

GLOBALFOUNDRIES enters volume production of ultra high voltage process technology

05/29/2018  GLOBALFOUNDRIES today announced that its 180nm Ultra High Voltage (180UHV) technology platform has entered volume production for a range of client applications, including AC-DC controllers for industrial power supplies, wireless charging, solid state and LED lighting, as well as AC adapters for consumer electronics and smartphones.

Polymer crystals hold key to record-breaking energy transport

05/25/2018  Scientists from the universities of Bristol and Cambridge have found a way to create polymeric semiconductor nanostructures that absorb light and transport its energy further than previously observed.

EUV lithography: Extending the patterning roadmap to 3nm

05/25/2018  This year’s Advanced Lithography TechXPOT at SEMICON West will explore the progress on extreme ultra-violet lithography (EUVL) and its economic viability for high-volume manufacturing (HVM), as well as other lithography solutions that can address the march to 5nm and onward to 3nm.

Microsemi continues to expand silicon carbide product portfolios

05/24/2018  Microsemi Corporation (Nasdaq: MSCC), a provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it will be expanding its Silicon Carbide (SiC) MOSFET and SiC diode product portfolios early next quarter, including samples of its next-generation 1200-volt (V), 25 mOhm and 80 mOhm SiC MOSFET devices.

Switching with molecules

05/24/2018  Molecular switch will facilitate the development of pioneering electro-optical devices.

Next generation dopant gas delivery system for ion implant applications

05/24/2018  A new class of adsorbent materials offer high capacity storage and safe delivery of dopant gases.

Lumentum orders Veeco MOCVD system

05/23/2018  Veeco Instruments Inc. announced that Lumentum Holdings Inc. has ordered the Veeco K475i™Arsenide/Phosphide (As/P) Metal Organic Chemical Vapor Deposition (MOCVD) System for production of its advanced semiconductor components.

Brite Semiconductor joins SiFive's DesignShare program

05/23/2018  The company will be the first to offer DDR IP in the growing ecosystem.

North American semiconductor equipment industry posts April 2018 billings 

05/23/2018  April 2018 monthly billings for North American equipment manufacturers surpassed the October 2000 record high of $2.6 billion.

GLOBALFOUNDRIES announces industry's most advanced automotive-qualified production FD-SOI process technology

05/23/2018  Manufacturing certification for security, reliability and robustness provides customers with performance and power efficiency for automotive applications.

Cadence Design Systems and NI announce collaboration to simplify next-gen semiconductor and RF development

05/22/2018  Cadence Design Systems, Inc. and NI today announced a broad-ranging collaboration to improve the overall semiconductor development and test process of next-generation wireless, automotive and mobile integrated circuits (ICs) and modules.

IEEE International Electron Devices Meeting announces 2018 Call for Papers

05/22/2018  The 64th annual IEEE International Electron Devices Meeting(IEDM), to be held at the Hilton San Francisco Union Square hotel December 1-5, 2018, has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

Cloud computing: the power to optimize manufacturing

05/22/2018  The cloud is an innovation fueled by advanced chip technology, but it has also been a model the industry hesitated to embrace.

Memory device packaging: From leadframe to TSV

05/22/2018  Memory devices employ a wide range of packaging technology from wire-bond leadframe and BGA to TSV.

SEMICON West adds WT | Wearable Technologies Conference co-location

05/22/2018  U.S. electronics manufacturing event expands with wearables program.

Semi capex forecast to exceed $100B for the first time in 2018

05/22/2018  IC Insights raises its full-year spending growth forecast for this year from 8% to 14%.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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