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WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
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Sanjay Yedur et al, from Pivotal Systems and J.H. Lee et al from Samsung’s R&D Equipment Engineering Team discuss the use of a real-time gas flow monitoring system that allows for in-situ flow measurements, based on a highly accurate rate of pressure drop over a known volume and temperature. Using this system, insights are gained on the run-to-run repeatability of mass flow controller (MFC) transient and steady-state flow during wafer processing.
McPherson’s high-resolution spectrometer, Model 2061, is now available for scanning and imaging applications via 2D CCD or CMOS detectors. It suits emission, luminescence, Raman (strained Silicon), and high-temperature plasma measurement with better than 0.02nm full width half maximum spectra.
An EBPG5000plusES will be delivered to the newly formed Nanotechnology and Application Center (SUNAC) of the Sabanci University based in Istanbul. The Gaussian Beam system fulfills the challenging requirements of the institute which will collaborate in the field of nanotechnology research with other institutions.
CAMECA unveiled the latest addition to its line of high-end metrology systems: the EX-300 metrology tool targeted for front-end process control of 22 nm technology nodes and beyond. e EX-300 is a versatile metrology tool based on LEXES (Low-energy Electron induced X-ray Emission Spectrometry) technology.
With double-digit growth in consumption in key sectors (PCs, cell phones), strong GDP increase, wafer fab capex increases, and firm ASPs, Bill McClean, president, IC Insights, gave SEMI Industry Strategy Symposium (ISS) attendees some "reasons for optimism."
Imec launched an industrial affiliation program on high-bandwidth optical input/output (I/O). The primary objective of the new program, which is part of imec's research platform on deep-submicron CMOS scaling, is to explore the use of optical solutions for realizing high-bandwidth I/O between CMOS chips. 
KLA-Tencor (KLAC) debuted an automated inspection system for substrates and epitaxial wafers used in HBLED manufacturing. The Candela 8620 provides automated defect inspection for LED materials such as gallium nitride, sapphire, and silicon carbide, enabling enhanced quality control of both opaque and transparent substrates, faster time-to-root cause, and improved MOCVD reactor uptime and yield. Frank Burkeen, KLA-Tencor, discusses the Candela 8620 inspection system.
Ionizers can improve wafer back- and frontside particle performance in PVD processing tools by removing surface charges that hold electrostatically adhered particles. Controlling charges results in higher yields for chip manufacturers and improved tool performance. Viraj Pandit and Emery Kuo, Novellus Systems and Cheryl Avery, ION Systems show that the INOVA PVD system’s good particle performance (with good quality wafers) is made more robust with an ionizer installation (with marginal quality wafers).
Wafer fab capex in 2011 is expected to stick around 2010 levels. But don't despair of growth, says Dean Freeman of Gartner. For one thing, cutting-edge wafer fab equipment will be hot. On top of that, 2011 will be a brief respite, with a strong 2012/2013 waiting in the wings.