Semiconductors

SEMICONDUCTORS ARTICLES



CD-SEM-metrology-tool-from-Advantest debuts for next-gen photomasks

11/12/2010 

Advantest Corporation released a SEM-based critical dimension (CD) measurement system for next-generation photomasks and patterned media. The E3630 is fully compatible with Advantest’s existing E3610/E3620 CD-SEM measurement systems and software, and boasts 30% improved linewidth repeatability.

Packaging-providers-growing-faster-than-semiconductor-market-Gartner-forecast

11/12/2010 

Packaging providers outgrowing semiconductor fab market: Gartner forecastJim Walker, research VP at Gartner, told attendees at the Gartner Semiconductor Briefing (11/4/10, San Jose, CA) that, after declining 14.7% in 2009, the outsourced semiconductor assembly and test services (OSATS) market will expand by 37% this year, and by 6.2% in 2011.

LEDs-ramp-MOCVD-reaps-benefit-Gartner-forecast

11/12/2010 

MOCVD equipment and the LED market: Gartner forecast through 2020According to Dean Freeman, research VP at Gartner, the LED market will see ~11% growth in 2010, and ~35% growth in 2011. Reaping the benefits of the accelerating interest in LEDs is the MOCVD equipment market.

The end of graphics memory price margins? iSuppli sees GPU falling to CPU

11/11/2010 

CPU integration is pushing graphics off dedicated memory, causing graphics-centric memory to lose share of the DRAM market over the next 5 years. The flattening of the graphics memory segment represents a major change, considering its attractive margins, fierce rivals and major players that graphics memory attracted.

DCG-Systems-P3X-Cobra-circuit-edit-FIB-system

11/11/2010 

DCG Systems announced the P3X Cobra FIB circuit edit system for complex edit challenges, even at advanced 22 nm device process technologies. The P3X Cobra delivers ion beam performance from 2keV to 30keV beam energies.

Bond-align-mask-align-SUSS-MicroTec-Fraunhofer-collab

11/11/2010 

SUSS MicroTec and Fraunhofer for Surface Engineering and Thin Films IST launched SELECT, a technology for bond aligners and mask aligners that selectively activates parts of wafer surfaces through plasma.

Silicon-shipments-grew-in-Q3-2010

11/10/2010 

Worldwide silicon wafer area shipments increased during the third quarter 2010 when compared to second quarter 2010 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

InvenSense-integrates-3-axis-gyroscope-3-axis-accelerometer-on-single-silicon-die

11/10/2010 

InvenSense released its MPU-6000 product family. The MPU-6000 MEMS motion sensing technology integrates a 3-axis gyroscope and a 3-axis accelerometer on the same silicon die together with an onboard Digital Motion Processor (DMP) capable of processing complex 9-axis sensor fusion algorithms.

SIA ups outlook, cracking $300B in 2010

11/09/2010 

The SIA has bumped up its outlook for 2010 semiconductor sales to 32.8% growth to $300.5B, aligning it more with industry peers -- but above the current pace indicated by its own monthly data.

SEMATECH-III-V-MOSFET-FinFET-RAM-IEDM-preview

11/09/2010 

Revealing research breakthroughs, engineers from SEMATECH’s Front End Processes (FEP) program will present technical papers at the IEEE International Electron Devices Meeting (IEDM), December 6-8 in San Francisco.

ON-Semi-expanding-8-wafer-fab-in-US

11/08/2010 

ON Semiconductor (ONNN) plans to install another $15.7 million worth of production equipment in its 8" Pocatello, Idaho, wafer manufacturing facility during the next 6 months. This investment is in addition to the company's announcement in June of an $11 million equipment expansion.

Smartphone-IC-market-surge-in-2010-NAND-DRAM consumption rising

11/08/2010 

The worldwide smartphone IC market forecast is expected to register a strong 20% 2010-2014 CAGR, according to IC Insights' new 2011 edition of its IC Market Drivers report (to be released in November).

Arradiance-ships-benchtop-atomic-layer-deposition-ALD-system to Oregon State U

11/05/2010 

With its capability to process up to 6" wafers using up to 8 precursors, GEMStar has the flexibility to deposit atomically thin layers of material on virtually any substrate and was designed with the most challenging high aspect ratio and through-pore deposition applications in mind.

Maxim-shipping-analog-chips-built-on-300mm-wafers

11/05/2010 

Maxim Integrated Products (Nasdaq:MXIM) qualified and shipped production analog product built on 300mm wafers. This gives Maxim a significant technology edge in the analog/mixed-signal market.

TSMC-anneal-for-gate-last-HKMG-IEDM-preview

11/04/2010 

TSMC anneal for gate-last HKMG process: IEDM previewLaura Peters, contributing editor, discusses TSMC's HfZrO/TiN stack, fabricated by a novel multi-deposition, multi-anneal process. TSMC will present the results at the upcoming International Electron Devices Meeting (IEDM, San Francisco, CA, December 6-8, 2010) with researchers from the Nanyang Technological University (Singapore).

Intermolecular-Elpida-extend-R-D-collab-for-advanced-DRAM-technology

11/04/2010 

Intermolecular expanded its collaborative development program with Elpida Memory. This new multi-year agreement focuses on research, development, manufacturing process transfer and high-volume yield-ramp support for multiple generations of DRAM technology.

Rigaku-EUV-lithography-optical-components-push

11/03/2010 

Rigaku Innovative Technologies announced further expansion into the optics market for extreme ultraviolet (EUV) lithography. RIT plans to continue supporting the industry by supplying Osmic Coatings, a line of multilayer coated optics that are essential to EUVL.

Faster inspection of MEMS possible with microinterferometer arrays

11/01/2010 

Scientists involved in the European Union's "Smart inspection systems for high-speed and multifunctional testing of MEMS and MOEMS" (SMARTHIEHS) project are developing a new test concept based on parallel inspection of devices at wafer level.

IEDM Preview: When do TSV stresses affect device operation?

11/01/2010 

At this year's IEDM, IMEC researchers will discuss the impact of mechanical stresses on device performance for through-silicon vias (single and arrays), showing how complex interaction of stress components hampers design rules and layout.

Northeastern Surface Prep 2010: III-V cleaning, CMP revolutions, low-k film adsorption, LED surfaces

11/01/2010 

Techcet's Michael A. Fury continues his observations from the 7th International Surface Cleaning and Preparation Workshop in Boston. Key takeaways included GaAs heterojunctions, CMP evolutions & revolutions, preventing water adsorption in low-k films, glass surface prep for LEDs, and membrane filters to remove ionic contaminants.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts