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WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
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AMO GmbH and SUSS MicroTec AG are developing applications for substrate conformal imprint lithography (SCIL) with UV curing material. Due to unique sequential contacting and separation technology, a distortion-free replication of a stamp at high throughput is now possible with UV-SCIL.
Answering the growing demand for a high resolution, Dr. Schenk has developed an enhanced version of the Pollux Particle Detection System for Photomasks. Pollux-Enhanced automated particle detection system enables fabs to perform a complete inspection on each reticle prior to its use.
Mattson Technology Inc. (NASDAQ: MTSN), advanced wafer fab process equipment supplier, received orders for multiple Suprema photoresist strip systems from a new Asian customer. The Supremas will be used in both front-end-of-line (FEOL) and back-end-of-line (BEOL) applications for advanced logic device production.
Advances in lithographic patterning critically depend on the timely availability of enabling resists and materials, say Warren Montgomery and Stefan Wurm, SEMATECH. They detail the toolset and collaborative approach of SEMATECH, which helps bridge the lapse between basic research and wafer fab production processes to keep lithography moving forward. What has the research organization's attention in 2010?
DEK has launched ProActiv process technology to enable electronics manufacturers to print pastes with high-density heterogeneous PCBs and ultra fine pitch assemblies such as advanced package assembly.
With the development and production release of the microRSP-A300, CAPRES has addressed the challenges associated with in-line measurement on production wafers, reducing reliance on data extrapolation and monitor wafers to validate doping levels.
Keithley Instruments Inc. (NYSE:KEI) updated its ACS Basic Edition Semiconductor Parametric Test Software for semiconductor test and measurement applications. ACS Basic Edition Version 1.2 performs characterization of component or discrete (packaged) semiconductor devices.