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WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
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Cascade Microtech (NASDAQ: CSCD), supplier of production probe cards with signal integrity for multi-site die testing, released S-Technology, which provides a unique mechanical architecture for Pyramid probe cards to consistently deliver evenly distributed contact force for solder bump technologies in die tests.
Robert Pagliaro, RP Innovative Engineering Solutions, demonstrates that simple but effective enhancements to wet clean steps can help achieve more stringent surface preparation and reduce complexity, cost of ownership (COO), and environmental concerns associated with existing methods. Contamination left or caused by cleaning and drying steps can adversely affect wafer yields.
Picotest released a new family of Signal Injectors, or adapters, to improve voltage regulator, LDO, and power supply testing accuracy. Increased bandwidth and higher resolution measurements are enabled for PSRR, stability, crosstalk, reverse transfer, input impedance, Bode plots, and crosstalk tests along with non-invasive ICT for load transients, stability and output impedance.
Applied Materials (AMAT) launched its new Applied Centura Tetra X Advanced Reticle Etch system capable of etching photomasks needed for challenging device layers at 22nm and beyond. Expanding the capabilities of AMAT's Tetra III platform, the Tetra X breaks the 2nm critical dimension uniformity (CDU) barrier across all feature sizes.
JEOL introduced the InTouchScope, an analytical, low-vacuum scanning electron microscope (SEM) featuring integrated energy dispersive spectroscopy (EDS) with the latest silicon drift detector (SDD) technology. 
Jeff Schake, et al, DEK Printing Machines, discuss the flatness characteristics of available wafer pallets, and use them in an experiment with thinned wafers in automated printing. With thin wafers, and the requirement for low coating thickness, the wafer-support tooling surface metrology should have an appreciable impact on coating thickness control.