Semiconductors

SEMICONDUCTORS ARTICLES



Making automotive smart: Key takeaways from SEMI Taiwan Member Forum

05/03/2018  Emboldened by advances in self-driving and Internet of Vehicles (IoV) technologies, Taiwan’s microelectronics sector is investing heavily in manufacturing processes and equipment as engines of innovation and growth for autonomous driving, the world’s next market goldmine. But breaking into the self-driving vehicle industry can be an uphill struggle.

One-dimensional material packs a powerful punch for next generation electronics

05/02/2018  The new technology has applications in nanometer-scale transistors and circuits.

EV Group begins construction of new Manufacturing III building

05/02/2018  EV Group today announced that it has started construction work for the next expansion phase of its corporate headquarters.

TowerJazz announces release of advanced 300mm 65nm BCD power management platform

05/02/2018  TowerJazz today announced the release of its 300mm 65nm BCD (Bipolar-CMOS-DMOS) process, the most advanced power management platform for up to 16V operation and 24V maximum voltage.

TI expands lead among top analog suppliers in 2017

05/02/2018  Top 10 suppliers held 59% of analog market last year with ON Semi showing strongest growth.

Mentor enhances tool portfolio for TSMC 5nm FinFET and 7nm FinFET Plus processes and wafer-on-wafer stacking technology

05/01/2018  Mentor, a Siemens business, has announced that several tools in its Calibre nmPlatform and Analog FastSPICE (AFS) Platform have been certified by TSMC for the latest versions of TSMC's 5nm FinFET and 7nm FinFET Plus processes.

Global semiconductor sales up 20% year-to-year in Q1

05/01/2018  The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $111.1 billion during the first quarter of 2018, an increase of 20 percent compared to the first quarter of 2017.

Valleytronics discovery could extend limits of Moore's Law

05/01/2018  Study finds that light polarization properties of candidate material offer additional computing degrees of freedom.

Annual Washington forum brings top industry priorities to policymakers

05/01/2018  Just as the annual Cherry Blossom festival wraps up, international trade has flowered as a top concern for SEMI members, requiring immediate action as 20 SEMI member executives carried the torch for the industry in recent meetings with lawmakers at the annual SEMI Washington Forum.

Cyient acquires semiconductor firm AnSem N.V.

04/30/2018  Cyient Limited today announced that its step down subsidiary Cyient Europe Ltd. has acquired AnSem N.V.

TSMC certifies Synopsys Design platform for high-performance 7nm FinFET Plus technology

04/30/2018  Synopsys, Inc. today announced certification of the Synopsys Design Platform with TSMC's latest Design Rule Manual (DRM) for advanced 7nm FinFET Plus process technology.

Spin Transfer Technologies announces breakthrough MRAM technology for SRAM and DRAM applications

04/30/2018  Spin Transfer Technologies, Inc. announced results of its unique Precessional Spin Current (PSC) structure.

Speeding up material discovery

04/30/2018  Algorithm take months, not years, to find material for improved energy conversion.

Jim Keller joins Intel to lead silicon engineering

04/27/2018  Intel today announced that Jim Keller will join Intel as a senior vice president. He will lead the company's silicon engineering, which encompasses system-on-chip (SoC) development and integration.

Key findings for the global lithography systems market

04/27/2018  According to Technavio market research analysts, the CAGR for the global lithography systems market is projected to be over 5% during the forecast period.

A powerful laser breakthrough

04/27/2018  Lehigh research team demonstrates terahertz semiconductor laser with record-high output power.

Samsung begins mass production of 10nm-class 16Gb LPDDR4X DRAM for automobiles

04/26/2018  The latest LPDDR4X features high performance and energy efficiency while significantly raising the thermal endurance level for automotive applications that often need to operate in extreme environments.

Barbara Humpton named Siemens U.S. CEO

04/26/2018  Siemens Corporation today announced that Barbara Humpton has been appointed CEO for the United States, effective June 1, 2018.

Cell membrane inspires new ultrathin electronic film

04/26/2018  Japanese researchers have developed a new method to build large areas of semiconductive material that is just two molecules thick and a total of 4.4 nanometers tall.

Cheaper and easier way found to make plastic semiconductors

04/25/2018  Cheap, flexible and sustainable plastic semiconductors will soon be a reality thanks to a breakthrough by chemists at the University of Waterloo.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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