04/20/2009  The market for chip tools is still awful, but a slowing in declines in tool orders may offer some hope, and what may be the first step in a long road back to an industry turnaround.

04/18/2009  In an exclusive daily blog for SST, Techcet's Michael A. Fury summarizes the day's papers, including several on eCMP, an "elegant" application of CMP to fix SiGe strain channels, and still-stealth "digital CMP." Other notable papers described work on CNT fabrication and electronic devices, inkjet printing to replace sputtering in displays, and optical screening for metal hydrides.

04/17/2009  In an exclusive daily blog for SST, Techcet's Michael A. Fury reviews talks about new technology in mobile phones; "DNA origami" self-assembly; hyperspectral imaging; single-crystal silicon ribbons; 3D patterned devices made with MEMS and self-assembly techniques; and the utility of "toys" based on electro-osmotic ionic flux.

04/16/2009  In an exclusive daily blog for SST, Techcet's Michael A. Fury summarizes papers and discussion spanning nanocrystal structures for memory devices, combinatorial screening for metal gate alloys contacting a HfO₂ gate dielectric, more uses for supercritical CO₂, and various aspects of chemical mechanical planarization.

04/14/2009  Activity among the top global foundries is heating up, with shipments expected to surge as much as 50% in 2Q09, according to an analyst -- but it's too soon to invoke the "R" word (recovery) just yet.

04/14/2009  A team of researchers at MIT have produced 36nm-wide lines using interference patterns and a photochromic material, and say the technique could be extended down to patterns on the scale of individual molecules.

04/13/2009  A month ago Gartner pegged preliminary 2008 capex at a -25% slide to ~$33.46B. Turns out the firm was about $3B on the high side -- its "final" tally pegs 2008 semiconductor capex at just $30.7B, down -31.7% from 2007.

04/13/2009  By Paul Enquist and Chris Sanders, Ziptronix, Inc.
In 3D IC technology, thinned, planar circuits are stacked and interconnected using through silicon vias (TSVs). 3D ICs have the potential to alleviate scaling limitations, increase performance by reducing signal delays, and reduce cost. Enabling technologies for 3D IC include TSV formation, thinning, and alignment and bonding. Realizing the full potential of this technology requires a scaleable approach to 3D IC fabrication.

04/08/2009  APRIL 8, 2009 -- LEUVEN, BELGIUM -- IMEC, the Belgian nanoelectronics research institute, has announced that it has begun expanding its Leuven campus facilities, starting with 2,800 square-meters of research labs and including the extension of its state-of-the-art clean room.

04/07/2009  Mike Fury of Techcet Group explains how the "industry darling" CMP consumables sector has evolved with a stable supplier base and growth rates aligned to other materials supply chains -- and how this helps fabs and suppliers focus on the business of optimizing process performance and cost.

04/06/2009  April 6, 2009: The London Centre for Nanotechnology will develop a new device to enable people living with HIV to monitor their own health and the effectiveness of their treatments, thanks to a $3 million EPSRC (Engineering and Physical Sciences Research Council) grant.

04/06/2009  Alongside the photovoltaic market's extraordinary growth is a need for a sustainable method for disposal of PV modules once they reach the end of their life. To this end there is busy development of strategies and techniques that make the most of the valuable materials contained in their products and simultaneously improve their positive environmental impact.

04/02/2009  APRIL 2, 2009

04/01/2009  ISMI has been the leader in implementing small-lot manufacturing and single wafer processing for 300mm Prime and next-generation factory (NGF) 450mm manufacturing.

03/31/2009  Budapest, Hungary-based Semilab is staking its claim in the metrology sector with a pair of new acquisitions to broaden its portfolio and cement a foothold in Tier 1 fabs. Chris Moore, president/CEO of Semilab AMS, tells SST how the company has built up a portfolio of technologies to address critical applications. Also on his mind: the need for suppliers to build critical mass, what Tier 1 fabs are receptive to right now, and the state of 450mm tool development.

03/30/2009  March 30, 2009: Micralyne Inc., a MEMS developer and manufacturer, and SVTC Technologies LLC, an independent MEMS and CMOS commercialization company, plan to collaborate on development and manufacturing of MEMS devices using 8-in. fabrication technology.

03/26/2009  March 26, 2009: Heidelberg Instruments has announced the sale of an advanced DWL 2000 maskless laser lithography system to the MESA+ Institute for Nanotechnology at the University of Twente in The Netherlands.

03/25/2009  March 25, 2009: A spinoff from the Semiconductor Research Corp. (SRC) and Northwestern University has come up with a unique ultrasound holography approach that combines scanning-probe microscopy with ultrasound and holography to provide glimpses into the tiniest of buried structures.

03/24/2009  Demand for semiconductor manufacturing equipment continues to plod along at historic lows, but those seeking any sign of optimism may have a little ray of hope to point to.

03/22/2009  MARCH 19, 2009 -- SAN JOSE, CA -- All regions are showing double-digit declines in construction spending in 2009, with the possible exception of the Americas.