01/08/2009  In the quest to develop products with higher functionality at lower cost, the semiconductor value chain is struggling to cope with the increasingly complex technologies and expenditures needed to develop leading-edge CMOS products. Though the nature of these challenges is not new, their intensity is unprecedented.

01/08/2009  Technology-driven growth is still possible in the current downturn, according to SST's poll of executives from across the semiconductor manufacturing supply chain. Even during an economic slump, they remain optimistic about two things: the continuing need to innovate, and the ineveitable upturn.

01/08/2009  The chip industry is bracing for a challenging 2009 as consumers rein in spending and electronics suppliers plan for reduced production -- at least through the first half of the year. But if there's one constant in the industry, besides the cycles, it's that technology continues to march on. IC manufacturers are determined to continue advancing their technology roadmaps, which call for rolling out 32nm or 28nm devices, in order to maintain their competitive edge.

01/08/2009  The macroeconomic issues that plagued the second half of 2008 will continue to impact the semiconductor and MEMS markets in 2009, specifically in segments that are automotive and consumer-product driven. Despite the effects, companies in these markets remain committed to innovation, and in turn, are expected to continue to invest in new manufacturing technologies (e.g., 3D/TSVs and nanoimprint lithography) to bring to market novel devices.

01/08/2009  To successfully maneuver in today's restless economic waters, companies must possess a stellar balance sheet with a strong cash position, and provide leading-edge technology.

01/08/2009  Amid the gloomy outlook on IC demand in the coming quarters, many chip manufacturers are cutting back on their investments to build capacity. However, it is at this time -- when demand is at its softest -- that the wisest of chip manufacturers are continuing to make strategic investments in new manufacturing technologies and methodologies in order to position themselves to quickly ramp up on new chip designs when semiconductor demand inevitably swings upward once again.

01/08/2009  As the global economic tide starts to recede, it exposes many high technology manufacturing challenges that were otherwise hidden. In the semiconductor industry, these challenges are often opportunities for innovation -- and the situation we face in lithography today is an excellent example.

01/08/2009  Facing one of the most serious global financial crises in decades, companies have as their highest priorities the reduction of expenditures and improvement in operational efficiency. These necessary steps remind us once again of the semiconductor industry's cyclical nature, and that these downturns have been the incubators for change, which result in a stronger industry in the long run.

01/08/2009  Looking ahead to 2009, we believe the semiconductor market will continue further down the newly split paths as announced in the 2007 ITRS Roadmap. That is, there are now two distinct groups of device manufacturers: 1) The leading edge (scaling) -- "More Moore," with a focus on 300mm and larger wafers, and 90nm and smaller technology nodes; and 2) functional diversification/mainstream -- "More than Moore," with a focus on 200mm and smaller wafers, and 90nm and larger technology nodes.

01/08/2009  Managing costs and optimizing productivity are increasingly important in enabling semiconductor manufacturers to retain profitability. New strategies and timely solutions are needed to optimize fab output through enhancing equipment productivity and asset life extension. To meet these challenges, we anticipate 2009 will see greater collaboration between equipment suppliers and semiconductor manufacturers, leading to innovative solutions to address these important factors.

01/08/2009  With our industry in a cyclical downturn exacerbated by the worldwide financial crisis, we are challenged to do everything possible to maintain profitability. Unfortunately, times such as these can also increase aversion to perceived risk, resulting in missed opportunities for incremental but significant gains. We would do well to take our lead from the automotive industry, in which competitors embraced a philosophy of "constant improvement" over the approach of being only "good enough."

01/08/2009  Chipmakers are trying many paths toward high-k metal gate dielectric (HK+MG) CMOS for 32nm and beyond, and papers presented at IEDM 2008 in San Francisco, CA, showed steadily improving results even though the routes may vary. Still, getting to uniform manufacturable devices presents some tough challenges.

01/07/2009  In response to a call for localized support and increased demand of 3D IC process development in Asia Pacific, EV Group (EVG) and Brewer Science, Inc. have set out to outfit an ultra-thin wafer bonding lab in Taiwan. To this end, the companies announced the installation of an EVG 500 series wafer-bonding system at Brewer Science's Taiwan applications lab in Hsinchu Science Park.

01/07/2009  January 7, 2009: Energetiq Technology Inc., a developer and manufacturer of specialized short-wavelength light products that enable nano-scale structures, has raised additional capital in its Series C round of financing, led by new investor Ushio Inc. and existing investors including Intel Capital and Shea Ventures.

01/07/2009  January 7, 2009: A team of University of Toronto physicists have demonstrated a new technique to squeeze light to the fundamental quantum limit, a finding that has potential applications for high-precision measurement, next-generation atomic clocks, novel quantum computing and our most fundamental understanding of the universe.

01/06/2009  Media reports suggest Samsung is chopping its chip investment plans by nearly 50%, but the company says it's not so -- at least, not yet. But if true, it could actually help the firm's DRAM competitors.

01/06/2009  Taiwan's National Development Fund reportedly is ready to appropriate about US $6B to underpin its DRAM and flat-panel display industries, but individual companies are still hashing out whether their individual needs will be met. And an outside party is stumping to be the island's DRAM consolidator to challenge Samsung.

01/06/2009  ASM International and SAFC's Hitech division have signed a partnership targeting atomic layer deposition (ALD) source materials for advanced ultrahigh-k (ULK) insulators targeting the 3x manufacturing node.

01/05/2009  NEC Corp. says it has developed and demonstrated an operating nonvolatile magnetic flip-flop, opening the possibility for SoCs that require zero power in a standby state and can be quickly returned to an active state.

01/01/2009  Spending on equipping of frontend semiconductor fabs is expected to plummet 31% in 2008 to $26 billion, and recent announcements suggest another 30%-40% decline in 2009, resulting in the lowest spending level over the past 10 years. This article tracks the changing landscape of semiconductor fab spending, and what the future holds for 2009 and beyond.