Semiconductors

SEMICONDUCTORS ARTICLES



A universally profitable renewable energy business model

03/08/2018  The solar energy sector shined in a global renewable energy market that maintained steady growth last year despite the United States’ shocking withdrawal from the Paris Agreement. Solar panel costs dropped to an all-time low, driving global demand that surpassed the 100GW mark for the first time on the strength of standout annual 26 percent growth.

Synopsys collaborates with Samsung Foundry to develop DesignWare IP for Samsung 8nm finFET process

03/08/2018  Synopsys, Inc. today announced a collaboration with Samsung Foundry to develop DesignWare Foundation IP for Samsung's 8nm Low Power Plus (8LPP) FinFET process technology.

Simulation and experiment help TU Dresden researchers study next-generation semiconductors

03/08/2018  Theoretical physicists and experimentalists collaborate to identify dopants capable of enabling new designs of semiconducting materials.

KLA-Tencor receives Intel's Preferred Quality Supplier award

03/08/2018  KLA-Tencor Corporation has been recognized by Intel as a recipient of a 2017 Preferred Quality Supplier (PQS) award.

Palma Ceia closes Series B funding

03/07/2018  Palma Ceia SemiDesign (PCS), a fabless semiconductor company offering wireless chips, modules, systems and IP supporting emerging Machine-to-Machine (M2M) WiFi and cellular standards for the Internet of Things (IoT), today announced it has completed a Series B round of financing.

Applied Materials receives Intel's Preferred Quality Supplier award

03/07/2018  Applied Materials, Inc. has been recognized by Intel as a recipient of a 2017 Preferred Quality Supplier (PQS) award.

Are the major DRAM suppliers stunting DRAM demand?

03/07/2018  Skyrocketing DRAM prices potentially open the door for startup Chinese competitors.

January semiconductor sales up 22.7% compared to last year

03/06/2018  Global semiconductor market grows year-to-year for the 18th consecutive month; month-to-month sales decrease slightly.

Presto Engineering provides high-volume wafer-level test for Maja Systems wireless data-center connectivity solutions

03/06/2018  Launch of Maja Systems terabit connectivity solutions in millimeter wave CMOS accelerated by Presto’s high-volume wireless and RF test expertise.

SUNY Poly's Center for Semiconductor Research in Albany earns TÜV SÜD AMERICA INC. ISO 9001:2015 certification

03/06/2018  SUNY Polytechnic Institute today announced that its advanced semiconductor-based research and development efforts at its Albany NanoTech Complex have successfully received ISO 9001:2015 certification from TÜV SÜD AMERICA INC. for its effective quality management system.

HEIDENHAIN donates to UNCC Center for precision metrology

03/05/2018  Enabling further advancements in metrology, HEIDENHAIN CORPORATION recently donated some equipment to UNC Charlotte's Center for Precision Metrology (CPM), a world premier university metrology lab.

Silvaco completes acquisition of NanGate

03/05/2018  Silvaco today announced that it has acquired NanGate, a developer of Electronic Design Automation (EDA) software, that offers tools and services for creation, optimization, characterization and validation of physical library IP.

Executive viewpoints: 2018 outlook

03/05/2018  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2018.

Work to do to keep the good times rolling

03/02/2018  2017 was a terrific year for SEMI members. Chip revenues closed at nearly $440B, an impressive 22 percent year- over-year growth.

Understanding ALD, MLD and SAMs as they enter the fab

03/01/2018  As the world of advanced manufacturing enters the sub-nanometer scale era, it is clear that ALD, MLD and SAM represent viable options for delivering the required few-atoms-thick layers required with uniformity, conformality, and purity.

Semiconductor Manufacturing Electronics Corporation formally signed a joint venture agreement

03/01/2018  SMIC, Shaoxing Government, and Shengyang Group together announced today the founding of the Semiconductor Manufacturing Electronics (Shaoxing) Corporation (planned) with joint capital contributions. T

92 IC wafer fabs closed or repurposed from 2009-2017

03/01/2018  150mm and 200mm wafer fabs accounted for two-thirds of total closures.

2018: Big changes in mask manufacturing and what it means for mask models

03/01/2018  There are big changes on the horizon for semiconductor mask manufacturing, including the imminent first production use of multi-beam mask writers, and the preparation of all phases of semiconductor manufacturing for the introduction of extreme ultra-violet (EUV) lithography within the next few years.

High-res 3D X-ray microscopy for non-destructive failure analysis of chip-to-chip micro-bump interconnects in stacked die packages

03/01/2018  3D integration and packaging has challenged failure analysis (FA) techniques and workflows due to the high complexity of multichip architectures, the large variety of materials, and small form factors in highly miniaturized devices.

Experimentally demonstrated a toffoli gate in a semiconductor three-qubit system

02/28/2018  A new progress in the scaling of semiconductor quantum dot based qubit has been achieved at Key Laboratory of Quantum Information and Synergetic Innovation Center of Quantum Information & Quantum Physics of USTC.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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