02/28/2018  Construction will be completed in the second half of 2019 and ready for production in 2020 Samsung aims to maintain its leadership in cutting-edge process technology under 7nm.

02/28/2018  Extreme ultraviolet and 193 immersion lithography technology and Cadence digital tools used to design 3nm CPU core.

02/27/2018  Co-developed technology solution enables significant power and die size reductions for IoT and wearable products.

02/27/2018  Brewer Science, Inc., today from SPIE Advanced Lithography 2018 introduced its OptiLign commercial-quality directed self-assembly (DSA) material set developed in collaboration with Arkema.

02/27/2018  The top five semiconductor metrology/inspection equipment vendors grew 17.7% in 2017 according to the report “Metrology, Inspection, and Process Control in VLSI Manufacturing”, recently published by The Information Network.

02/27/2018  ClassOne Equipment, Atlanta-based provider of refurbished name-brand semiconductor processing equipment, has announced the sale of multiple systems to a major global components manufacturer as part of a significant upgrade to their UK fab.

02/26/2018  Researchers at North Carolina State University have developed a new technique that allows them to print circuits on flexible, stretchable substrates using silver nanowires. The advance makes it possible to integrate the material into a wide array of electronic devices.

02/26/2018  SILTECTRA GmbH today reports that it has validated a breakthrough capability for its COLD SPLIT technology.

02/26/2018  Imec presents initial electrical results on N5 32nm pitch metal-2 layer.

02/23/2018  "The strong billings levels from late 2017 have carried over into the new year," said Ajit Manocha, president and CEO of SEMI.

02/23/2018  Super Micro Computer, Inc. today announced that it has expanded its Silicon Valley Headquarters to over two million square feet of facilities with the grand opening of its new Building 22.

02/22/2018  In January, Gigaphoton Inc., a major manufacturer of lithography light sources, announced the shipment of an ArF Excimer Laser for advanced immersion exposure (lithography) devices, the "GT65A" Unit 1, as a new product that meets the growing demand for semiconductors in recent years.

02/22/2018  Peter Trefonas, Ph.D., corporate fellow in Dow Electronic Materials, has recently been elected a Fellow of SPIE, for achievements in design for manufacturing and compact modeling.

02/22/2018  2017 finished on an upturn – both in the USA and globally. Based on consolidated fourth-quarter actual and estimated revenues of 213 large, global electronic manufactures, sales rose in excess of 7 percent in 4Q’17 vs. 4Q’16.

02/21/2018  Despite increasing costs of development, IC manufacturers are still making great strides.

02/21/2018  Cymer, a developer of lithography light sources used by chipmakers to pattern advanced semiconductor chips, today announced the first shipment of the newly qualified XLR 800ix light source that improves performance and productivity, as well as lowers cost-of-ownership for leading-edge argon fluoride (ArF) immersion lithography systems.

02/20/2018  Qualcomm Incorporated today announced that Qualcomm River Holdings B.V. has reached an agreement with NXP Semiconductors N.V.

02/20/2018  ASML Holding N.V. (ASML) today announces that its Supervisory Board intends to appoint Christophe Fouquet (44) as Executive Vice President to the Board of Management, subject to notification of the Annual General Meeting of Shareholders on 25 April 2018.

02/20/2018  Intel far surpasses others with R&D spending of $13.1 billion in 2017 and accounts for 36% of expenditures among Top R&D spenders.

02/16/2018  Growth in demand for wafer processing equipment will account for the majority of value growth.