Semiconductors

SEMICONDUCTORS ARTICLES



Report: Freescale poised for buyout

09/11/2006  September 11, 2006 - Two investment firm consortiums are in a bidding war to acquire Freescale Semiconductor, with the pricetag for the former Motorola chipmaking arm soaring past $16 billion, according to a New York Times report.

Samsung unwraps 40nm "charge trap flash" device

09/11/2006  September 11, 2006 - Samsung Electronics Co. Ltd. says it has created a 32Gb NAND flash device using 40nm process technologies, featuring a "charge trap flash" (CTF) architecture which the company says "sharply" reduces intercell noise levels, and enables higher scalability to enable transition from 40nm to 30nm and even 20nm processes.

Cascade Microtech announces partnership with Philips, Agilent

09/11/2006  Cascade Microtech, a maker of tools and systems for precise electrical measurements on small structures, announced a partnership agreement with Philips' MiPlaza research center and Agilent Technologies to create a new world class Electronic Measurement Laboratory on the High Tech Campus in Eindhoven, The Netherlands.

Excelpoint Distributes CMOS MEMS-based Timing Components

09/08/2006  Discera, Inc., a CMOS MEMS-based resonator technology provider, will partner with Excelpoint, a distributor in the Asia Pacific region, to begin full-scale commercial deployment of its timing products. Target markets will include China, Singapore, Hong Kong, and India.

Motorola, Arizona State advance carbon nanotube sensing capabilities

09/07/2006  Motorola Labs, the applied research arm of Motorola Inc., and Arizona State University announce a key advancement in the use of Single-Walled Carbon Nanotubes (SWNTs) in field effect transistors (FETs) to sense biological and chemical agents.

Dongbu launches 0.13-micron process for image sensors

09/06/2006  September 6, 2006 - Dongbu Electronics said it has completed development of a CMOS image sensor process using 0.13-micron process technologies, created for Seoul Electronics & Telecom Co. Ltd. The foundry plans to begin volume production of the devices in 4Q.

Samsung sampling 1-2GB NAND for mobile apps

09/06/2006  September 6, 2006 - Samsung Electronics Co. Ltd. is now shipping 1-2GB samples of its high-density MLC NAND, called "moviNAND," an embedded combination of NAND flash memory, a multimedia card (MMC) controller and onboard firmware, for use in mobile applications.

Freescale builds 3MB embedded flash array for autos

09/06/2006  September 6, 2006 - Freescale Semiconductor said it has added 32MB of flash memory to its 32-bit MCU targeted at automotive applications, and is sampling what it claims is the industry's largest embedded flash memory on an MCU.

FEI announces order from Japanese steel firm

09/06/2006  FEI of Hillsboro, Ore., announced that Japan's JFE Steel Corp. has ordered a Titan 80-300 for its research center in Kawasaki. JFE Steel, a leading global supplier of steel products, is the first Japanese customer to order the Titan S/TEM.

Euro partners tout EUV infrastructure progress

09/06/2006  September 6, 2006 - Focus GmbH and two German universities, Bielefeld and Mainz, working on a European Commission-sponsored project to develop extreme ultraviolet lithography (EUVL) technologies, say they have build a photoemission electron microscope capable of measuring features as small as 20nm without destroying the sample, a key step in development of EUV infrastructure.

Intel axes 10,500 workers, eyes $1B in capex "avoidance"

09/06/2006  September 6, 2006 - Confirming months of speculation, Intel has announced plans for a sweeping restructuring following an analysis of the company's structure and efficiency, citing plans to shave $3 billion off of annual costs and operating expenses over the next two years.

Chartered reaffirms 3Q guidance

09/06/2006  September 6, 2006 - Singapore foundry Chartered Semiconductor Manufacturing is maintaining its expectations for 3Q06, with sales flat to slightly down in a range of $356-$368 million, and profits of $6-$16 million.

SMIC rolls out platforms for 90nm SoC, 130nm processes

09/06/2006  September 6, 2006 - Chinese foundry Semiconductor Manufacturing International Corp. (SMIC) has developed a low-power digital reference flow for its 90nm process technology with Cadence Design Systems Inc., and completed a standard design platform with VeriSilicon Holdings Co. Ltd. for its 0.13-micron low leakage process.

ASML hikes 3Q orders outlook, cites memory push

09/06/2006  September 6, 2006 - Citing strong demand from DRAM and NAND flash customers, ASML has increased its outlook for tool orders in 3Q by about 50% to be flat with 2Q levels, suggesting an additional $575 million in sales could be on the books in the next year.

Nova puts litho metrology patents up for bids

09/06/2006  September 6, 2006 - Nova Measuring Instruments, Rehovoth, Israel, is soliciting bids from approximately 100 companies to license six of its patents relating to use of a lithography tool with integrated metrology, and will even accept bids for outright ownership of the technology.

Nova putting litho metrology patent licenses up for bids

09/06/2006  September 6, 2006 - Nova Measuring Instruments, Rehovoth, Israel, is soliciting bids from approximately 100 companies to license six of its patents relating to use of a lithography tool with integrated metrology, and will even accept bids for outright ownership of the technology.

SMIC adds to solar cell biz

09/05/2006  September 5, 2006 - Taiwanese power supply maker Powercom Co. reportedly is contracting mainland foundry Semiconductor Manufacturing International Corp. (SMIC) to manufacture solar cells, with operation scheduled to begin in November

SMIC, Synopsys forge 90nm reference flow

09/05/2006  September 5, 2006 - Synopsys Inc. and Chinese foundry Semiconductor Manufacturing International Corp. (SMIC) have developed and deployed a third-generation reference design flow based on SMIC's 90nm process.

Litho panel probes concerns about the "Road" ahead

09/05/2006  A somewhat surprising consensus on future lithography came out of a panel of experts at SEMICON West, with discussions of potential lithography solutions for the 32nm half-pitch node including major problems facing developers of EUV and high-index fluid immersion lithography using 193nm lasers. The message from panelists was clear -- the industry will have to learn how to live with dual-patterning at least for awhile, while toolmakers seek ways to boost throughput limits.

Promos commits $5B to two 300mm fabs

09/05/2006  September 5, 2006 - Promos Technologies has applied for government approval on two planned 300mm flash memory fabs at the Central Taiwan Science Park, with projected costs exceeding $5 billion by the time of projected completion in 2008.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts