Semiconductors

SEMICONDUCTORS ARTICLES



Cleanroom research focuses on next-gen wafer lithography

11/01/2005  A 2,600-square-foot cleanroom, previously occupied by Infineon, is the new site of research and development of emerging wafer-lithography technologies being conducted by Fraunhofer Center for Nanoelectronic Technologies.

Nano wind blows into Chicago

11/01/2005  The NanoCommerce trade show and SEMI NanoForum begin today in Chicago. The events, which run through Thursday, are designed to cover both business and technology issues.

Solder Bumping

11/01/2005  Mastering Challenges of Lead-free Alloys

Lead-free Impact on Wafer Bumping & Wafer-level Packaging

11/01/2005  With the July 2006 date for implementation of the EU’s RoHS and WEEE Directives looming, most, if not all producers of electronic products are studying prospective technologies and looking for potential solutions for assembling products using lead-free solders.

November 2005 Exclusive Feature: WAFER LEVEL TEST

Reliability testing using a highly parallel source-measure method



10/31/2005  Pete Hulbert, Keithley Instruments Inc., Cleveland, Ohio

New semiconductor materials and shrinking device dimensions have made reliability testing increasingly important because the gate dielectric behavior of modern devices isn't well understood, requiring the development of new device lifetime models. However, traditional test methods are time consuming and not suitable for new materials and shorter development cycles. A new approach...

Oki develops method to fabricate GaN-HEMT on silicon wafers

10/31/2005  October 31, 2005 - Oki Electric Industry Co. has developed a technique to fabricate transistors of gallium nitride (GaN) on silicon wafers instead of expensive silicon carbide, reports the Nikkei English News. Using this technique, Oki said it can manufacture chips with an output of around 100W for less than half the conventional cost.

Intel to invest $650 million in NM fab

10/25/2005  October 25, 2005 - Intel Corp. has announced plans to invest $650 million to increase the capacity of its 300mm wafer Fab 11X in Rio Rancho, NM. Construction and new tool installations are scheduled to continue through 2006, with production operations set to begin through the new expansion in early 2007. This investment will create more than 300 new manufacturing jobs.

View Engineering acquires Micro-Metric

10/21/2005  October 21, 2005 - Micro-Metric, San Jose, CA, a provider of noncontact measurement and assembly systems, has announced that View Engineering, a Simi Valley, CA-based vision measurement systems provider, has acquired its assets.

September '05 Book-to-Bill Ratio is 1.02

10/20/2005  San Jose, Calif. — In September 2005 and on a 3-month-average basis, North American-based manufacturers of semiconductor equipment posted $1.09 billion in orders and a book-to-bill ratio of 1.02, according to SEMI's September 2005 Book-to-Bill Report. This ratio represents $102 worth of orders received for every $100 of product billed for the month.

Analog shuttering CA fabs, moving work to MA, Ireland

10/20/2005  October 20, 2005 - Analog Devices Inc., Norwood, MA, is consolidating wafer fabrication operations in Sunnyvale and Santa Clara, CA, to its larger facilities in MA and Ireland, where the company works on more advanced process technologies.

IMEC, Infineon targeting nitride-based flash memory

10/19/2005  October 19, 2005 - European R&D consortium IMEC and chipmaker Infineon Technologies AG have developed a new profiling technique for extracting charge profiles in nitride-based nonvolatile flash memory (NVM), which will allow the technology to compete broadly against traditional flash memory for standalone code and data storage, as well as in embedded applications.

IMEC embarks on R&D for 45nm RF-CMOS, neuro-electronic systems

10/18/2005  October 18, 2005 - European R&D consortium IMEC has added an RF-CMOS arm to its industrial affiliation program for researching sub-45nm CMOS technologies, expanding its efforts from an earlier 90nm program.

MEMC keeps European silicon patent

10/18/2005  October 18, 2005 - MEMC Electronic Materials Inc., St. Peters, MO, has received a favorable ruling from the Opposition Division of the European Patent Office regarding the manufacture and use of semiconductor-grade, single-crystal, defect-free silicon wafers having a diameter of 200mm or greater.

Molecular Imprints names new CEO

10/18/2005  Molecular Imprints Inc., a maker of nanoimprint lithography tools, announced that it has appointed Mark Melliar-Smith as chief executive officer. Melliar-Smith was previously COO.

Oki Electric reports high-amplification GaN transistor

10/17/2005  October 17, 2005 - Oki Electric Industry Co. Ltd., Tokyo, Japan, has unveiled the development of a gallium nitride high electron-mobility transistor (GaN-HEMT) formed on a silicon substrate.

Eight new SEMI standards cover FPDs and MEMS

10/14/2005  October 13, 2005 - Semiconductor Equipment and Materials International (SEMI) has published eight new technical standards for the semiconductor, flat-panel display (FPD), and microelectromechanical systems (MEMS) manufacturing industries.

Samsung to pay $300M in DOJ DRAM deal

10/14/2005  October 14, 2005 - Samsung Electronics Co. Ltd. has agreed to pay a $300 million fine to the US Department of Justice regarding a single charge related to price-fixing allegations...

Indium Grows Western U.S. Sales Team

10/12/2005  Utica, N.Y. — In efforts to provide enhanced customer service, Indium Corp. has expanded its sales team in the western U.S. Bill Macartney IV is the new U.S. Rocky Mountain regional sales manager, Tony Przano is the new Southwest regional sales manager, and Karthik Vijayamadhavan is the new area sales manager for the West Coast.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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