08/19/2005  August 19, 2005 - North American-based manufacturers of semiconductor equipment posted $1.02 billion in orders in July (three-month average basis) and a book-to-bill ratio of 0.93, according to the monthly Book-to-Bill Report published today by SEMI.

08/19/2005  San Jose, Calif. — In July 2005, and on a 3-month average, North American-based semiconductor equipment manufacturers posted $1.02 billion in orders and a book-to-bill ratio of 0.93, according to SEMI's July 2005 Book-to-Bill Report.

08/19/2005  A consortium of companies in the Semiconductor Industry Association announced the launch of the Nanoelectronics Research Initiative.

08/18/2005  Aug. 18, 2005 - Tessera Technologies Inc. has transferred its MicroBGA chip-scale packaging technology to the University of Alaska Fairbanks and to North Dakota State University. This licensing and transfer of technology is a part of the development of an advanced technology center on both campuses.

08/18/2005  August 18, 2005 - EV Group, Scharding, Austria, has announced lab-on-a-chip (LoC) developments achieved at its Singapore customer Institute of Microelectronics (IME).

08/17/2005  August 17, 2005 - Engineers at Sematech's Advanced Materials Research Center (AMRC), Austin, TX, are investigating a nanoscale approach to metrology that will allow them to examine new semiconductor structures at the atomic level, and so prepare the way for next-generation electronics.

08/17/2005  San Jose, Calif. — Worldwide silicon wafer area shipments increased 10% during Q2 2005 when compared to Q1 area shipments, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis. Total silicon wafer area shipments were 1,606 million sq. in. during the most recent quarter, up from 1,465 million sq. in. shipped during the previous quarter. The new quarterly total area shipments are 1% below Q2 2004 shipments.

08/15/2005 

08/12/2005  August 12, 2005 - Worldwide silicon wafer area shipments increased 10% during 2Q05 when compared to 1Q05 area's shipments, according to SEMI's Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

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08/12/2005  August 12, 2005 - Silicon foundry Taiwan Semiconductor Manufacturing Co. (TSMC) recently submitted a plan to construct a 300mm wafer fab and a technology-development center at the Central Taiwan Science Park to the park's administration, according to the Taiwan Economic News.

08/12/2005  Colorado Springs, Colo. — IC Interconnect (ICI), a wafer bumping service company, now offers lead-free wafer-bumping capabilities as a standard service offering in recognition of the EU's looming RoHS initiatives.

08/11/2005  August 11, 2005 - MOSAID Technologies Inc. and foundry UMC have announced that they are cooperating on the development of comprehensive double data rate (DDR)/DDR2 SDRAM memory controller semiconductor intellectual property solutions for UMC's 90nm and 130nm process geometries.

08/11/2005 

08/08/2005  August 8, 2005 - IBM has announced the availability of its fourth-generation silicon germanium (SiGe) bipolar CMOS (BiCMOS) foundry technology, 8HP. The company reports that the new 130nm technology is applicable to markets such as automobile safety systems; 60GHz WiFi chips for wireless networks; high-speed A/D and D/A converters; and more.

08/05/2005  August 5, 2005 - A new project, part of the FP6 program of the EU and coordinated by IMEC, is targeted at demonstrating the breakthrough concept of spin torque in a nanoscale microwave integrated oscillator, intended for wireless integrated-device applications.

08/04/2005  August 4, 2005 - Falling prices amid "tepid demand" pushed most DRAM companies into the red in 2Q05, but some companies are shining as signs begin to indicate a recovery may be underway, according to preliminary data from iSuppli Corp.

08/03/2005  August 3, 2005 - The Semiconductor Industry Association (SIA) has announced it has signed a contract with Vanderbilt University to conduct a retrospective epidemiological study to determine if there is an increased cancer risk among wafer fabrication workers compared to other semiconductor industry workers and the general population.

08/02/2005  August 2, 2005 - The members of the Blue Whale Consortium have announced the successful completion of their mission to develop high-performance, cost-effective chip-size wafer-scale packaging (WSP) for system-on-chip (SoC) for handheld devices.

08/01/2005  Today’s consumer electronics demand higher performance from smaller form factors.

08/01/2005  Freescale Semiconductor Inc. (www.freescale.com) has embarked on a memory technology-magnetic tunnel-junction random access memory, or MRAM-that is proving to have implications for manufacturing in Freescale’s own cleanrooms.