07/14/2005  July 14, 2005 - ATMI Inc., a supplier of materials and materials packaging, has purchased a minority interest in Anji Microelectronics, a developer of advanced semiconductor materials located in Shanghai, China.

07/14/2005  (July 14, 2005) San Francisco, Calif. — Top executives from the semiconductor equipment and materials industry engaged in a debate over the industry's future on SEMICON West's opening day. One question addressed was whether the center of the industry will inevitably shift away from North America toward Asia, reflecting the Asia-Pacific market's growing size and importance.

07/13/2005  July 13, 2005 - ASM International N.V. and IMEC have announced that they have agreed to enter into a three year strategic partnership in the area of back-end-of-line (BEOL) interconnect technology, commencing in 2006.

07/13/2005  July 13, 2005 - Honeywell has announced that its Electronic Materials business will expand its Asia/Pacific manufacturing capabilities to include the production of 300mm PVD (physical vapor deposition) sputtering targets at its Korea plant.

07/13/2005  SAN JOSE, Calif.--(BUSINESS WIRE)--July 12, 2005--Olympus Integrated Technologies America's (Olympus-ITA) new AL Series optical inspection and defect review system delivers wafer edge and bevel inspection.

07/12/2005  July 12, 2005 -- Following the robust 67.2% market expansion in 2004, the equipment market will decline 12.1% to $32.6 billion in 2005, according to the mid-year edition of the SEMI Capital Equipment Consensus Forecast, released at the annual SEMICON West exposition.

07/12/2005  July 12, 2005 - Aviza Technology, Inc. and the SEZ Group announced they are joining forces to solve key challenges surrounding ALD film removal for next-generation IC manufacturing.

07/12/2005  SAN FRANCISCO, CA (July 11, 2005)-Eco-Snow Systems, a member of The BOC Group (NYSE: BOX), and the leading supplier of dry carbon dioxide (CO2) snow-based wafer cleaning tools, has introduced a new process for semiconductor wafer cleaning that eliminates the negative side effects of traditional plasma cleaning.

07/12/2005  VILLACH, Austria and PARIS, July 11 /PRNewswire/ -- The SEZ Group , the market leader and premier innovator in single-wafer cleaning solutions for the semiconductor industry, and Air Liquide (Euronext Paris), the world leader in industrial and medical gases and related services, today announced they are joining forces to solve the chemistry challenges associated with front-end-of-line (FEOL) advanced metal-gate etch.

07/12/2005  Clinton Township, Michigan--July 11, 2005--KUKA Robotics Corporation, a leading global manufacturer of industrial robots, today announced the introduction of a family of clean room robots designed for semiconductor manufacturing, test and handling applications.

07/12/2005 

07/12/2005  Providers of nanotechnology equipment are retooling their plans in the face of lower demand from semiconductor companies.

07/12/2005  Honeywell announced it intends to invest at least $5 million into laboratory equipment and research and will locate laboratories at the center.

07/12/2005 

07/11/2005 

07/08/2005  July 8, 2005 - As the 2H05 begins, the next down cycle in the semiconductor capital equipment market is becoming more apparent, according to analyst Gartner's recent report, "Semiconductor Capital Equipment Sales Face Soft Demand in 2H05." Gartner will present a detailed industry outlook on July 11 at next week's SEMICON West 2005 show.

07/08/2005  SAN FRANCISCO, CA -- (MARKET WIRE) -- 07/07/2005 -- The advanced chip industry is moving rapidly into nanotechnology, a trend that will be presented by global experts at next week's 2005 ITRS Public Conference of the draft 2005 International Technology Roadmap for Semiconductors (ITRS).

07/08/2005  Technology and the communications revolution have enabled an integrated world economy and have unleashed hypercompetitive enterprises.

07/07/2005  (July 7, 2005) Corning, N.Y. — Intel Corp. and Corning Inc. are joining forces in an agreement to develop ultra-low thermal expansion ULE glass photomask substrates required for extreme ultraviolet (EUV) lithography technology. These substrates are needed to develop low-defect EUV photomasks to enable 32-nm node high-volume production using EUV lithography. The joint development program will help to enable chip production using EUV technology by 2009.

07/07/2005  July 7, 2005 - Intel Corp. and Corning Inc. have entered into a joint development agreement (JDA) to develop ultra-low thermal expansion (ULE) glass photomask substrates required for extreme ultraviolet (EUV) lithography technology. The JDA will help to enable chip production using EUV technology starting in 2009.