Semiconductors

SEMICONDUCTORS ARTICLES



Touchy nanotubes work better when clean

01/04/2018  Rice, Swansea scientists show that decontaminating nanotubes can simplify nanoscale devices.

Surprising changes in semiconductor equipment market share in 2017

01/04/2018  Through three quarters of calendar year 2017, market shares of top semiconductor equipment manufacturers indicate large gains by Tokyo Electron and Lam Research.

Global semiconductor sales increase 21.5% year-to-year in November

01/03/2018  Worldwide market notches highest-ever monthly sales of $37.7 billion; sales increase 1.6 percent compared to October.

SEMI data projects new highs in fab equipment spending

01/03/2018  The year-end update to the SEMI World Fab Forecast report reveals 2017 spending on fab equipment investments will reach an all-time high of $57 billion.

Viewing atomic structures of dopant atoms in 3-D relating to electrical activity in a semiconductor

01/02/2018  Scientists at Tokyo Institute of Technology (Tokyo Tech) and their research team involving researchers of JASRI, Osaka University, Nagoya Institute of Technology, and Nara Institute of Science and Technology have just developed a novel approach to determine and visualize the three-dimensional (3D) structure of individual dopant atoms using SPring-8.

eVaderis completes tape-out of MRAM-based, memory-centric MCU demonstrator for next-gen IoT applications

01/02/2018  eVaderis, a semiconductor IP start-up that provides design solutions to improve the functionality, power efficiency and performance of its customers' semiconductor chips, has successfully demonstrated a fully functioning design platform through an ultra-low-power microcontroller (MCU) in Beyond Semiconductor's BA2X product line.

SEMI names new SEMI Japan president

01/02/2018  SEMI today announced the appointment of Masahiko (Jim) Hamajima as president of SEMI Japan.

APAC tops the global mask alignment systems market

12/22/2017  The global mask alignment systems market is expected to grow at a CAGR of more than 9% during the forecast period, according to Technavio’s latest market research.

Qualcomm board unanimously rejects director nominees assembled by Broadcom and Silver Lake partners

12/22/2017  Qualcomm Incorporated today announced that the Qualcomm Board of Directors, following the recommendation of the Board's Governance Committee, has unanimously determined not to nominate any of the 11 candidates assembled by Broadcom Limited and Silver Lake Partners.

UMC announces availability of 40nm SST embedded flash process

12/21/2017  Toshiba MCU ICs are expected to utilize the highly robust, non-volatile memory process.

Understanding the impact of defects on the properties of moS2

12/21/2017  Researchers at the Center for Integrated Nanostructure Physics, within the Institute for Basic Science (IBS), have shown that defects in monolayer molybdenum disulfide (MoS2) exhibit electrical switching, providing new insights into the electrical properties of this material. As MoS2 is one of the most promising 2D semiconductors, it is expected that these results will contribute to its future use in opto-electronics.

New JEDEC committee for wide bandgap power semiconductors invites industry participation

12/20/2017  JEDEC Solid State Technology Association announces the successful launch of its newest committee: JC-70 Wide Bandgap Power Electronic Conversion Semiconductors.

Samsung now mass producing industry's first 2nd-generation, 10nm class DRAM

12/20/2017  Samsung Electronics Co., Ltd. announced today that it has begun mass producing the industry’s first 2nd-generation of 10-nanometer class (1y-nm), 8-gigabit (Gb) DDR4 DRAM.

ISS Europe 2018 to focus on winning in the global marketplace

12/20/2017  Electronics manufacturing executives will sharpen their competitive edge in Dublin, Ireland, on 4-6 March at Europe's SEMI Industry Strategy Symposium (ISS Europe).

Acoustic device makes piezoelectrics sing to a different tune

12/20/2017  New embedded transducer approach allows surface acoustic wave device to transmit signals with six times the speed of most commercially used devices.

EPC introduces 40V gallium nitride power transistor eight times smaller than equivalently rated MOSFETs

12/19/2017  EPC2049 GaN power transistor offers power systems designers a 40 V, 5 m? power transistor about 8 times smaller than equivalently rated silicon MOSFETs for point of load converters, LiDAR, and low inductance motor drive.

Intersil to start operations as Renesas Electronics America in January 2018

12/19/2017  Renesas Electronics Corporation today announced the integration of Intersil Corporation as a legal entity and a new branding policy following the acquisition of Intersil on February 24, 2017.

Ronnie Kenneth joins Nova's Board of Directors

12/19/2017  Nova, a provider of metrology solutions for advanced process control used in semiconductor manufacturing, today announced that Ronnie (Miron) Kenneth, former CEO of Voltaire Technologies Ltd. and former CEO of Pontis Ltd., has been appointed to the company's Board of Directors.

EVG completes latest phase of production capacity expansion at corporate headquarters

12/19/2017  Newly opened building with advanced cleanroom technology provides additional space for final assembly of EVG process equipment and technical source inspection by the company's global customers.

Largest SEMICON China ever targets industry growth

12/19/2017  More than 70,000 players in the electronics manufacturing industry are expected to descend upon SEMICON China for technology and innovation insights to accelerate already strong industry growth.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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