Semiconductors

SEMICONDUCTORS ARTICLES



STEAG HamaTech expands US activities

06/07/2005  June 7, 2005 - STEAG HamaTech USA Inc., a wholly owned subsidiary of STEAG HamaTech, Sternenfels, Germany, will be expanding its presence in Austin, TX, with an initiative to strengthen US infrastructure capabilities for installed base customer support for photomask process equipment, as well as product development for niche wafer applications.

Freescale, U. of Florida develop double-gate transistor model

06/06/2005  June 6, 2005 - Freescale Semiconductor and the University of Florida have created what they say is the industry's first double-gate transistor model called FinFET. It is engineered to pack more computing power into less space and reduce power consumption, while using existing semiconductor manufacturing processes.

Canadian nanoengineers create tiny transistor

06/03/2005  June 3, 2005 - Canadian engineers have unveiled the creation of what they say is the world's smallest transistor in which electricity flows through a molecule, reported the Agence France-Presse. The device is only visible through a powerful microscope, but experts say it may be the biggest development so far in nanotechnology.

Applied Materials files to establish holding company in China

06/02/2005  June 2, 2005 - Applied Materials Inc. has announced its intention to form a holding company in China and to enhance its operations and capabilities in the country. The application for Applied Materials (China) Holdings Ltd. is pending approval by Chinese government agencies.

Baolab Selects Coventor 3-D Micro-emulation Tool

06/02/2005  (June 02, 2005) Cary, N.C. — Baolab MicroSystems has picked Coventor Inc.'s 3-D micro-emulation tool, MEMulator, to verify its design in the pre-fabrication stage. MEMulator provides realistic 3-D design-rule checks visualization and mechanical connection color scheming to check for etch and connection errors before foundry processes. Baolab has incorporated MEMulator into its design process to catch errors and reduce fabrication runs.

NEW PRODUCTS

06/01/2005 

Automotive Packaging Is a Powerful, Problem-solving Tool

06/01/2005  Protecting Silicon From Extreme Environments

Single-wafer, mixed-fluid cleaning proposed for advanced processes

06/01/2005  AUSTIN, Texas-The need for and difficulty of removing surface particles without damaging circuit features, and the increasing trend of mask cleaning borrowing from wafer-cleaning technologies, were key themes that emerged from the seventh annual conference on surface preparation cleaning "Emerging Technologies in Semiconductor Surface Preparation," sponsored by SEMATECH(www.sematech.org).

VLSI: Global tool orders off in April

05/31/2005  Worldwide bookings for semiconductor manufacturing equipment totaled $3.72 billion in April, down 10.6% from March and 34.6% from a year ago, according to VLSI Research Inc.

Heard at Europa: ITRS stewards seek clarity, consensus for Roadmap priorities

05/31/2005  By Paula Doe, Contributing Editor, WaferNews

Key issues under discussion for the 2005 edition of the International Technology Roadmap for Semiconductors include the introduction of 450mm wafers, the problem of improving critical dimension control, and clearer definitions for half pitch to keep everybody honest, said regional committee chairmen in a press conference at the recent SEMICON Europa.

Global semiconductor sales show slight decline in April

05/31/2005  May 31, 2005 - Worldwide sales of semiconductors declined slightly in April to $18.2 billion, a sequential decline of 1.2% from the $18.4 billion reported in March, the Semiconductor Industry Association (SIA) reported today. April sales were up 6.9% from the $17.0 billion reported in April 2004. The SIA noted that April is traditionally a strong month for semiconductor sales.

Tool companies collaborate on AFM tip development

05/31/2005  Veeco, a developer of atomic force microscopy (AFM) products, announced last week that it signed a joint development program with CEA Leti, an applied research electronics laboratory in Europe, and Team Nanotec, a fabricator of AFM probe tips.

June 2005 Exclusive Feature: APC/E-DIAGNOSTICS

Principles for combining sensor data collection with process control



05/27/2005  By Leonid Rosenboim, MKS Instruments Inc.

Collection and analysis of physical measurements have become crucial components in advanced process control (APC) and e-diagnostics for semiconductor manufacturing. To further advance diagnostics capabilities, tool suppliers and device makers are increasing the number of sensors used in process chambers to improve manufacturing steps and ultimately achieve higher yields.

Order round-up: Akrion, Mattson, Synopsys, Ultratech

05/25/2005  May 25, 2005 - A round-up of recent industry activity shows new orders for Akrion, Mattson Technology, Synopsys, and Ultratech products.

STS Augments Presence in Asia with New Singapore Office

05/25/2005  (May 25, 2005) Cardiff, U.K. — Surface Technology Systems plc (STS) has opened its new sales office in Singapore, further strengthening its commitment to the Asian semiconductor manufacturing market. The Singapore office will provide local sales and service support to customers and STS agents throughout Singapore, Australia, China, Hong Kong, India, Korea, Malaysia, Philippines, Taiwan, and Thailand.

IBM, Infineon, Macronix launch exploratory research on new memory technology

05/24/2005  May 24, 2005 - IBM, Infineon, and Macronix have announced a joint research initiative to explore the potential of a new form of computer memory technology called phase-change memory (PCM), which stores data by changing the state of a special material from an amorphous to a crystalline structure, rather than storing data as an electrical charge.

Oraxion Diagnostics appoints new CEO, COO

05/24/2005  May 24, 2005 - Oraxion Diagnostics, a provider of advanced metrology systems, has named industry veterans Bang C. Nguyen as CEO and director and Jonathan M. Sabol as COO.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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