09/09/2004  (September 9, 2004) Washington, D.C.—IMAPS will sponsor an optoelectronics device packaging workshop and exhibition from October 11 through 14, 2004, at the Radisson Hotel in Bethlehem, Penn. The event will focus on advances in optoelectronics, opto device packaging and associated technologies.

09/09/2004  September 9, 2004 - DARPA has awarded Lucent Technologies a $9.5 million contract to develop an advanced microsystem that will make the design, engineering, and fabrication of next-generation advanced silicon ICs faster, more economical, and with increased security for military apps such as homeland security.

09/08/2004  September 8, 2004 - A slew of earnings updates from chipmakers suggest that the march of sustained strong growth for the industry is nearing an end.

09/08/2004 

09/07/2004  September 7, 2004 - Chartered Semiconductor Manufacturing has achieved functional 0.13-micron 300mm wafers from its Fab 7, showing silicon results that exceeded internal targets within five months of the first equipment installation. According to the company, it has also launched engineering 300mm wafers at Fab 7 for its 0.11-micron process, as well for the 90nm platform it is jointly developing with IBM.

09/02/2004  September 2, 2004 - ASML Holding NV, Veldhoven, The Netherlands, and Tokyo-based Nikon Corp. have mutually agreed to suspend legal proceedings in the US and Asia concerning disputed IP for lithography systems.

09/01/2004 

09/01/2004 

09/01/2004  The National Science Foundation has awarded University of Oregon $402,000 for a new electron beam lithography and nanoimprint lithography systems. UO is contributing $172,000 of the $574,000 price tag for the new equipment. UO Professors Mark Lonergan and Jim Hutchison were among the co-principal investigators listed on the grant application.

09/01/2004  OVEN CONTROL AND SOLDER MATERIAL CONSISTENCY ARE CRITICAL

09/01/2004  For years, engineers at SensArray heard from their customers how much they wanted a wireless temperature measuring device that could run within a lithotrack to measure the real-time temperatures of the hotplates and heating elements—without having to manually access the wafer.

09/01/2004  In a move designed to meet increasing research and development needs within the semiconductor industry, International Sematech (www.sematech.org) has established the Advanced Technology Development Facility, Inc. (ATDF) as an independent subsidiary of its R&D wafer fab and related analytical labs.

08/31/2004  August 31, 2004 - EV Group (EVG), a supplier of wafer-bonding and lithography equipment, has opened a second customer-support center in Japan with a significant increase in engineering staff to better serve its growing customer base in that country.

08/31/2004  August 31, 2004 - Wafer fab capacity utilization for integrated circuits climbed to 95.4% in the second quarter of 2004, the highest since the peak of the last IC boom period in 2000, according to recent data compiled by the Semiconductor International Capacity Statistics (SICAS).

08/31/2004  A Colorado-based government lab has moved forward in its quest to make a precise clock available to more industries. Researchers with the National Institute of Standards and Technology(NIST) reported last Friday that they have developed the core technology for a MEMS-based atomic clock.

08/30/2004  (August 30, 2004) Mountain View, Calif.—The Microelectronics Packaging and Test Engineering Council (MEPTEC) is gearing up to host two luncheons in September to unveil Dataquest's annual forecast. Jim Walker, VP of Semiconductor Manufacturing and Emerging Technologies at Gartner-Dataquest (and also a member of Advanced Packaging's advisory board), will present 'Up, Down, and All Around: Pedaling Your Way Through the Next Cycle.'

08/30/2004  August 30, 2004 - Pall Corp. and Matheson Tri-Gas Inc., a member of Nippon Sanso Corp., have entered into a strategic alliance to jointly develop, manufacture, and sell gas purifiers to the semiconductor industry.

08/30/2004  August 30, 2004 - Last week, Intel presented highlights of its 65nm process technology, which the company has demonstrated on fully functional 70Mbit SRAM chips containing more than 0.5 billion transistors (each cell contains six transistors). The news comes only nine months after the company's disclosure of its first 0.57 sq. micron SRAM logic cell at 65nm.

08/30/2004  August 30, 2004 - Researchers from the Georgia Institute of Technology and Naval Research Laboratory have improved upon a method to directly write nanometer-scale patterns onto various surfaces.

08/30/2004