12/06/2017  With the prospects of large 450mm wafers going nowhere, IC manufacturers are increasing efforts to maximize fabrication plants using 300mm and 200mm diameter silicon substrates.

12/06/2017  Leti, a research institute of CEA Tech, has integrated hybrid III-V silicon lasers on 200mm wafers using standard CMOS process flow.

12/06/2017  EPFL researchers have successfully measured some of the quantum properties of electrons in two-dimensional semiconductors. This work in the field of spintronics could one day lead to chips that are not only smaller but that also generate less heat.

12/06/2017  A new technology enables dramatically lower thermal budget capability that is enabling to thermal processes like epitaxy, CVD and diffusion, without any semiconductor material consumption.

12/05/2017  October marked the global industry's largest-ever monthly sales total.

12/05/2017  A new illumination technology compares favorably to conventional bright field illumination.

12/05/2017  Discovery expected to lower energy consumption in electric power equipment.

12/05/2017  Quarterly billings of US$14.3 billion set an all-time record for quarterly billings, exceeding the record level set in the second quarter of this year.

12/04/2017  The third quarter of this year has seen broad growth both globally and also for the European electronic supply chain.

12/04/2017  GLOBALFOUNDRIES and Ayar Labs, a startup bringing optical input/output (I/O) to silicon chips, today announced a strategic collaboration to co-develop and commercialize differentiated silicon photonic technology solutions.

12/01/2017  Electronics manufacturing executives will attend Europe’s SEMI Industry Strategy Symposium (ISS Europe) in Dublin, Ireland on 4-6 March.

12/01/2017  Smartphones and computers wouldn't be nearly as useful without room for lots of apps, music and videos. Devices tend to store that information in two ways: through electric fields (think of a flash drive) or through magnetic fields (like a computer's spinning hard disk). Each method has advantages and disadvantages. However, in the future, our electronics could benefit from the best of each.

12/01/2017  The ConFab 2018, to be held at The Cosmopolitan of Las Vegas on May 21-23, is thrilled to announce the newest opening day Keynote speaker, Professor John M. Martinis.

11/30/2017  The semiconductor industry continued its upward trend in the third quarter of 2017, notching 12 percent sequential growth with strength across all application markets, according to IHS Markit.

11/30/2017  Soitec, a designer and manufacturer of semiconductor materials for the electronics industry, today announced the latest generation of silicon-on-insulator (SOI) substrates in its Imager-SOI product line designed specifically for fabricating front-side imagers for near-infrared (NIR) applications including advanced 3D image sensors.

11/30/2017  Empa researchers in collaboration with the Max Planck Institute for Polymer Research in Mainz and the University of California at Berkeley have now succeeded in growing ribbons exactly nine atoms wide with a regular armchair edge from precursor molecules.

11/30/2017  Micron Technology Inc. (Nasdaq:MU) today announced that the company has appointed Derek Dicker as vice president and general manager of the Storage Business Unit.

11/29/2017  Transphorm Inc. announced it received a $15 million investment from Yaskawa Electric Corporation.

11/29/2017  SiFive announced today that it has joined GLOBALFOUNDRIES' FDXcelerator Partner Program, and will be making RISC-V CPU IP including SiFive's E31 and E51 RISC-V cores available on GF's 22FDX process technology.

11/28/2017  North America-based manufacturers of semiconductor equipment posted $2.02 billion in billings worldwide in October 2017 (three-month average basis).