08/02/2004  August 2, 2004 - Intel Corp. said it has finished installation of the world's first pilot line for extreme-ultraviolet (EUV) lithography at its 300mm Hillsboro, OR, facility, in an effort to move the technology out of R&D and on track for 32nm IC production by 2009.

08/02/2004  August 2, 2004 - Cries of an impending slowdown in equipment demand weren't enough to dampen the Japanese equipment industry, which flared back to life in June by posting the most order value in three and a half years.

08/02/2004  In every sense of the phrase, LumArray Inc. wants to rip the mask off the world of photolithography. Launched only this summer, the latest startup from MIT has a new technology to fire beams of light through a mosaic of micro-machined lenses onto a substrate.

08/01/2004  While the numbers were generally positive for the assembly and test subcontractors in the first quarter of 2004, the industry cooled off somewhat to start the year.

08/01/2004  Packaging Requirements for MEMS and MOEMS

08/01/2004  When it comes to manufacturing, the philosophy at Matrix Semiconductor Inc. (www.matrixsemi.com) is there's nothing new in the process.

07/30/2004  July 30, 2004 - IBM, East Fishkill, NY, has unveiled a chip-morphing technology to support a new class of semiconductors that can automatically monitor and adjust their performance and power consumption.

07/28/2004 

07/27/2004  (July 27, 2004) San Jose, Calif.—The Fabless Semiconductor Association (FSA) recently announced that fabless company funding sequentially increased 62 percent year-over-year (YoY) in Q2 2004. FSA made this announcement with the release of its Q2 2004 Fabless Fundings report. Forty-five fabless companies generated $543.7 million in investments in Q2 2004, compared to 27 in Q2 2003, totaling $335.4 million.

07/27/2004  July 26, 2004 - Winbond Electronics Corp. has begun construction of its $2.5 billion 300mm fab in the Central Taiwan Science Park in Taichung.

07/27/2004  July 27, 2004 - Taiwan Semiconductor Manufacturing Co. (TSMC) and El Segundo, CA-based Applied Wave Research Inc. (AWR), a provider of electronic design automation (EDA) tools, have agreed to jointly develop a design platform for TSMC's 0.35-micron silicon germanium (SiGe) process.

07/23/2004  July 23, 2004 - Shanghai-listed Jiangxi Lianchuang Optoelectronic Science and Technology Co., Ltd., one of four national semiconductor lighting bases in China, aims at building a complete LED industrial chain covering epitaxial wafer, chip manufacture and packaging.

07/22/2004  July 22, 2004 - Lam Research Corp., Fremont, CA, said it has ceased investment and development of its CMP systems. The company will continue to support its CMP installed base but is redeploying CMP resources, including R&D and workers, to its etch business.

07/22/2004  July 22, 2004 - Ibis Technology Corp., Danvers, MA, a provider of SOI implantation equipment, has decided to discontinue its wafer-manufacturing business to focus on its SOI implant tools.

07/22/2004  (BUSINESS WIRE, July 22, 2004) Petaluma, Calif.—Tegal Corporation has been granted United States Patents Nos. 6,689,220 and 6,756,318, which enable nano layer deposition (NLD) of conformal thin films for barrier, copper seed and high-K dielectric applications in advanced microprocessor and memory device production.

07/21/2004  July 21, 2004 - Amkor Technology Inc., Chandler, AZ, has agreed to acquire Unitive Inc., Research Triangle Park, NC, for $48 million, gaining technology and capacity for 300mm electroplated wafer bumping, lead-free wafer bumping and wafer-level packaging, and bump/probe assembly and test capabilities in Taiwan and the US.

07/21/2004  (July 21, 2004) Chandler, Ariz.—Amkor Technology, Inc. signed agreements to acquire privately-held North Carolina-based Unitive, Inc., and to obtain a majority interest of approximately 60 percent in Unitive Semiconductor Taiwan Corporation (UST), a joint venture between Unitive and various Taiwanese investors. Unitive, Inc. and UST are among the world's leading providers of services for flip chip and wafer level packaging applications.

07/21/2004  PennWell Corp., publisher of Solid State Technology, recently announced a new semiconductor industry event, The ConFab, to be held at the Venetian Hotel in Las Vegas on May 15-18, 2005.

07/21/2004  July 21, 2004 - Amkor Technology Inc. has signed definitive agreements to acquire privately-held Unitive Inc., based in North Carolina, and to obtain a majority interest of approximately 60% in Taiwan-based Unitive Semiconductor Taiwan Corp., a joint venture between Unitive and various Taiwanese investors.

07/20/2004  (July 14, 2004) San Francisco, Calif.—Silicon Border Development, a global developer of industrial parks catering to the high-tech industry, signed an exclusivity agreement with the State of Baja California, Mexico, to create a specialized industrial park called "Silicon Border" that will establish an alternative for cost-effective and centralized semiconductor operations in North America.