Semiconductors

SEMICONDUCTORS ARTICLES



SST invests in Grace

03/08/2004  March 8, 2004 - Flash memory developer Silicon Storage Technology (SST), Sunnyvale, CA, said it contributed $33 million to the recent Series B round of financing in Grace Semiconductor Manufacturing Corp., the holding company for foundry Shanghai Grace Semiconductor.

Europe to lead sub-45nm development

03/08/2004  March 8, 2004 - The European Commission has announced plans to create a consortium to demonstrate the feasibility of 45nm-and-below CMOS logic technologies.

SMIC: We have funds for 2005

03/08/2004  March 8, 2004 - China's Semiconductor Manufacturing International Corp. (SMIC) says it has enough funding to meet its capital requirements through 2005, but is leaving the door open to raise more funds.

Nanochip to make memories with $20 million more

03/08/2004  Armed with new investment, Nanochip Inc. expects to make a memorable impact on the removable storage market. The Oakland, Calif., firm today received $20 million from a syndicate of institutional and industry investors, including Microsoft Corp. That is about $5 million more than the company sought during its second funding round.

Samsung joins 65nm trio

03/05/2004  March 5, 2004 - Samsung Electronics has joined IBM, Chartered, and Infineon in efforts focus on 65nm CMOS logic processes, eventually including 45nm process development.

Hitachi firms join for parts

03/04/2004  March 4, 2004 - Three semiconductor-manufacturing groups under Hitachi Ltd. plan to join forces to purchase equipment parts and materials.

Flash inventor seeks payday

03/03/2004  March 3, 2004 - Former Toshiba Corp. engineer Fujio Masuoka has filed a suit in the Tokyo District Court seeking 1 billion yen ($9.2 million) from his former employer for his contributions toward the creation of flash memory.

NanoOpto, Nanonex drop disputes

03/03/2004  NanoOpto Corp. and Nanonex Corp. have settled a legal dispute over intellectual property and other business issues.

SEAJ: Backend leads Japan equipment, frontend showing life?

03/02/2004  March 2, 2004 - Demand for Japanese-made semiconductor equipment continues to be led by backend operations, but signs of a shift may be starting to appear, according to the latest figures from the Semiconductor Equipment Association of Japan (SEAJ).

UMCi revs production

03/02/2004  March 2, 2004 - UMCi, the Singapore-based 300mm fab of United Microelectronics (UMC), has started volume production with "good wafer yields" of copper interconnect-based chips for FPGA and wireless communications.

The Small Print: Book publishers are following the nano buzz

03/02/2004  The day after HP's "n is for nanotechnology" commercial ran during the U.S. Open tennis tournament in September 2003, Fred Filler's phone started ringing. The marketing manager with book publisher Wiley & Sons had long been telling colleagues that nanotechnology was a subject they'd be hearing more about. Today, Wiley is one of several publishers with a growing focus on small tech titles.

Renesas files against Nanya

03/01/2004  March 1, 2004 - Renesas Technology Corp. has filed a complaint in Tokyo District Court against Nanya Technology Corp.'s Japan subsidiary, alleging "willful" misuse of two memory-related patents.

Semiconductor industry ready to take 193-nanometer plunge

03/01/2004  Less than a month into 2004, semiconductor industry representatives have decided that the end of the decade should be all wet.

Jensen Corp.: A fitting acquisition for Swagelok

03/01/2004  When Jensen Fittings Corp. was sold to Swagelok Co. in January 2001, the purchase of the sanitary fitting and component maker may have been regarded in one of two ways—just another deal in the merger-acquisition trend or a transaction that allowed an autonomous life sciences-based firm to go global and a fluid components manufacturer to diversify even further.

Semico: Wafer demand strong in 2004

02/27/2004  February 27, 2004 - Demand for wafers grew nearly 13% in 2004 and will continue at nearly a double-digit pace from now until 2008, according to Semico Research.

Intense Photonics expanding, hiring

02/26/2004  FEB. 26--GLASGOW, Scotland-- Optoelectronic chip maker Intense Photonics Ltd. is hiring and expanding facilities at its UK fab to handle demand from emerging markets.

SMIC IPO funds not enough for capex?

02/26/2004  February 26, 2006 - Just more than half of the funds raised in the initial public offering of China's Semiconductor Manufacturing International Corp. (SMIC) will go to the company -- the rest will be squirreled away by directors and institutional shareholders

EU probing alleged chip price fixing

02/26/2004  February 26, 2004 - The European Union has opened a probe into allegations of collusion over chip prices and output among the world's memory chip producers.

Wacker Siltronic planning April IPO

02/26/2004  February 26, 2004 - Wacker Siltronic, the wafer unit of Wacker Chemie GmbH, Freiberg, Germany, is planning an IPO by mid-April, according to a statement made at the company's earnings conference.

Intel invests again in EUV

02/25/2004  February 25, 2004 - Intel Corp., Santa Clara, CA, has agreed to make an equity investment in Media Lario International SA, an Italian developer of optical components for extreme ultraviolet (EUV) lithography.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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