Semiconductors

SEMICONDUCTORS ARTICLES



CleanRooms Group and PDA Launch Agenda for "First-Ever" Contamination Control and Pharmaceutical Manufacturing Science Event

02/25/2004  CO-LOCATED CLEANROOMS EAST 2004/PDA SCITECH SUMMITT SET FOR MARCH 8-12, 2004, IN ORLANDO, FLA. FEB. 12--Nashua, N.H.--CleanRooms Group of PennWell Corp., publishers of CleanRooms magazine, and PDA, an international association for pharmaceutical and biopharmaceutical science and technology, have finalized the agenda for conference sessions to be offered at the 2004 CleanRooms East / PDA SciTech Summit at the Orlando County Convention Center in Orlando, Florida, March 8-12, 2004.

Intel: 2004 revenues in step with industry

02/24/2004  February 24, 2004 - Intel Corp., Santa Clara, CA, said its revenue growth in 2004 will be about 15%, in the middle of earlier forecasts and the same as the projected growth for the entire chip industry.

ASAT reports second consecutive quarter of operating profits

02/24/2004  (February 24, 2004) Pleasanton, Calif.—ASAT Holdings Ltd. has released its financial results for Q3 2004, and business is improving. Net revenue in Q3 was $59.6 million, an increase of 50 percent compared to $39.7 million last year.

Synopsys boosts IP with acquisitions

02/23/2004  February 23, 2004 - Synopsys Inc., Mountain View, CA, has made a pair of acquisitions to bolster its IP portfolio with embedded memory and CMOS transceiver technologies.

Hynix ramping up in China

02/23/2004  February 23, 2004 - Now in the final stages of factory site selection, Hynix Semiconductor's China affiliate reportedly could begin commercial production of memory chips by 2H05.

SMIC IPO bigger than expected?

02/23/2004  February 23, 2004 - The upcoming IPO of Semiconductor Manufacturing International Corp. (SMIC) could raise up to $1.58 billion, about 5% higher than initial projections, with a projected P/E ratio surpassing both TSMC and UMC.

Fairchild planning $143 million expansion to 8-inch wafer fab

02/20/2004  FEB. 20--MOUNTAINTOP, Penn.--Fairchild Semiconductor will invest $143 million to expand its 8-inch wafer facility here.

Nikon, TEL accelerate 193nm immersion plans

02/19/2004  February 19, 2004 - Nikon Corp. and Tokyo Electron Ltd. are accelerating their co-development of 193nm immersion lithography tools with a sooner-than-expected mass production start date of late 2H05.

AML: No more MEMS fabless model for us

02/19/2004  February 19, 2004 - UK-based AML said it is abandoning the foundry model for fabricating MEMS devices, calling it a "flawed concept" and "not flexible enough" to meet its demands, and is reverting back to in-house fabrication.

Bye-bye, SiGe BiCMOS in cell phones, says TI

02/19/2004  Silicon-germanium BiCMOS has been relegated to the status of a niche technology at Texas Instruments Inc., now that the Dallas-based company has demonstrated a single-chip CMOS concept for next-generation radio circuits used in cellular phones and other portable wireless applications.

FSI, SCP settle patent suits

02/19/2004  February 19, 2004 - FSI International Inc., Chaska, MN, and SCP Global Technologies Inc., Boise, ID, have settled litigation alleging patent infringement of wafer processing technologies.

Oregon's nanotech researchers are thinking commercialization

02/18/2004  When Congress passed the $3.7 billion 21st Century Nanotechnology Research and Development Act last year, hopes blossomed among Oregon's academics. Among the bill's sponsors was their own senator, Democrat Ron Wyden. When the money begins to flow in 2005, Oregon will be ready. Researchers are moving from basic research to product tests in microtechnology-based energy, chemical and biological systems, along with nanomaterials and nanosurfaces.

Nanometrics, Lam ink metrology deal

02/17/2004  February 17, 2004 - Nanometrics Inc., Milpitas, CA, has signed a deal to integrate its NanoOCD/DUV 9101b film thickness mapping module into Lam's CMP tool.

Matsushita targets 15% chip sales growth

02/13/2004  February 13, 2004 - Matsushita Electric Industrial Co. said it is planning for 15% revenue growth in its semiconductor business over the next three years, by focusing efforts on system LSIs and image sensors for consumer devices.

SMIC files for IPO

02/12/2004  February 12, 2004 - China's Semiconductor Manufacturing International Corp. has filed with US securities regulators for a $714 million initial public offering in Hong Kong and New York.

Kulicke & Soffa, ASE team up

02/12/2004  (February 12, 2004) Willow Grove, Penn.—Kulicke & Soffa and ASE have formed a strategic relationship between Kulicke & Soffa's Test Products Group and ASE Test Limited. As part of the agreement, K&S will provide onsite services at ASE Test's facilities in Taiwan.

K&S, ASE tie up for chip testing

02/11/2004  February 11, 2004 - Kulicke & Soffa, Willow Grove, PA, and the ASE Group have formed a strategic relationship, whereby K&S' Test Products Group will provide onsite services at ASE Test Ltd's facilities in Taiwan.

Winbond reading fab for 3Q

02/11/2004  February 11, 2004 - Winbond Electronics Corp. said it is planning to start the $1.3 billion first stage of construction on its 300mm facilitiy in the Central Taiwan Science Park by 3Q04.

A (very) small measure of success

02/11/2004  February 11, 2004 - A device created at MIT makes the most precise measurement device of all: the Nanoruler, with "ticks" a few hundred-billionths of a meter apart.

Chipmakers tout Black Diamond, Applied describes new lowk technology

02/11/2004  February 11, 2004 - Eight chipmakers were on hand recently in San Francisco, presenting their end products manufactured at the 90nm node using Applied Materials' Black Diamond lowk dielectric film on the company's Producer SE platform.




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Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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