Semiconductors

SEMICONDUCTORS ARTICLES



Molecular memory not a dream as ZettaCore attracts real money

01/20/2004  Your cell phone, like an increasing number of electronic devices, constantly drinks electricity to maintain its memory. If you could somehow get it to sip instead of gulp, you might get a week from the battery instead of a day. That's one potential benefit of technology under development at ZettaCore, which is expected to announce today that a venerated venture capital firm has taken an equity stake.

Renesas eyes IPO

01/19/2004  January 19, 2004 - Renesas Technology Corp., the JV between Hitachi and Mitsubishi Electric, has reportedly signed Goldman Sachs and Daiwa SMBC to manage its initial public offering later this year.

SensoNor chooses SUSS tools for tire sensors

01/19/2004  SensoNor ASA (News, Web) has chosen SUSS MicroTec AG's (News, Web) MEMS production systems to make tire pressure sensors, according to a news release.

Samsung 4Q profits spike

01/15/2004  January 15, 2004 - Korea chipmaker Samsung Electronics Co. Ltd. reported record 4Q03 sales of $10.85 billion with a net income of $1.57 billion, short of analyst expectations but up 24% from a year ago.

Nanometrics, Ebara forge deal

01/15/2004  January 15, 2004 - Nanometrics Inc., Milpitas, CA, has signed a deal to supply integrated metrology units to Japan's Ebara Corp. for use with its CMP products.

SSMC to expand capacity

01/15/2004  January 15, 2004 - Singapore-based wafer manufacturer Systems on Silicon Manufacturing (SSMC), a government-sponsored JV between Philips Semiconductors and TSMC, plans to spend $250 million in 2004 to expand capacity of 200mm wafers to 33,000 per month, more than originally planned.

WaferGen launches with Delft's help

01/15/2004  A next-generation biotech instrument maker with ties to Delft University of Technology in the Netherlands has launched in the United States, according to a news release.

Nikon aims for EUVL in '04

01/14/2004  January 14, 2004 - Nikon Corp., Tokyo, Japan, plans to start full-scale production of extreme ultraviolet (EUV) lithography systems this year, with a planned launch in 2006 for use with 45nm and 32nm chips.

IBM, Chartered join for 90nm SOI

01/14/2004  January 14, 2004 - Singapore's Chartered Semiconductor Manufacturing has signed a deal to manufacture 90nm silicon-on-insulator products for IBM, East Fishkill, NY.

SUSS sells nano tool to Taiwanese R&D center

01/14/2004  SUSS MicroTec AG News, Web has sold a stepper system to a Taiwanese organization for nanoscale research and development, according to a news release.

IDC: Global chip sales driven by Asia-Pacific

01/13/2004  January 13, 2004 - A recent report from IDC predicts 18% growth in 2004 for the semiconductor industry, driven by double-digit growth in shipments of personal computers and mobile phones, and increasing contributions from the Asia-Pacific region.

Samsung boosts DRAM investment

01/13/2004  January 13, 2004 - Samsung Electronics Co. said it will spend $1 billion on a production line to boost its output of DRAM chips, part of an overall 2004 capex budget of $4.4 billion.

Ibis facing lawsuits

01/12/2004  January 9, 2004 - Three law firms have filed class-action suits against Ibis Technology Corp., Danvers, MA, and its president and CEO Martin Reid, concerning alleged misrepresentations about the company's SIMOX-SOI implantation business.

IPAC offers wafer-level chip scale packaging

01/09/2004  (January 9, 2004) San Jose, Calif.—Integrated Packaging Assembly Corporation (IPAC), an IC packaging foundry, has announced its intention to become a major supplier of wafer-level packaging (WLP). Their packaging services include thin film processing, wafer bumping, chip singulation and testing.

Nanotech develops faster with funding for education

01/09/2004  A new model for collaboration is one that involves industry more directly in education. State governments are competing to attract high-tech activities and this means building upon research universities. And industry is becoming more heavily involved at educational institutions. These are signs that the U.S. educational system is evolving to meet these new challenges.

TI boosts demand with supply deals

01/08/2004  January 8, 2004 - Texas Instruments has signed deals with South Korean firm DongbuAnam and Amkor Technology Inc. to increase production of its digital light processing (DLP) chips.

Wafer markets in 2H04: deja vu all over again?

01/07/2004  January 7, 2004 - Will history, along with an unexpected slowdown in silicon wafer demand, repeat itself in the second half of 2004? It could, based on a new analysis by Advanced Forecasting Corp.

Infineon places bets on flash market

01/07/2004  January 7, 2004 - Infineon Technologies, Munich, Germany, has entered the flash market with the introduction of a NAND-compatible 512Mbit flash chip based in its TwinFlash technology.

SIA: Chip sales on track for double-digit gains

01/06/2004  January 6, 2004 - Worldwide semiconductor sales continued to report solid gains in November 2003, posting growth for the ninth consecutive month and a solid double-digit increase from a year ago, according to data from the Semiconductor Industry Association (SIA).




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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