12/04/2003  November 17, 2003 - Immersion lithography could replace super-high NA 193nm lithography for 65nm and 45nm production, according to an executive in Canon USA Inc.'s semiconductor equipment division.

12/04/2003  November 21, 2003 - Wacker Siltronic says it will implement pay cuts at its Burghausen site in order to avoid layoffs announced last month.

12/04/2003  Global orders in September of Japanese semiconductor equipment continued to display solid gains, soaring above 100 billion yen for the second consecutive month at levels not seen since January 2001, according to the latest figures from the Semiconductor Equipment Association of Japan (SEAJ).

12/04/2003  Intel Corp. has presented results of its high-k/metal gate transistor development aimed at reducing current leakage as device dimensions shrink and transistor gate dielectrics become thinner.

12/04/2003  South Korea's semiconductor trade deficit was slashed by 93% in the third quarter thanks to rising DRAM ASPs and a general global IT recovery, according to industry sources.

12/04/2003  Worldwide semiconductor sales rose 6.5% in September to $14.4 billion, up 5.9% from $13.56 billion in August -- the seventh consecutive monthly increase and the biggest monthly percentage change in over a decade, according to data from the Semiconductor Industry Association (SIA).

12/04/2003  Molecular Imprints Inc., an Austin, Texas, developer of imprint lithography systems, has made an initial close on $15 million of an ongoing $30 million Series B funding round, according to a company spokeswoman.

12/03/2003  By combining pre-processed wafers from TSMC -- up to metal level 2 -- and then providing custom programming for as many as five metal levels, AMI Semiconductor says it can cut the cost of reticles to about one-quarter of the usual cost.

12/01/2003  When a new technology emerges, talk typically centers on more gigahertz, fewer micrometers or higher integration densities. In the background, however, a quiet revolution is taking place in the form of process technologies, manufacturing structures and new forms of collaboration between industry partners.

12/01/2003  A fabless semiconductor company using an outsourcing model relies on a foundry for wafer fabrication, a testing house for wafer sort and an assembly house for chip assembly. The multiple manufacturing processes involved make it difficult for the fabless company to isolate the cause of an assembly failure.

12/01/2003  E-mail, interactive Web sites and instant messaging have forever changed the way we communicate; and in turn, these pervasive media have changed the landscape of technical conference design forever.

11/25/2003  (November 25, 2003) Tokyo, Japan—Toshiba Corp. today announced a boost in its semiconductor business capital expenditure that will expand memory production at Oita Operations in Kyushu.

11/20/2003  NOV. 20--NORWALK, Conn.--According to a soon-to-be-released updated report from Business Communications Company, Inc. (www.bccresearch.com), nanomaterial-based devices using RGB-286 will make it to market first and can be fabricated using current chip manufacturing processes and integrated with CMOS technology.

11/18/2003  EV Group, an Austrian maker of MEMS and semiconductor wafer processing equipment, has been selected by DALSA Semiconductor to supply MEMS production equipment, according to a news release.

11/17/2003  (November 17, 2003) Marlborough, Mass.—Shipley Co. and Rodel will become Rohm and Haas Electronic Materials, effective February 1, 2004. Together, Shipley and Rodel comprise the more than $1 billion electronic materials business group of Rohm and Haas Co., which provides material solutions to the electronic and optoelectronic industries.

11/17/2003  FEI Co. makes charged particle beam systems – tools that help customers observe, analyze and manipulate materials at the submicron level. It's a perfect place to be as small tech enters the business world. FEI's products serve in R&D departments and production facilities in the semiconductor and data storage industry, and at universities and research labs.

11/13/2003  NOV. 13--PORTLAND, Ore.--A handheld device that can detect bio- and chemical agents in the event of a terrorist attack has received the thumbs-up from the National Science Foundation.

11/13/2003  November 5, 2003 - Canon USA's Semiconductor Equipment Division has received a 2002 Spotlight Award from AMD for its role in servicing and supporting AMD's lithography needs.

11/12/2003  (November 12, 2003) Berlin, Germany—Research conducted by an international team of micro- and nano- technology experts known as 'enablingMNT,' on MST/MEMS Equipment Manufacturers shows that in the area of MEMS packaging, Europe has a large number of suppliers, while the U.S. seems to handle larger volumes.

11/12/2003  Carbon nanotubes are a hundred times stronger than steel, right? That factoid has been reported so often that few realize that such superstrength is predicted by calculations, not by any direct measurement. Now, the National Institute of Standards and Technology is working on developing standards and road maps for nanoelectronics.