Semiconductors

SEMICONDUCTORS ARTICLES



ChipPAC, ASMC form strategic alliance in China

09/23/2002  Sept. 23, 2002 - Fremont, CA - ChipPAC Inc., a provider of semiconductor assembly and test services, and Advanced Semiconductor Manufacturing Corp. (ASMC), Shanghai, China, an analog and power wafer foundry company, have formed a new alliance to support customers in the analog and power markets.

Samsung Electronics invests US$5B to expand production facilities

09/20/2002  Sept. 20, 2002 - Seoul, Korea - Samsung Electronics plans to invest about 6 trillion won (US$5 billion) next year for expansion of manufacturing facilities.

Ionics acquires EnChem technology

09/20/2002  SEPT. 20--WATERTOWN, MA-- Ionics, Inc. has acquired the business and assets, including patents and know-how, of Microbar Inc.'s EnChem wastewater treatment process.

Toshiba to boost outsourcing of system chip production

09/19/2002  Sept. 19, 2002 - Tokyo, Japan - Toshiba Corp. plans to increase outsourcing of system chips to allow its domestic factories to focus on the production of high-value goods.

Samsung outlines nano strategy

09/17/2002  Samsung Electronics Co. said it plans to make extensive use of nanoscale technology in future chips and other new products, according to Asia Pulse.

Intel conducts research in integrated silicon

09/13/2002  Intel Corp., Santa Clara, CA, is using integrated silicon technologies in an attempt to drive the convergence of computing and communications over the next decade, enabling a digital future that makes electronic devices simpler, less expensive, and easier to use.

ATMI, Metara sign JD agreement

09/12/2002  Sept. 12, 2002 - Danbury, CT - ATMI Inc., a provider of specialty materials and services to the semiconductor industry, and Metara Inc., a supplier of automated metrology systems, have signed a joint development and manufacturing agreement.

IBM looks to nano self-assembly
for semiconductor industry future


09/12/2002  Nanotechnology and nanomaterials will be critical to solving the semiconductor industry’s formidable challenges, said John Kelly, IBM senior vice president and a keynote speaker at the Albany Symposium on Global Nanotechnology. Kelly said IBM is looking toward a future in which circuitry patterns are made through molecular self-assembly.

Intel unveils its nano inside
with new small tech initiatives


09/12/2002  Semiconductor giant Intel Corp. today revealed plans to apply nanotechnology and MEMS devices across a range of projects, including sensor networks and optical “building blocks” that will advance the integration of computing and communications.

AMD, UMC to collaborate on 300mm APC technology

09/09/2002  Sept. 9, 2002 - Taipei, Taiwan, and Sunnyvale, CA - AMD and UMC plan to jointly develop advanced process control (APC) technology for cost-effective, high-volume 300mm semiconductor manufacturing.

HP builds molecular memory
with unprecedented density


09/09/2002  Nanoscale computing took a significant step forward today with Hewlett Packard's announcement that it has fabricated a 64-bit array that switches molecules on and off inside a grid of nanowires only a square micron in size. The prototype circuit has 10 times the density of today's RAM memory chips. The first market for the technology would be flash memory for portable devices.

Submircon wafer plant a reality

09/06/2002  SEPT. 6--THAILAND--Submicron Technology's long-delayed wafer fabrication plant is finally set to become a reality, making Thailand the first country in the Association of South East Asian Nations (ASEAN) to produce wafers using .09-micron microelectronic technology.

MEMSIC takes on ADI with new accelerometer

09/06/2002  MEMSIC Inc., which makes CMOS-based MEMS accelerometers/sensors, is now offering an accelerometer with sensitivity compensation over temperature that is, according to the company, pin-for-pin compatible with Analog Devices' (ADI) 14-lead CERPAK, cutting costs up to 50 percent and shortening lead times

New technology to seal MEMS
could speed integration with chips


09/05/2002  MEMS devices need to be tightly sealed against contaminants. Yet packaging MEMS remains an expensive final step. For complex devices, packaging can run as high as 80 percent of the cost. Ziptronix Inc. hopes to seal its own success with a simple, low-cost process for hermetically encapsulating entire MEMS wafers inside a foundry's clean rooms.

Bulky mask data sets create storage problems

09/04/2002  As mask data sets become more complex and data-intensive, maskmakers face the challenge of how to manage large amounts of data that must be moved from design to mask.

Chartered offers SiGe BiCMOS technology

09/04/2002  Sept. 4, 2002 - Singapore - Chartered Semiconductor Manufacturing has penned a joint technology agreement with IMEC, a European independent R&D center for microelectronics, that will result in Chartered offering 0.18-micron silicon germanium (SiGe) BiCMOS manufacturing capabilities by 2H03.

Chartered to raise funds through rights issue

09/02/2002  Sept. 2, 2002 - Singapore - Chartered Semiconductor Manufacturing Ltd., the world's third largest chip foundry, announced an 8-for-10 rights issue today to raise US$633 million.

SEMICON West: Technology Advances During a Slow Recovery

09/01/2002  SAN JOSE, CALIF. In spite of continuing uncertainty in the semiconductor industry, there was a healthy level of excitement on the show floor at the back-end portion of SEMICON West in San Jose this year

Solder bump inspection

09/01/2002  Evaluating new flip chip designs




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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