08/30/2002  Company Working to Bring Together Top Chipmakers and Suppliers to Develop a Highly Scalable, Flexible Test Platform With an Expected Lifetime of 10+ Years

08/30/2002  SAN JOSE, Calif.- July 15, 2002-SUSS MicroTec today announced the MA300Plus, a full field proximity Mask Aligner addressing the growing demand for advanced packaging tools capable of processing wafers with diameters of up to 300 mm.

08/30/2002  New NanoTech(TM) Family Builds on Ultratech's Proven Technology Expertise to Provide Highly Flexible, Productive and Cost-Effective Steppers for Emerging Markets

08/30/2002  Fremont, CA, July 17, 2002 - ChipPAC, Inc. (Nasdaq: CHPC), one of the world's largest and most diversified providers of semiconductor assembly and test services, today announced that it has successfully engineered a high performance embedded processor module, named the i-Module, with 5 chips in the footprint of a standard Ball Grid Array (BGA) package.

08/30/2002  Manufacturing Execution Systems (MES) Interface and Implemented "Embedded" Capability Enables New Level of Equipment Control

08/30/2002  Cham/Switzerland, July 18, 2002 - ESEC, a leading provider of chip-assembly equipment and system solutions for the semiconductor industry, will be presenting a revolutionary technology based on a rotating bondhead, at the world's largest semiconductor trade fair, Semicon West, taking place on July 17-19, 2002, in San Jose, California/USA.

08/30/2002  CHANDLER, Ariz. and RESEARCH TRIANGLE PARK, N.C., July 18, 2002 -- Amkor Technology, Inc. (Nasdaq: AMKR) and Unitive, Inc. have expanded their two-year relationship by entering into a strategic manufacturing alliance to collaborate on turn-key manufacturing services using Unitive's wafer level packaging solutions and Amkor's advanced ackaging and test capabilities.

08/29/2002  Aug. 29, 2002 - Hsinchu, Taiwan - Taiwan Semiconductor Manufacturing Co. has signed a letter of intent with Shanghai's Songjiang district to build a production plant.

08/29/2002  New 3Di-7500 and 3Di-8500 Expand Product Offering

08/29/2002  Rapid, non-destructive analyzer ideal for materials used in bump bonding and flip chip assembly

08/29/2002  Willow Grove, PA, July 17, 2002 Kulicke & Soffa Substrate Division is expanding their product line with the development of the D²I², "Direct Die Interposer Interconnect" substrate. D²I²offers industry-leading electrical performance, improved wafer utilization, and is environmentally friendly.

08/28/2002  nPoint Inc., a Wisconsin-based provider of precision motion devices and controllers, has launched a new tool to its line of nanoscale motion and control products.

08/27/2002  Aug. 27, 2002 - Austin, TX, Eindhoven, Netherlands, and Geneva, Switzerland - Motorola, Philips, and STMicroelectronics have unveiled a 90nm CMOS design platform that allows designers to start next generation SoC product development for low-power, wireless, networking, consumer, and high-speed applications.

08/27/2002  While development of microelectromechanical systems (MEMS) has been going strong all over the world for at least a decade, Europe has been in the vanguard.

08/23/2002  AUG. 23--SINGAPORE--Former store supervisor Poh Too Ding, 39, had never stepped into a cleanroom at a wafer fab, but he still found the idea of working inside one for hours at a time "discomforting."

08/22/2002  Aug. 22, 2002 - Thousand Oaks, CA, and Taipei, Taiwan - Rockwell Scientific Co. LLC (RSC) and UMC have develoed the HAWAII-2RG, a readout IC (ROIC) designed by RSC and fabricated by UMC based on its mixed-mode CMOS process and precision stitching technique. The project was funded by the NASA Ames Research Center through a contract with the U. of Hawaii.

08/22/2002  The White House has signed off on a report detailing the full scope of the National Nanotechnology Initiative, which includes a heightened commitment to using nanotechnology to fight weapons of mass destruction. The report concludes that while the NNI has fundamental research as its focus, “its ancestral programs have already made enormous impact in commercial markets."

08/21/2002  Aug. 21, 2002 - San Jose, CA - Cypress Semiconductor Corp. and WaferYield, Inc. announced that Cypress has expanded its non-exclusive commercial license agreement to use WaferYield's WAMA technology.

08/19/2002  Aug. 19, 2002 - Taipei, Taiwan, and San Jose, CA - Cadence Design Systems Inc., a supplier of electronic design products and services, and UMC have unveiled a joint initiative to help customers facilitate the smooth transition to fabrication through physical design verification using Cadence's technology for nanometer designs.

08/19/2002  NanoInk, a mere seven months old, has released its first product: a software-and-supplies package that turns any atomic force microscope into a Dip-Pen Nanolithography machine that's targeted to research labs. Now comes the hard part – making a bunch of AFM pen tips work in an array large enough for manufacturing. The company promises an array product by early 2003.