Semiconductors

SEMICONDUCTORS ARTICLES



ARM, Synopsys, TSMC address need for proven SoC methodologies

05/28/2002  May 28, 2002 - Cambridge, England; Mountain View, CA; Hsinchu, Taiwan - ARM, Synopsys Inc., and Taiwan Semiconductor Manufacturing Co. (TSMC), have collaborated in generating a proven, fast track SoC integration methodology for use by ARM partners who use TSMC as a foundry.

Drought effecting Northern Taiwan

05/24/2002  May 28, 2002 -- Hsinchu, Taiwan-- In recent weeks, there have been numerous reports about the drought conditions in Taiwan and how it may affect chip makers this summer, fact is the hardest hit region is north of Taipei, according to Taiwan Semiconductor Manufacturing Corporation (TSMC).

Asyst signs definitive agreement to form JV with Shinko Electric Co. Ltd.

05/24/2002  May 24, 2002 - Fremont, CA - Asyst Technologies Inc., a provider of integrated automation solutions, has signed a definitive agreement related to its previously announced planned joint venture with Shinko Electric Co. Ltd. of Japan.

Conexant and The Carlyle Group name new fab, Jazz Semiconductor

05/22/2002  May 22, 2002--Newport Beach, CA & Washington, DC--Conexant Systems, Inc. and The Carlyle Group have named their new ISO-9000 certified wafer fab, Jazz Semiconductor. The new facility will have 100,000 square feet of ISO Class 3 cleanroom space.

Japan's chip industry to develop lithography tech with gov't backing

05/22/2002  Tokyo, Japan - Major Japanese semiconductor makers and makers of related equipment will join together to develop EUV technology with the support of the government, industry sources said.

DuPont Photomask looks to design automation to cut mask costs

05/21/2002  DuPont Photomask doesn't want to be just a maskmaker any more. Instead CEO Peter Kirlin's broader vision is to become a "microimaging solutions supplier." And it looks like it has taken a big step in that direction with its recent acquisition of design automation supplier BindKey Technologies.

No FIBbing, next-generation failure analysis hits bottom line

05/20/2002  As semiconductor manufacturers race against the industry roadmap, failure analysts have had to keep up their end of the design cycle/product cycle equation so the bottom line enablers - yield enhancement and advanced process development - proceed efficiently.

DRAM chipmaker Mosel Vitelic mulls buying Hynix assets

05/20/2002  Mosel Vitelic Inc., Taipei, Taiwan, said it is looking at the possibility of buying assets from Hynix Semiconductor Inc.

Fujitsu develops 8-stacked MCP

05/17/2002  Fujitsu Microelectronics has developed an ultra-high density, multi-chip package (MCP) that can support up to eight chips. This development was made possible by the company's advances in thin chip processing and multi-stacked package technology.

DuPont Photomasks, Infineon, AMD lay out ambitious photolith plans

05/16/2002  Dresden, Germany -- Infineon Technologies AG, Advanced Micro Devices Inc., and DuPont Photomasks Inc. plan to establish and operate a new advanced photomask facility in Dresden, with investments of around EUR 360 million over the next five years.

Hard evidence for the increasing importance of materials

05/16/2002  Despite the overall industry's worst year ever, sales remained relatively stable at a range of suppliers of enabling materials, as users kept buying photomasks, slurries, and compound semiconductor substrates even if they weren't equipping fabs. But the damage in the volume-dependent silicon wafer business was staggering.

UltraRF, Hitachi Kokusai to develop RF power amplifier modules

05/14/2002  May 14, 2002 - Sunnyvale, CA - UltraRF Inc., a wholly owned subsidiary of Cree Inc., has signed an agreement with Hitachi Kokusai Electric of Japan for the development of high power amplifier modules based on UltraRF's LDMOS-8 technology.

ASML expects to sell 140 To 180 litho systems in '02

05/10/2002  Dutch toolmaker ASML Holding NV expects to sell between 140 and 180 lithography systems in 2002, down from 197 systems last year, ASML spokesman Tom McGuire said Friday.

AMD to cut some 800 workers in Austin, TX

05/08/2002  May 8, 2002 - Sunnyvale, CA - Advanced Micro Devices Inc. (AMD) will tell nearly 800 chip manufacturing workers in Austin, TX, that they're losing their jobs, people familiar with the company said.

Biggest China opportunity may be for older equipment

05/07/2002  It may not be the big guys who benefit most from China's expanding semiconductor production. While the top tool companies focus on shipping the latest technology, smaller equipment makers and remarketers of used equipment may actually find a bigger market for their older generation products.

TSMC: Planned China fabs aimed at local market

05/07/2002  Hsinchu, Taiwan - Taiwan Semiconductor Manufacturing Co (TSMC) said its planned manufacturing facilities in China will be aimed at the growing mainland market and not exports.

Infineon, Nanya to cooperate on DRAM memory chips

05/02/2002  May 2, 2002 - Munich, Germany and Toayuen, Taiwan - Following successful cooperation talks, Infineon Technologies and Nanya Technology Corp. have signed a non-binding MoU for the two companies to cooperate on standard memory chips (DRAMs).

Chip sales reach $10.75B in March, overall industry outlook brighter

05/02/2002  May 2, 2002--San Jose, CA--Worldwide sales of semiconductors jumped to $10.75 billion for the month of March, which marks a whopping 7.2 percent increase above the $10.03 billion in sales logged during February. The hike is considered the highest monthly sequential increase since April 1986, according to the Semiconductor Industry Association (SIA.)

Multilink partners with Magma Design Automation

05/01/2002  May 1, 2002 - Somerset, NJ - Multilink Technology Corp. a provider of semiconductor-based solutions for accelerating the deployment of high-speed optical networks, is collaborating with Magma Design Automation Inc., a provider of chip design solutions, on the design of next generation very large scale integration (VLSI) products using CMOS technologies at 0.13-micron and below.

Wafer-level burn-in with test

05/01/2002  A key enabler for low-cost SoC and SiP




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts