01/09/2002  Jan. 9, 2002 - Santa Clara, CA - Intel Corp. has appointed 16 VPs. The newly appointed VPs are Craig Brown, Steven Grant, Nasser Grayeli, Ravi Jacob, Brian Krzanich, Jeffrey McCrea, Stuart Pann, Gregory Pearson, Prasad Rampalli, Keith Reese, Dianne Rudolph, Bruce Sewell, David Shannon, Anthony Sica, Stacy Smith, and Randy Wilhelm.

01/08/2002  Applied Materials recently introduced its decoupled plasma nitridation (DPN) chamber that incorporates a high concentration of nitrogen at the surface of an ultra-thin gate oxide, providing protection against leakage current and boron penetration. The process is single wafer.

01/08/2002  Jan. 8, 2002 - Woodbury, NY- Veeco Instruments Inc. and Photronics Inc. have formed a strategic relationship focused on accelerating the development of advanced manufacturing technologies required to fabricate enhanced reticle and next generation lithography mask technologies.

01/04/2002  Jan. 4, 2002 - Taipei, Taiwan - United Microelectronics Corp. (UMC) said it may delay the start of mass production at its plant in Singapore.

01/04/2002  Jan. 4, 2002 - Seoul, Korea - Lenders of Hynix Semiconductor Inc. are likely to insist on a major asset sale to Micron Technology.

01/03/2002  Toshiba Semiconductor's novel plan to rethink the fab to make small runs of systems chips without big capital investment may not be so far out after all.

01/02/2002  Jan. 2, 2002 - Salt Lake City, UT - Daw Technologies Inc., provider of ultra-clean manufacturing environments, has established a new subsidiary business unit, Daw Mexico, S. de R.L. de C.V. in Guadalajara, Mexico. The company has hired Jose de Jesus C?res G. to manage the new business unit.

01/01/2002  Today's artificially intelligent systems are fabricated using sub-micron scale devices in micro- and meso-scale packages, primarily using electronic signals and the logic of programming to interface to the macroscopic world

01/01/2002  Packaging and assembly still dominate the overall cost of any fiber optic devices,¹ largely because fiber optic alignment and attachment are difficult and time consuming

01/01/2002  Strip packaging and wafer-level packaging (WLP) are now making packaging and final test more like fab processing

01/01/2002  Modular/prefabricated cleanrooms isolate the process, whether it be manufacturing or laboratory related, from outside contamination. In addition to cleanliness, users can often control temperature and humidity, thereby ensuring the best possible results within the cleanroom.

12/27/2001  Dec. 27, 2001 - Armonk, NY - SEMX Corp. has signed a letter of intent to sell its domestic wafer reclaim operation, American Silicon Products, to an undisclosed party.

12/26/2001  Dec. 26, 2001 - The IEEE has announced two award recipients for 2002 - Herbert Kroemer of UCAL-Santa Barbara and Dr. Yoshio Nishi of Texas Instruments.

12/21/2001  December 21, 2001 -- SINGAPORE -- Chartered Semiconductor Manufacturing is buying into Semiconductor Manufacturing International Corp.

12/21/2001  Dec.21, 2001 - Milpitas, CA - Chartered Semiconductor Manufacturing and Semiconductor Manufacturing International Corporation (SMIC) have entered into an alliance. Upon execution of the detailed agreements, Chartered will transfer its 0.18-micron baseline logic process technology and grant patent license rights to SMIC in exchange for an equity stake and access to capacity.

12/21/2001  Dec. 21, 2001 - Hsinchu, Taiwan - Taiwan Semiconductor Manufacturing Company (TSMC) has appointed Dick Thurston VP and general counsel, effective January 2002.

12/20/2001  Dec. 20, 2001 - Livingston, Scotland - NEC Corp. will suspend operations of its semiconductor manufacturing facility, NEC Semiconductors (UK) Ltd. (NECSUK), located in Livingston, Scotland, beginning in April 2002.

12/20/2001  Dec. 20, 2001 - Taipei, Taiwan - Winbond Electronics Corp. is set to sell its five-inch wafer production lines to Asia Pacific MEMS System Corp. for NT$500 million (US$14.70 million).

12/20/2001  Dec. 20, 2001 - Burnaby, British Columbia - PMC-Sierra, a provider of broadband semiconductors, and Taiwan Semiconductor Manufacturing Company (TSMC) will collaborate on developing SoC products using 0.13-micron technologies.

12/19/2001  Dec. 19, 2001 - San Francisco,CA - Micron Technology will buy Toshiba Corp.'s U.S. commodity memory-chip business, which is good for both the No. 2 memory chipmaker and the industry, potentially putting Micron in the cat-bird seat as the memory chip market ripens for consolidation, according to analysts.