Semiconductors

SEMICONDUCTORS ARTICLES



Vanguard to drop DRAM production in 2002

12/06/2001  Dec. 6, 2001 - Taipei, Taiwan - In order to accelerate the development as a wafer foundry service provider, Vanguard International Semiconductor Corp. will drop the manufacturing of its DRAM chips in 2002, executives of the firm said.

Hynix prefers cash injection from Micron

12/06/2001  Dec. 6, 2001 - Seoul, South Korea - Hynix Semiconductor Inc. said it wants US chipmaker Micron Technology Inc. to inject cash into the company under a proposed alliance aimed at easing the global glut of computer memory chips.

ASML Opens Technology Training Center in Japan

12/05/2001  December 5, 2001 -- TOKYO -- ASML recently announced the creation of a new Asian training center based in Kawasaki, Japan. The facility will provide a variety of training courses in advanced lithography, wafer track and thermal processing technology, with a particular focus on 300mm equipment.

Delayed reaction: Some big Japanese toolmakers still see strong Q3 sales

12/05/2001  Despite all the gloom and doom coming from Japan's struggling chipmakers lately, a few of the country's equipment suppliers continue to do surprisingly well.

Electroglas named newest member of SECAP consortium

12/05/2001  Dec. 5, 2001 - San Jose, CA - Electroglas, a supplier of test and inspection equipment, has joined the Semiconductor Equipment Consortium for Advanced Packaging (SECAP).

ASML announces first technology training center in Japan

12/05/2001  Dec. 5, 2001 - Tokyo, Japan - On the opening day of SEMICON Japan 2001, ASML announced the creation of a new Asian training center based in Kawasaki, Japan.

International SEMATECH Takes Delivery of SEZ Spin-Processor for 300 mm R&D

12/04/2001  December 4, 2001 -- VILLACH, Austria -- International SEMATECH (ISMT) will take delivery of the 1300 SEZ Spin-Process tool for its 300 mm silicon wafer research and development, according to the SEZ Group. Based on previous success using SEZ tools for other frontside and backside applications, ISMT plans to use this tool to develop process modules for double-sided pre-oxidation and pre-gate cleanings.

Applied Materials acquires Global Knowledge Services

12/04/2001  Dec. 4, 2001 - Santa Clara, CA - Applied Materials has acquired all of the outstanding equity of Global Knowledge Services (GKS) Inc., a privately-held company based in Austin, TX, that provides advanced data mining services to improve semiconductor manufacturing yield and efficiency.

TEEN INVENTORS EARN SCHOLARSHIP
BY MAKING MEMS DEVICES RUN BETTER


12/04/2001 
For the MEMS industry, friction is a key problem. It's one of the main impediments to successfully making some micromachined gears and moving parts. But on Monday, two teens from New York state turned that sticky problem into a successful science fair project, winning a $100,000 scholarship in the Siemens Westinghouse Science and Technology Competition.

Fujitsu doesn't expect major earnings impact from plant closure

12/03/2001  Dec. 3, 2001 - Tokyo, Japan - Fujitsu Ltd. does not expect a major impact on its earnings forecast in FY01 from the closure of its flash memory production plant in the US, as it has already allocated a special loss for large-scale restructuring for the year, a company spokesman said.

VENTURE CAPITALISTS: NANOSCIENCE
SHOULD GET DOWN TO NANOBUSINESS


12/03/2001 
Investors have stern words for nanotechnology researchers itching to cash in on their small tech ideas: It's all about the business. While they're confident that nanotechnology will lure its share of investment dollars, speakers at a recent Nanotech Planet conference warned that concrete problems of sales, marketing and manufacturing still loom.

Semicon Southwest: Something old, something new

12/01/2001  AUSTIN, TX—The story from October's Semicon Southwest trade show and conference was no different from most shows that took place over the past two months.

Intel packaging technology aims to enable 20-GHz processors by 2006

12/01/2001  Intel Corp. recently announced that it has demonstrated a new packaging technology that could enable the development of 20-GHz microprocessors by 2006 or 2007

Silver lining

12/01/2001  One of the clichés that you hear during slow times in the electronics industry is that a lull gives manufacturers the chance to develop new products rather than focusing on getting more of the same old products out the door

Getting on the same page

12/01/2001  No one ever thought writing a set of global standards for cleanrooms or controlled environments would be easy or fast. In fact, as we stand on the brink of 2002, it has been more than eight years since contamination-control professionals from varied industries and from around the world first convened to draw up ISO standards 14644 and 14698. And it could still be another six months or more until the last of the 10 separate standards are released.

Design, balance and certify a successful minienvironement integration design

12/01/2001  Before entering into the critical minienvironement integration strategies, let's first take a look at the basics.

Lithography for advanced packaging

12/01/2001  Solutions for wafer edge processing

AMCs: Properties and gaining control

12/01/2001  Airborne molecular contaminants (AMCs) are non-particulate contaminants that easily penetrate conventional HEPA and ULPA filters. Like particles, AMCs consist of molecules, or clusters of molecules.

Guidelines for selecting an optical particle counter (OPC)

12/01/2001  Selecting an optical particle counter (OPC) can appear deceptively simple. Typically, the specification focuses on sensitivity, flow rate, size range and coincidence loss. Secondary requirements are number of channels, the sample/hold periods and alarm limits.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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