11/05/2001 

11/02/2001  November 2, 2001 - San Diego, CA - JMAR Technologies Inc. a provider of precision micro- and nanotechnology products, said its JMAR-SAL NanoLithography Inc. (JSAL) division, Burlington, VT, has been awarded US patent number 6,295,332, titled Method for Improving X-ray Lithography in the Sub-100nm Range to Create High Quality Semiconductor Devices.

11/02/2001  November 2, 2001 - Chandler, AZ - SpeedFam-IPEC Inc. has announced cost-cutting measures that include decreases in discretionary spending and a reduction in worldwide headcount by 20%, or approximately 160 employees, as part of its continued commitment to reducing operating costs.

11/01/2001  November 1, 2001 - San Jose, CA - Implant Center Inc. (IC) and Ion Implant Services Inc. (IIS), two providers of ion implantation services, have joined forces and have adopted a new name for the combined operation, INNOViON Corp.

11/01/2001  Belgium's independent R&D center IMEC has begun research to develop technology that will give the industry integrated wafer-level packaging on copper low-k IC interconnect, to be done in wafer processing's back end of the line (BEOL).

11/01/2001  November 1, 2001 - Taipei, Taiwan - The board of Winbond Electronics Corp. yesterday decided to revamp its business strategies and restructure to cope with the economic slowdown.

11/01/2001  November 1, 2001 - Round Rock, TX - DuPont Photomasks Inc. founder Kenneth Rygler is resigning to pursue personal and other interests. Rygler, exec. VP of worldwide marketing and strategic planning at DuPont, will serve as a consultant to the company.

11/01/2001  Die separation of thin silicon wafers and delicate III-V substrates creates challenges for traditional saw dicing

11/01/2001  Toshiba America Electronic Components Inc. has expanded its lineup of medium-power packaging solutions to include US-Flat, S-Flat, M-Flat, thin flat package (TFP) and VS-6 devices

11/01/2001  Providing high density and performance for chip-to-system interconnection

11/01/2001  According to the September 2001 update to IC Insight's (Scottsdale, AZ) McClean Report, the integrated circuit (IC) recovery of 2001 (Fig. 2) will most certainly mirror that "canoe" shape, or rolling bottom...

10/31/2001  October 31, 2001 - Santa Clara, CA - Applied Materials has been granted patents no. 6,287,990 and 6,303,523 by the US Patent & Trademark Office covering advanced low-k dielectric chemical vapor deposition (CVD) film technology used to increase the speed and performance of next-generation chips.

10/30/2001  October 30, 2001 - Taiwan - Taiwan Semiconductor Manufacturing Co Ltd. (TSMC), has invested T$7.7 billion in R&D of the 0.13-micron manufacturing process for 300mm chipsets in the first three quarters of 2001.

10/30/2001  October 30, 2001 - Santa Clara, CA - Applied Materials Inc. and PDF Solutions have announced a collaboration to provide comprehensive yield improvement solutions to semiconductor manufacturers. The program combines Applied Materials' inspection and methodical defect reduction technology with PDF Solutions' process-design characterization methodologies.

10/30/2001  October 30, 2001 - Austin, TX - domainLogix Corporation, Advanced Micro Devices, ILS Technology, and Oceana Sensor Technologies will develop a set of security reference models to be used as a basis for research within the semiconductor manufacturing and tool supplier industries.

10/29/2001  The annual CMP Users' Group symposium (Northern California chapter of the American Vacuum Society) held recently in San Jose was rich with new technologies and industry progress. Although the CMP market projections presented by Tom Tucker of Laredo Technologies were grim - second half revenues are expected to be down 50% from 1H01 - he did highlight several technologies that will come to the fore as the industry scrambles to innovate its way out of the downturn.

10/29/2001  October 29, 2001 - Tainan, Taiwan - Taiwan Semiconductor Manufacturing Co. (TSMC) has announced a new NT$700 billion (US$20 billion) expansion plan, which includes six new 300mm fabs in Taiwan.

10/26/2001  October 26, 2001 - Taipei, Taiwan - Chipmakers including Intel and Taiwan Semiconductor Manufacturing Co. (TSMC) plan to retool portions of their 200mm wafer fabs into 300mm wafer facilities to sharpen their competitive edge, according to Financial Times.

10/26/2001  Sterling Semiconductor Inc., a subsidiary of Uniroyal Technology Corp., will begin customer sampling of its new 3-inch diameter silicon carbide (SiC) substrate.

10/25/2001  October 25, 2001 - Tokyo, Japan - Japanese electronics conglomerate Fujitsu Ltd. said it slipped deep into the red in the first half of its business year and cut 4,500 jobs as it struggles with a severe info-tech slump.