10/03/2017  Rutgers-led discovery could spawn a wave of new electronic devices.

10/03/2017  There has been a great deal of speculation around the composition of Intel’s Optane XPoint memory technology. TechInsights set about to find answers.

10/03/2017  Today, SEMI announced the lineup of keynotes coming to SEMICON Japan's "SuperTHEATER" -- focusing on the future of the electronics manufacturing supply chain.

10/03/2017  COMET Group today announced the opening of Lab One, its customer-centric technology and application center in San Jose, CA.

10/02/2017  Japan chip industry finds growth opportunities in robotics; explored at SEMICON Japan (December 13-15) in Tokyo.

10/02/2017  The SEMI International Standards Committee, at their SEMICON West 2017 meeting, approved the transformation of the existing 3D Stacked IC Committee and Assembly & Packaging Committee into a single, unified 3D Packaging and Integration Committee.

10/02/2017  Graphene is a sheet of carbon one atom thick, and it has drawn worldwide attention as a new material. A Japanese research group discovered that pressure is generated by simply stacking graphene oxide nanosheets. They also found that the pressure can be increased by reducing the interlayer distance through heat treatment. It is an innovative approach for applying high pressure without using an enormous amount of energy.

10/02/2017  Quantum dots are nanometre-sized semiconductor particles with potential applications in solar cells and electronics. Scientists from the University of Groningen and their colleagues from ETH Zürich have now discovered how to increase the efficiency of charge conductivity in lead-sulphur quantum dots.

09/29/2017  The Semiconductor Industry Association (SIA) released the following statement today from SIA president & CEO John Neuffer in support of the corporate tax reform framework released today by leaders in the Trump Administration and Congress.

09/29/2017  EPFL scientists have now greatly improved the operational stability of PSCs, retaining more than 95% of their initial efficiencies of over 20 % under full sunlight illumination at 60oC for more than 1000 hours.

09/28/2017  OEM Group announced today a post-dice clean solution on the proven Cintillio Batch Spray platform following plasma and laser dicing methods.

09/28/2017  SK Hynix Inc. announced its board of directors yesterday approved its plan to participate in a Bain Capital-led consortium that plans to purchase Toshiba Corporation's memory chip unit, Toshiba Memory Corporation

09/28/2017  The patent, the first ever for a thin III-V layer on crystalline silicon thin-film, covers group III-V elements such as Gallium Arsenide (GaAs), and Indium Gallium Phosphide (InGaP), for the top layer, as well as all inorganic materials, including, silicon, germanium, etc., for the bottom layer.

09/28/2017  Silicon Mobility announced today the opening of an office in Burlingame, CA. The office is located close to San Francisco international airport at the gate entry of the Silicon Valley.

09/28/2017  UCSB engineers create atomically thin superlattice materials with precision.

09/27/2017  Reno Sub-Systems today announced it has closed its Series C funding.

09/27/2017  Inventory corrections, economic uncertainty, and price erosion derailed the power transistor market in the last five years, but the 2017 O-S-D Report sees steady modest growth ahead.

09/26/2017  SiFive today announced it has joined the TSMC IP Alliance Program, part of the TSMC Open Innovation Platform, which accelerates innovation in the semiconductor design community.

09/26/2017  Researchers from Finland and Taiwan have discovered how graphene, a single-atom-thin layer of carbon, can be forged into three-dimensional objects by using laser light. A striking illustration was provided when the researchers fabricated a pyramid with a height of 60nm, which is about 200 times larger than the thickness of a graphene sheet.

09/26/2017  Understanding the impact of valve flow coefficient (Cv) in fluid systems for microelectronics manufacturing.