Semiconductors

SEMICONDUCTORS ARTICLES



Tokyo Seimitsu rejects patent claim, files antitrust counterclaim against KLA-Tencor

09/27/2001  September 27, 2001 - Oakland, CA - Today, Tokyo Seimitsu Co., Ltd. has filed its answer in response to KLA-Tencor's patent infringement suit. The answer denies all charges of patent infringement and alleges KLA's U S Patent No. 4,805,123 is invalid and unenforceable.

AMD to eliminate 2,300 jobs, close two TX facilities

09/26/2001  September 26, 2001 - Sunnyvale, CA - Advanced Micro Devices is closing two plants and laying off 2,300 employees, or nearly 15% of its work force, as the chipmaker accelerates cost-cutting moves amid slowing sales of its microprocessors.

PSi Technologies signs agreement with Advanced Power Technology

09/26/2001  September 26, 2001 - Manila, Philippines - PSi Technologies Holdings Inc., an independent provider of power semiconductor assembly and test services, has signed of a long term assembly and test service agreement with Advanced Power Technology Inc., (APT) a designer, manufacturer and marketer of high-power, high-frequency power semiconductors.

STMicroelectronics releases powerFLAT package for power ICs and MOSFETs

09/21/2001  September 21, 2001 - Geneva, Switzerland - STMicroelectronics has introduced its latest generation of chip-scale package for power integrated circuits as well as six N-channel MOSFETs that take advantage of the new package to slash size and weight while boosting thermal and electrical performance.

PRI Automation to continue support of Compaq's future Itanium-based openVMS platform

09/21/2001  September 21, 2001 - Billerica, MA - PRI Automation, Inc. (PRI), will continue its use of Compaq Computer Corporation's OpenVMS platform.

Intel boosts China investment despite global slowdown

09/21/2001  September 21, 2001 - Shanghai - Intel Corp said it is spending $302 million to expand its chip assembly and testing plant in China, even as the global economy may be teetering on the brink of recession.

IBM to sell Japanese electronic parts plant to SCI

09/18/2001  September 18, 2001 - Armonk, NY - IBM Corp. is in the final stages of negotiations with SCI Systems Inc., a US electronics manufacturing services (EMS) firm, to sell its Japanese unit's electronic parts factory, sources close to the matter said.

Analog Technology broken into 2 business divisions

09/17/2001  September 17, 2001 - Taipei, Taiwan - Analog Technology Inc., a manufacturer of various ICs, has split into two business divisions, one for IC products and the other for providing wafer foundry services, beginning this month.

Aset to work on low cost, low throughput tools

09/13/2001  A wafer fab built with current equipment has to have capacity of 20,000 wafers or so a month to be economical. New minifabs would run only 5,000 wafers per month, with smaller, lower throughput equipment, but the key is reducing tool costs proportionally as well.

Asyst and TSMC team 300mm automation solution

09/11/2001  September 11, 2001 - Fremont, CA - Asyst Technologies Inc. is collaborating with Taiwan Semiconductor Manufacturing Co. (TSMC) on a strategic 300mm fab-transport development project.

Extraction Wins Multiple Advanced Filtration Orders for 300mm Fabs

09/06/2001  September 6, 2001 -- FRANKLIN, MA -- Extraction Systems recently announced the sale of multiple Extraction 3000 filter systems for 300mm semiconductor fabs in the U.S., Taiwan and Europe.

Intel Plans New 300 mm Wafer Fab Plant

09/06/2001  September 6, 2001 -- HOUSTON, CO -- Despite the current high-tech downturn, Intel plans to break ground in October on a new one million square foot 300 mm wafer fab plant in Hillsboro, Oregon.

SEZ opens new service center to support growing German client base

09/05/2001  September 5, 2001 - Villach, Austria - The SEZ Group has opened its newest service and support center in Dresden, Germany. The location is of strategic importance for SEZ because it will be the primary source of support for the company's installed tool base in the growing high-tech community in the Dresden area (Silicon Saxony).

KLA-Tencor to Buy QC Optics

09/04/2001  September 4, 2001 -- WILMINGTON, MA -- San Jose-based KLA-Tencor plans to buy defect detection system manufacturer QC Optics.

Japan slams on the brakes with worse than expected Q2 results

09/04/2001  Worse than expected second quarter results have spurred more cutbacks in capital spending at Japan's big chipmakers, as companies look for ways to curb losses without laying off workers.

Lam Research to lay off 10% of employees

09/04/2001  September 3, 2001 - Fremont, CA - Lam Research Corp. is reducing its work force, which will impact approximately 10% of its employees around the globe.

NEC launches 32-Bit RISC single-chip microcontroller

08/31/2001  August 31, 2001 - Santa Clara, CA - NEC Electronics Inc. announced its V850ES/SA2 and SA3 microcontrollers. These new devices are the first to use the V850ES core and are optimized for low-power, battery-operated portable and handheld applications such as two-way radios and audio players, according to NEC.

New Japanese government research project to make its own tools

08/30/2001  Japan's latest government-funded industry research initiative for 50nm generation technology plans to start by designing and developing its own new semiconductor production tools. Japanese press reports said Intel researchers would also participate, but Intel sources could not confirm this before press time.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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