09/26/2017  Last year was a great year for photovoltaic (PV) technology.

09/25/2017  Cypress Semiconductor Corp. today announced the appointment of Jeffrey J. Owens to its board of directors.

09/25/2017  A new system combines acoustic, optical and reflectometric techniques to enable measurement of metals, dielectrics, resists and critical dimensions on a single platform.

09/25/2017  Synopsys, Inc. today announced that the Synopsys Design Platform has been fully certified for use on Samsung Foundry's 28FDS (FD-SOI) process technology.

09/25/2017  Applications now include nanoscale Spintronics sensors that further enhance the areal density of hard disk drives, through MRAMs that are seriously being considered to replace embedded flash, static random access memories (SRAM) and at a later stage dynamic random access memories (DRAM).

09/22/2017  DSA and EUV should be envisioned as complementary, not competing, techniques that will eventually become mainstream for fine-pitch lithography.

09/22/2017  The basics of laser marking are reviewed, as well as current and emerging laser technologies.

09/22/2017  Applied Materials, Inc. will explore the future of computing in the era of artificial intelligence (A.I.) at its 2017 Analyst Day on Wednesday, September 27 in New York.

09/22/2017  Equipment billings in August declined relative to July, signaling a pause in this year's extraordinary growth.

09/21/2017  GF worked closely with Synopsys to complete the rigorous certification process of the Synopsys Design Platform on our 22FDX process platform.

09/21/2017  A study led by UChicago researchers describes an innovative method to make stacks of semiconductors just a few atoms thick. The technique offers scientists and engineers a simple, cost-effective method to make thin, uniform layers of these materials, which could expand capabilities for devices from solar cells to cell phones.

09/21/2017  2-D semiconductor gallium selenide in encapsulated nanoelectronic devices.

09/20/2017  New programs on Materials, Automotive, and Flexible Electronics expand SEMICON Europa's impact.

09/20/2017  Sales of ICs built using <40nm process technology forecast to rise 18% at pure-play foundries.

09/19/2017  GLOBALFOUNDRIES and Soitec today announced that they have entered into a five-year agreement to ensure the volume supply of state-of-the-art fully depleted silicon-on-insulator (FD-SOI) wafers.

09/19/2017  Semiconductor Research Corporation (SRC), today announced that Samsung Electronics Company Ltd. (Samsung), one of the world's largest chipmakers, has signed an agreement to join SRC's research consortium. Samsung will participate in two SRC platforms – the New Science Team (NST) project and the Global Research Collaboration (GRC) program.

09/18/2017  Cadence Design Systems, Inc. today announced that it has received three TSMC Partner of the Year awards at this year's TSMC Open Innovation Platform (OIP) Ecosystem Forum.

09/18/2017  Intel Corporation today announced that Andrew Wilson, CEO of Electronic Arts Inc., has been elected to Intel's board of directors. Wilson's election brings Intel's board membership to 12.

09/18/2017  GLOBALFOUNDRIES today announced the availability of a new set of enhanced RF SOI process design kits (PDKs) to help designers improve their designs of RF switches and deliver differentiated RF front-end solutions for a wide range of markets including front-end modules for mobile devices, mmWave, 5G and other high-frequency applications.

09/18/2017  IBS researchers produced the first 2D field-effect transistor (FET) made of a single material.