11/08/2000  Ithaca, New York--Nov. 8, 2000--With support from major industrial partners, Cornell University has opened a state-of-the-art laboratory for the design and testing of radio-frequency (RF) integrated circuits (ICs), such as the transceivers in cellular phones and other wireless devices.

11/08/2000  Sarasota, Florida--Nov. 8, 2000--Sterling Semiconductor, Inc., a subsidiary of Uniroyal Technology Corp., is installing additional silicon carbide (SiC) production equipment to increase its SiC wafer production by a factor of 10 in 2001.

11/08/2000  Hsinchu, Taiwan--Nov. 8, 2000--Taiwan Semiconductor Manufacturing Co. Ltd.'s (TSMC) board of directors has approved the acquisition of Camas, Wahington-based WaferTech, LLC's shares from the company's current stakeholders in a move that will increase TSMC's stake in the company from 66.89% to 99%.

11/07/2000  Veldhoven, The Netherlands--Nov. 7, 2000--ASML Lithography has developed a new 193nm Step & Scan lithography tool for high-volume production of semiconductor devices at the 100nm technology node.

11/07/2000  Puchon, South Korea--Nov. 7, 2000--Fairchild Semiconductor International has opened a wafer fab in Puchon, South Korea, to manufacture power semiconductors.

11/07/2000  East Fishkill, New York--Nov. 7, 2000--IBM Microelectronics and Scotland-based Kymata Ltd. have teamed up in a multi-year agreement to produce next-generation optical networking chips for high-speed e-business applications. As part of this agreement, IBM has acquired a minority equity stake in Kymata.

11/07/2000  Richmond, California--Nov. 7, 2000--Berkeley Process Control, Inc., a designer, manufacturer, and marketer of motion and control solutions, recently received a U.S. patent for its autocalibration technology.

11/06/2000  Research Triangle Park, North Carolina--Nov. 6, 2000--Kyma Technologies, a developer and supplier of nitride substrates, has developed a 2-inch-diameter, 50-micron-thick epitaxial gallium nitride (GaN) layer on a sapphire wafer, to be used as the core technology for a variety of applications within the semiconductor, optoelectronic, and communications industries.

11/02/2000  San Jose, California--Nov. 2, 2000--The worldwide semiconductor industry is on target this year to exceed the $200 billion mark for the first time, and could reach $319 billion by 2003, reported the Semiconductor Industry Association (SIA) in its annual forecast on Nov. 1.

11/02/2000  Tokyo, Japan--Nov. 2, 2000--Sharp Corp. and Nippon Foundry Inc. (NFI), a UMC Group foundry company, have signed a long-term foundry agreement to meet Sharp's fast-rising demand for flash memory and other advanced semiconductor devices required for cellular telephones and other digital equipment.

11/01/2000  Mountain View, California--Nov. 1, 2000--Samsung Electronics Co., Ltd. has signed a patent license agreement with Rambus Inc. for SDRAM, double data rate (DDR) SDRAM memory and controllers that directly interface with these types of memory.

11/01/2000  Somerville, New Jersey--Nov. 1, 2000--AZ Electronic Materials, a business of the Clariant Corp., has licensed polymer platforms from both Fujitsu and Hyundai for its 193-nm photoresists. By leveraging these two polymer platforms, AZ plans to provide solutions for the first critical photoresist layers migrating to 193-nm technology.

11/01/2000  I can't help but be amazed by the investment community's growing interest in semiconductor packaging. I would have thought that the packaging industry as a whole significantly lacks in glamour when compared to the high-flying (and fast-crashing) dot coms, and software, biomedical and pharmaceutical companies

11/01/2000  PHOENIX - In SRC's Copper IC Design Challenge, a national technology contest for university students that encourages exploration of the possibilities of copper in leading-edge IC manufacturing

11/01/2000  New Tripoli, Pennsylvania--Nov. 1, 2000--Worldwide revenues for semiconductor processing equipment will rise 76.1% in 2000 and continue rising an additional 45.9% in 2001, according to

10/31/2000  Westlake Village, California--Oct. 31, 2000--Diodes Inc., a manufacturer and supplier of high quality discrete semiconductors, has signed a letter of intent to acquire Missouri-based Fabtech Inc. The deal includes a 5-inch wafer foundry that specializes in Schottky products, and a 16,000 sq. ft. cleanroom within a 70,000 sq. ft. manufacturing facility formerly owned by AT&T.

10/30/2000  Research Triangle Park, North Carolina--Oct. 30, 2000--Ziptronix, Inc., a spin-off company of Research Triangle Institute (RTI), has raised $6.5 million in its first round of venture capital financing to launch a new technology that integrates semiconductors of many types, materials, and functions within existing semiconductor wafer fabrication processes.

10/27/2000  San Jose, California--Oct. 27, 2000--Novellus Systems, Inc., a leader in thin film deposition technology for the semiconductor industry, is acquiring Gasonics International Corp., a supplier of dry resist removal and surface preparation equipment for semiconductor manufacturers.

10/26/2000  Milpitas, California--Oct. 26, 2000--A definitive agreement has been signed by Xicor, Inc. to sell its Milpitas 6-inch wafer fab assets and inventory to Standard MEMS for approximately $12.5 million. Under a related agreement, Standard MEMS will become Xicor's fourth foundry.

10/23/2000  Egham, U.K--Oct. 23, 2000--The worldwide semiconductor intellectual property (IP) market, one of the fastest growing segments in the semiconductor industry, should reach $2.94 billion by 2004, forecasts Dataquest Inc., a unit of Gartner Group. Worldwide semiconductor IP revenue in 2000 is projected to peak at $620 million.