Semiconductors

SEMICONDUCTORS ARTICLES



Sony To Build 300 MM Facility in Japan

08/31/2000  TOKYO -- August 31, 2000 -- Japan's electronics giant Sony Corp. said it will spend $943 million over the next five years building its first 300-mm wafer fabrication facility.

Motorola Chooses IPC Solution to Improve Oxide CMP Processes

08/29/2000  REHOVOTH, Israel?Aug. 29, 2000?In an effort to improve its wafer manufacturing efficiency, Motorola has placed multiple orders for Nova Measuring Instrument's NovaScan Integrated Thickness Monitoring (ITM) systems.

Chartered and Ricoh Extend Pact

08/25/2000  SINGAPORE--Aug. 24, 2000--Chartered Semiconductor Manufacturing and Ricoh Company, Ltd. have announced an extension of their current manufacturing relationship.

SmartLynx Links Analog and Mixed Signal Chip Design Tools

08/25/2000  LONDONDERRY, N.H.--Aug. 25, 2000--SmartLynx Inc. announced new integration solutions that the company said provide bi-directional, intelligent data transfer for EDA tools.

Ametek Debuts Oxygen Analyzer for RTP

08/24/2000  PAOLI, Penn.--Aug. 24, 2000--Ametek, Inc. has developed an oxygen analyzer for rapid thermal processing silicon wafer fabrication systems.

Anadigics Adds Microlithography Equipment

08/23/2000  MINNEAPOLIS, Minn.--Aug. 23, 2000--FSI International announced that Anadigics Inc. has placed an order for an FSI microlithography system for use used to manufacture 6-inch GaAs wafers.

Dialog, Chartered Ink Three-Year Manufacturing Agreement

08/23/2000  STUTTGART, Germany and SINGAPORE--Aug. 23, 2000--A three-year manufacturing agreement potentially worth $250 million has been signed by Dialog Semiconductor and Chartered Semiconductor Manufacturing.

TSMC Orders Web Content Management, Implanters

08/22/2000  TAINAN, Taiwan--Aug. 22, 2000--Taiwan Semiconductor Manufacturing Company (TSMC), said they have selected Interwoven TeamSite/BroadVision Edition as their Web content management solution. In addition, the chip giant has ordered 300-mm high- and medium-current implanters from Varian Semiconductor Equipment Associates.

Tower Semiconductor Inks Pact with M+W Zander AG for New Fab

08/22/2000  MIGDAL HAEMEK, Israel--Aug. 22, 2000--Pending government approval, Tower Semiconductor Ltd. will embark on the construction of a new wafer fabrication plant valued at over $200 million.

China Approves Motorola's Semiconductor, Telecommunication Manufacturing Plans

08/21/2000  BEIJING, China and AUSTIN, Texas--Aug. 21, 2000--After months of waiting and a premature announcement in July, Motorola has finally received approval for its planned 16B RMB (US$1.9 billion) investment in new semiconductor manufacturing and telecommunications facilities.

Research Firm Warns of Slowdown

08/21/2000  CUPERTINO, Calif.--Aug. 21, 2000--While semiconductor sales post record high numbers and bookings of semiconductor manufacturing equipment are at robust levels, a slowdown could be right around the corner, warns Advanced Forecasting, Inc. (AFI), a research firm for the semiconductor and related industries.

Series of RF Transistors Targeted at Wireless, Mobile Applications

08/18/2000  GENEVA, Switzerland--Aug. 18, 2000--STMicroelectronics announced today a series of 10 RF power transistors targeted at wireless base station and mobile radio applications.

SEMATECH to Evaluate Metrology Tools

08/18/2000  AUSTIN, Texas--Aug. 18, 2000--Research consortium International SEMATECH today announced the launch of a Metrology/Yield Management Tool Initiative to develop and evaluate new measurement technologies for advanced semiconductor manufacturing processes.

MOSFET for High-Voltage, High-Density Handheld Applications Announced

08/17/2000  SANTA ANNA, Calif.--Aug. 17, 2000--Designers of handheld devices such as power tools may benefit from a new low-current, 500-V MOSFET from Microsemi Corp. that allows users to boost the voltage of their designs within the smallest possible board space.

CMOS Manufacturers Jump on the Bluetooth Bandwagon

08/17/2000  TOKYO, Japan--Aug. 17, 2000--Oki Electric Industry Co. Ltd. and ST Assembly Test Services announced they have jointly developed a CMOS RF device with Bluetooth specifications.

Synopsys, TSMC to Develop Test Chips

08/17/2000  MOUNTAIN VIEW, Calif.--Aug. 17, 2000-Synopsys Inc. and Taiwan Semiconductor Manufacturing Corp. announced an agreement to jointly develop test chips and silicon-calibrated technology files.

Photronics Completes Majority Investment in Mask Firm

08/16/2000  JUPITER, Fla.--Aug. 16, 2000--Photronics, a maker of photomasks, is the new majority owner of Precision Semiconductor Mask Corp.

Photronics Opens Advanced Reticle Characterization Center

08/15/2000  AUSTIN, Texas--Aug. 15, 2000--Photronics Inc. has opened its Advanced Reticle Characterization Center (ARCC) designed to meet the growing demand from semiconductor manufacturers and equipment suppliers working on technologies at and below the 0.13 ?m technology node.

MOSAID Invests in ATMOS DRAM Compilers

08/15/2000  OTTAWA, Canada--Aug. 15, 2000--MOSAID Technologies Inc. has taken a 19.9% equity stake in ATMOS Corp., broadening a relationship the two companies first established in December.

JMAR Introduces High-Speed, Lower-Power Semiconductor Memory Device

08/11/2000  SAN DIEGO, Calif.--Aug. 10, 2000--JMAR Technologies has introduced its new line of FIFO memory devices dubbed VeloSync designed to improve speed and power efficiency.




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Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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