Semiconductors

SEMICONDUCTORS ARTICLES



SanDisk Forms Joint Venture on Digital Photography

08/10/2000  SUNNYVALE, Calif.--Aug. 9, 2000--SanDisk Corp, a maker of flash memory chips and cards, has formed a joint venture with Photo-Me International intended to enable digital camera owners to obtain digital prints without the necessity of a personal computer or a high quality printer.

Dense-Pac Hurt By DRAM Allocation

08/10/2000  GARDEN GROVE, Calif.--Aug. 9, 2000--Dense-Pac Microsystems Inc., a provider of high-density semiconductor modules, said Wednesday that the recent DRAM allocation status would hurt the operational results for the quarter ending Aug. 31, 2000, compared with analyst expectations.

TSMC Announces 0.18-micron Mixed Signal and RF CMOS Processes

08/09/2000  HSIN-CHU, Taiwan--Aug. 8, 2000--Claiming an industry first, TSMC announced the production-readiness of an 0.18-?m mixed signal and RF CMOS process developed to meet the needs of the evolving telecommunications market.

EKC Expands Production of Copper Interconnect Cleaning Tool

08/06/2000  HAYWARD, Calif.--Aug. 4, 2000--Responding to increasing demand for products that clean copper interconnects in semiconductors, EKC Technology is boosting production of its EKC525 Cu cleaning tool, designed to clean advanced semiconductors that integrate copper interconnects and low-k dielectric materials.

Bio-Rad Laboratories Leaves Semiconductor Measurement Business

08/06/2000  HERCULES, Calif.--Aug. 4, 2000--Bio-Rad Laboratories has sold its semiconductor measurements business to Accent Semiconductor Technologies.

Kulicke & Soffa Shares Plunge on Order Deferrals

08/04/2000  WILLOW GROVE, Pa.--August 3, 2000--Kulicke & Soffa Industries, a supplier of bonding equipment for the semiconductor industry, saw its share prices plunge 25% yesterday after it announced some customer order deferrals and push-outs for its 8028 ball bonders.

Companies Complete Flip Chip Technology Transfer

08/03/2000  KAOHSIUNG, Taiwan--August 2, 2000--Advanced Semiconductor Engineering flip chip factory has received wafer bumping and redistribution technology from Kulicke & Soffa Industries and Flip Chip Technologies.

Therma-Wave Introduces New Metrology Products

08/02/2000  FREMONT, Calif.--August 1, 2000--Designed to expand its process control metrology systems business, Therma-Wave unveiled new products for use in metrology for metal films, critical dimension metrology, and a line of integrated metrology systems.

Outsourcing packaging engineering: The key to the ticking clock

08/01/2000  Time-to-market is indisputably the key issue facing the semiconductor industry. In the midst of the Internet revolution, opportunities abound for those semiconductor companies that can provide rapid solutions to these new-world demands

Software-driven wirebonding

08/01/2000  New design tools promise to relieve setup bottlenecks by automating the documentation and validation work

Particles...

08/01/2000  Cleanroom takes aim at Listeria; Taiwan chipmakers report little damage from quake; Wilshire Technologies signs definitive agreement of sale with Foamex Asia ...

SanDisk and TDK to Share Patents

07/28/2000  SUNNYDALE, Calif.--July 27, 2000--SanDisk Corp. and TDK Corp. announced a cross-licensing patent agreement which allows the companies to use each other's patents in design and manufacturing flash memory products.

Consortia Release English Version of 300mm Performance Metrics for 0.13-micron Processing

07/28/2000  PARIS, France--July 28, 2000--Building on their previous cooperation on 300mm wafer manufacturing requirements, International SEMATECH and the Japanese consortium Selete have made available the English language version of its 300mm equipment performance metrics for 0.13 ?m technology document.

Applied to Add Therma-Wave Metrology Systems

07/27/2000  FREMONT, Calif.--July 25, 2000--Therma-Wave Inc. will develop and supply advanced metrology solutions that integrate with Applied Materials' process systems and modules.

TSMC Equips 300mm Pilot Line with Applied Materials Systems

07/27/2000  SANTA CLARA, Calif.--July 26, 2000--Applied Materials Inc. announced that TSMC has placed a volume purchase order for its 300mm semiconductor manufacturing systems. Applied is now shipping systems to TSMC's Fab 6 located in Tainan, Taiwan.

JMAR Technologies To Develop X-ray Lithography System for U.S. Army

07/24/2000  SAN DIEGO, Calif.--July 21, 2000--JMAR Technologies Inc. has been awarded $3.8 million by the U.S Army to continue developing PXS laser plasma X-ray point-source technology for advanced semiconductor lithography applications.

Epi Wafer Monitoring Tool Promises Zero Scrap

07/24/2000  BILLERICA, Mass.--July 21, 2000--Promising users significant savings in cost and time due to its easy integration into the wafer production process, SemiTest Inc. has introduced the Epimet Model 2, an upgraded epitaxial resistivity monitoring tool.

Fairchild Semiconductor Offers Complete DIMM Support Solution

07/20/2000  SOUTH PORTLAND, Maine--July 20, 2000--Fairchild Semiconductor offers a DIMM Support Solution, which it says allows more memory and faster.

Fujitsu AMD Partnership Begins New Fab Construction

07/20/2000  SUNNYVALE, Calif.--July 20, 2000--Fujitsu AMD Semiconductor Ltd. broke ground this week on its third megafab which will be dedicated to manufacturing flash memory.

Avant! Granted Optical Proximity Correction Patent

07/20/2000  FREMONT, Calif.--July 20, 2000--Avant! Corporation was awarded patent number 6,081,658 for their Proximity Correction System for wafer lithography.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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