06/14/2000  SUNNYVALE, Calif.--June 14, 2000--Nanometrics Inc. has developed a Windows NT based software for the film metrology equipment market that takes advantage of the operating systems support of multi-tasking functions.

06/14/2000  SAN JOSE, Calif.--June 14, 2000--Electroglas Inc. a supplier of process management tools for the semiconductor industry, today announced the purchase by Silterra Malaysia of multiple 4090u wafer probers.

06/14/2000  SAN JOSE, Calif.--June 14, 2000--JDS Uniphase Corp. announced a definitive agreement to purchase a North Carolina facility to expand its Cronos MEMS manufacturing capacity.

06/13/2000  SAN DIEGO, CA--June 12, 2000--Cymer announced last week the shipment of its first ELX-6500F₂ laser to Ultratech Stepper.

06/07/2000  BOISE, Idaho--June 7, 2000--Micron Technology Inc. today announced samples of a new low-power memory architecture using stacked technology to combine both Flash and SRAM on one memory device.

06/06/2000  YOKOHAMA, Japan--June 6, 2000--MIPS Technologies and Chartered Semiconductor Manufacturing have completed the testing necessary to allow customers to use "drop-in" MIPS intellectual property processor cores directly through Chartered's foundries.

06/02/2000  TAOYUAN, Taiwan--May 31, 2000--Nanya Technology Corp. has placed a multiunit order for a memory yield improvement system from ESI, which will be deliver the product during the next eight months. Nanya officials say they will use the ESI systems to increase their production capacity of 64MB, 128MB and 256MB DRAM.

06/02/2000  LOS ANGELES, Calif.--June 6, 2000--Attendees at this week's Design Automation Conference (DAC) will have the opportunity to witness a "showcase" of a design initiative that promises to foster greater innovation of electronic design automation (EDA) tools.

06/01/2000  Wafer-level processing provides effective solutions to demanding requirements.

06/01/2000  JEDEC has propelled stacked chip-scale package standardization efforts in the form of a common agreement on SRAM and flash chips in a single package.

06/01/2000  Finding patterns and reporting their location quickly and accurately is essential in today's high-precision electronics and semiconductor manufacturing environments.

05/31/2000  PETALUMA, Calif.--May 30, 2000--Tegal Corp. today announced that it has received a patent for a process that minimizes critical dimension growth on a semiconductor wafers.

05/31/2000  MUNICH, Germany--May 30, 2000--International SEMATECH, Carl Zeiss, and the EUV LLC announced a program to demonstrate advanced optics for extreme ultraviolet lithography.

05/31/2000  SAN JOSE, Calif.--May 30, 2000--1st Silicon has purchased multiple SPEED high density plasma chemical vapor deposition tools from Novellus Systems.

05/26/2000  Fremont, CA--May 25, 2000--Hyundai Electronic, Ltd. has selected Avant!'s Taurus-OPC software for its 0.18 and 0.15 micron production DRAM processes.

05/25/2000  AUSTIN, TX--May 24, 2000--Fresh on the heels of pending legislation before the U.S. Congress that, if passed, would grant China normal trading privileges, a number of U.S.-based semiconductor manufacturers are seeking a foothold in the rapidly growing Chinese economy.

05/18/2000  ROUSSET, France--May 18, 2000--The Prime Minister of France, Mr Lionel Jospin, inaugurated Rousset8, STMicroelectronics' latest 200 mm wafer plant designed energy efficiency in mind. The fab is located in Rousset, near Aix-en-Provence in the south of France.

05/18/2000  ROUSSET, France--May 18, 2000--The Prime Minister of France, Mr Lionel Jospin, inaugurated Rousset8, STMicroelectronics' latest 200 mm wafer plant designed energy efficiency in mind. The fab is located in Rousset, near Aix-en-Provence in the south of France.

05/18/2000  MUNICH, Germany?May 18, 2000?Karl Suss and Image Technology are teaming to develop standardized 9-inch photomasks for high volume wafer bumping and wafer-lever chip scale packaging.

05/17/2000  CORVALLIS, OR.--May 17, 2000--Electroglas Inspection Products has increased wafer throughput, accuracy, and repeatability of QuickSilver II post-fab bumped wafer inspection system, company officials say.