Semiconductors

SEMICONDUCTORS ARTICLES



UPMEM announces the first processing in-memory chip accelerating Big Data applications

09/08/2017  UPMEM, a fabless semiconductor startup company, announces UPMEM Processing In-Memory (PIM), the next generation hardware solution for data intensive applications in the datacenter, solving server-level efficiency and performance bottlenecks.

NUS scientists unravel new insights into promising semiconductor material

09/08/2017  Researchers from the National University of Singapore (NUS) have established new findings on the properties of two-dimensional molybdenum disulfide (MoS2), a widely studied semiconductor of the future.

Lam Research acquires Coventor

09/08/2017  Lam Research Corporation announced that it has completed the acquisition of Coventor, Inc.

Cadence delivers comprehensive IP portfolio for TSMC 16FFC automotive design enablement platform

09/07/2017  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced it is delivering a comprehensive automotive IP portfolio for the TSMC 16nm FinFET Compact (16FFC) automotive process technology.

Kulicke & Soffa and Kinik sign collaboration agreement to provide comprehensive dicing blades solutions

09/07/2017  Kulicke & Soffa Industries, Inc. announced today its collaboration agreement with Kinik Company, to provide comprehensive dicing blades solutions.

SiFive and UltraSoC partner to accelerate RISC-V development through DesignShare

09/07/2017  SiFive, the first fabless provider of customized, open-source-enabled semiconductors, today announced that UltraSoC will provide debug and trace technology for the SiFive Freedom platform, based on the RISC-V open source processor specification as part of the DesignShare initiative.

Microsemi appoints Richard Beyer to its Board of Directors

09/07/2017  Microsemi Corporation today announced the appointment of Richard M. Beyer to its board of directors.

Cypress appoints Catherine Lego to Board of Directors

09/06/2017  Cypress Semiconductor Corp. today announced the appointment of Catherine P. Lego to its board of directors.

Defects in next-generation solar cells can be healed with light

09/06/2017  Researchers have shown that defects in the molecular structure of perovskites - a material which could revolutionise the solar cell industry - can be "healed" by exposing it to light and just the right amount of humidity.

Newly-discovered semiconductor dynamics may help improve energy efficiency

09/06/2017  Researchers examining the flow of electricity through semiconductors have uncovered another reason these materials seem to lose their ability to carry a charge as they become more densely "doped." Their results, which may help engineers design faster semiconductors in the future, are published online in the journal ACS Nano.

Stay ahead of the curve with SMC 2017 - Materials accelerating innovation

09/06/2017  Slated for September 18-20 in San Jose, Calif., the 18th annual SMC “offers a unique chance to network and discover opportunities in and around the industry in a year where dramatic growth has returned to the semiconductor market,” observes SMC 2017 co-chair Mark Thirsk of Linx Consulting, who will provide opening remarks at the conference.

Securing talent to connect, collaborate and innovate

09/06/2017  Our industry has a significant need for additional workers and several trends are working against us.

ASE K7 receives Green Factory Label

09/01/2017  Advanced Semiconductor Engineering, Inc, a semiconductor assembly and test service provider, announced that its K7 manufacturing facility in Kaohsiung has received the Green Factory Label from the Industrial Development Bureau, Ministry of Economic Affairs, Taiwan.

Update on the sale of Toshiba Memory Corporation

09/01/2017  There have been media reports speculating that Toshiba will make a decision on Aug 31 at Toshiba’s Board of Directors meeting.

DARPA's drive to keep the microelectronics revolution at full speed builds its own momentum

09/01/2017  A dozen performer teams with DARPA’s CHIPS program convene to kick off an ambitious push for an era of versatile, plug-and-play "chiplets."

SiC & GaN technologies upset the traditional benchmarks of the IGBT industry

09/01/2017  How is the IGBT market evolving for different applications? How will the IGBT market face the adoption of high performance WBG based devices?

Equipment forecast: $49.4 billion

09/01/2017  In 2018, 7.7 percent growth is expected, resulting in another record-breaking year—totaling $53.2 billion for the global semiconductor equipment market.

The ConFab 2018 will be held May 20-23

09/01/2017  The ConFab 2018, to be held May 20-23 in Las Vegas at THE COSMOPOLITAN of Las Vegas, will take a close look at the new applications driving the semiconductor industry, the technology that will be required at the device and process level to meet new demands, and – perhaps most importantly – the kind of strategic collaboration that will be required.

New device could turn heat energy into a viable fuel source

08/31/2017  A new device being developed by Washington State University physicist Yi Gu could one day turn the heat generated by a wide array of electronics into a usable fuel source.

Most of 2017 capital spending will go to foundry and flash memory

08/31/2017  Spending for DRAM expected to show biggest percentage gain in 2017.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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