05/01/1999  The palm-sized Thermal Track instrument enables users to conduct direct multipoint wafer temperature measurements to monitor thermal cycles in lithography, CVD, RTP and other semiconductor processes in real time. According to the manufacturer, this computer is half the size and weight of its predecessor and runs five times as long on its lithium-ion battery. New software features include a strip chart display of temperature versus time for each temperature sensor location on the wafer, and for s

04/01/1999  Model KA250, un veiled in March by Fluoroware Inc. (Chaska, MN), is a customizable 200-mm carrier for advanced wafer processing that incorporates two materials to achieve high performance at mid-range prices. Enhanced contamination control and automation compatibility are among its key characteristics.

03/01/1999  Willson VistaMax 2000 series goggles with polycarbonate lenses feature a high-flow fog prevention system and a deep, curved PVC frame that enables users to wear the goggles over prescription glasses and with disposable masks. According to the manufacturer, non-mist performance prevents fogging and misting up to three times better than conventional non-mist goggles.

03/01/1999  NEW YORK -- Even in semiconductor manufacturing, the saying still holds true: the whole is greater than the sum of the parts. Semiconductor processing is complex, cycling through hundreds of individual steps to create an integrated circuit. The interaction between these steps can impact contamination control.

03/01/1999  Leuven, Belgium -- The Inter uni versity Microelectronics Research Center (IMEC; Leuven, Belgium) and Semitool Inc. (Kalispell, MT) have announced a collaboration aimed at replacing conventional H2SO4/H2O2 photoresist-removal and cleaning processes used in semiconductor fabrication with lower-cost, environmentally friendly technology. The removal of H2SO4 and H2O2 from the manufacturing process promises to both reduce chemical and disposal costs as well as reduce deionized water usage. Ozonated

03/01/1999  Marblehead, MA -- Despite economic difficulties and a spotty technology base, Romanian institutes and companies are engaged in semiconductor development work, and are seeking international development partners.

02/01/1999  PRI Automation has agreed to a stock-swap takeover of Promis Systems Inc., a Toronto-based manufacturing execution systems company. The deal adds another link to PRI`s chain of fab automation products, which includes materials transport, front-end robots and planning/scheduling software. It will also add another layer of competition between PRI and tool robotics supplier Brooks Automation, which acquired MES developer FASTtech Integration last September, and create a direct rivalry with Applied

02/01/1999  GaSonics is installing its third Performance Enhancement Platform (PEP) system in the Vitesse Pierre Lamond wafer fabrication facility in Colorado Springs, CO -- a six-inch Gallium Arsenide (GaAs) fab. The PEP system features a fluorine-compatible clean chamber and a high throughput module for rapid resist removal. According to Vitesse, the system meets criteria for tool uptime and flexibility. The facility will support current generation technology and future technology development. -- TGW

12/01/1998  Daw Technologies has been awarded a $5.5 million contract to build approximately 42,000 square feet of Class 1,000 cleanroom space for a semiconductor wafer fabrication facility in Fort Collins, CO. Daw is responsible for installation and on-site project and construction management of the cleanroom area, and is furnishing critical components, including AirFrame ceilings, NetWork wall systems and Matrix aluminum access flooring systems. Completion is scheduled for July 1999. -- TGW

11/01/1998  Singapore -- Philips Electronics, the Netherlands, and foundry Taiwan Semiconductor Manufacturing Corp. are planning to build Singapore`s eleventh fab, a $1.2 billion joint venture facility targeted to begin production in the second half of 2000.

11/01/1998  National Semiconductor blasted the Wall Street Journal for running an Oct. 5 front-page article that questioned worker safety at its fab in Greenock, Scotland. National said the article "ignores crucial facts and is misleading," and said "there is no scientific evidence linking the semiconductor manufacturing environment and cancer." The article features interviews with a number of former and current workers. It notes a dearth of studies on wafer fab health issues, and quotes an EPA official as

10/01/1998  The SmartControl system consists of EF-1 fan filter units that can be controlled via touch panel or personal computers. Available with HEPA and ULPA filters, the units meet requirements for cleanroom applications for the semiconductor, wafer fab, MEMS and pharmaceutical industries. According to the manufacturer, the SmartControl system allows staggered start-ups, which can result in energy savings for users. Customization is available.

09/01/1998  San Francisco -- Though many semiconductor market forecasts cite a delay in the migration from 200- to 300-mm wafer fabrication, significant R&D strides are being made. In the area of contamination control, for example, such efforts include development of an ultraclean pumping system and high-reliability gas distribution system for 300-mm wafer fabrication; the use of chromium-rich oxide passivation and fluorine passivation for contamination-free delivery of reactive and corrosive gases; and the

09/01/1998  Allen, TX -- A startup that hopes to revolutionize the semiconductor industry by replacing semiconductor wafers with spheres could alter the contamination control industry because it employs a proprietary manufacturing process that substitutes cleanrooms with alternative clean environments.

09/01/1998  NovaCel sponges and NovaPoly hemmed polyester wipers are made for use in critical and controlled environments. NovaCel is a white poly vinyl acetal sponge that can be used as a wafer polishing medium. It is available in dry or pre-moistened versions. NovaPoly wipers feature an inverted hem, which guards against the generation of particulate, according to the manufacturer. Their sturdy construction allows them to be laundered and re-used. Both the sponges and wipers come in standard and custom si

08/01/1998  These ultraclean polyethylene gloves are suited for use by silicon growing processors and chip and wafer manufacturers. They test 5 PPMW for anti- oxidants and slip-agents and 10 PPMW for ash content, according to the manufacturer. All film is blown using certified nitrogen gas, with a gauge of 0.002 to 0.013 mil. Materials are made from selected resin and converted in a Class 100 cleanroom.

08/01/1998  The recent downturn in the semiconductor market has forced many chip makers and semiconductor manufacturing equipment developers to sharpen their pencils and find new ways to reduce costs without compromising product quality. As a result, more and more companies are discovering that wafer reclamation is an effective cost-cutting measure. In fact, some of the biggest wafer manufacturers, under pressure since the first quarter of 1996 when dynamic random-access memory (DRAM) prices dropped dramati

08/01/1998  Norwalk, CT -- Advances in membrane designs and surfaces are making the technology more beneficial to a broader range of industries concerned with contamination control, according to new findings published by Business Communications Co. (Norwalk, CT).

08/01/1998  Johnson Matthey and Air Products and Chemicals Inc. have jointly developed a palladium membrane diffusion technology that the companies claim virtually eliminates carbon monoxide, carbon dioxide and methane contamination in hydrogen gas, which is used in semiconductor manufacturing applications and can hinder device performance. The technology employs a methanation catalyst that converts the carbon monoxide and carbon dioxide to methane, allowing the palladium membrane to easily separate the che

07/01/1998  The VaporSorb CDA filter purifies the clean dry air used in semiconductor lithography processes. According to the manufacturer, it combines adsorption, chemisorption and catalytic destruction to remove airborne molecular contaminants, including acids, bases, dopants, condensable silicones and hydrocarbons; it also captures particulates down to 0.1 micron. The CDA filter is available with a flow rate of 3 or 30 lpm and can be equipped with an optional drying module.