08/04/2017  Topological insulators, a class of materials which has been investigated for just over a decade, have been heralded as a new 'wonder material', as has graphene. But so far, topological insulators have not quite lived up to the expectations fueled by theoretical studies. University of Groningen physicists now have an idea about why.

08/04/2017  Q2 sales are highest on record, 5.8 percent more than previous quarter, 23.7 percent higher than Q2 of last year.

08/03/2017  Covalent Metrology announced today that it has consolidated operations in a larger facility located in Santa Clara, CA.

08/03/2017  The III-N semiconductor family has attracted significant research attention over the last 25 years, resulting in intensive patenting activity, with a substantial increase during the past decade.

08/03/2017  Toshiba Corporation today announced that Toshiba Memory Corporation (TMC) will unilaterally invest in manufacturing equipment for the Fab 6 clean room at Yokkaichi Operations.

08/03/2017  GLOBALFOUNDRIES and Silicon Mobility today announced they have successfully produced the industry’s first automotive Field Programmable Controller Unit (FPCU) solution, called OLEA T222.

08/02/2017  Former Director of National Security Agency, Commander of U.S. Cyber Command to weigh in on the importance of technology to national security.

08/02/2017  DRAM, NAND flash memory markets drive the first annual double-digit upturn since 2010.

08/01/2017  The new SRP 5000 angular positioning system from HEIDENHAIN incorporates its high accuracy MRP 5000 angle encoder with accomplished bearing technology along with a unique ETEL torque motor with ultra-low detent torque.

08/01/2017  Researchers in China have disproved the theory that oxide electrodes destabilize ferroelectric phenomena called flux-closure domains in ferroelectric thin films.

08/01/2017  SEMICON Southeast Asia will make its debut in Kuala Lumpur, Malaysia on May 8-10 at the new Malaysia International Trade & Exhibition Centre (MITEC).

07/31/2017  Analog Devices, Inc. (ADI) today announced that it has become an affiliate member of Mcity at the University of Michigan.

07/31/2017  Berkeley Lab, UC Berkeley scientists discover unique thermoelectric properties in cesium tin iodide.

07/31/2017  TECHCET's model shows all slack soon gone from supply-chain for both 300mm and 200mm diameter.

07/28/2017  For an increasing number of designs, companies are finding it beneficial to design their own ASICs with system-on-a- chip (SoC) complexity. For reasons of cost reduction, quality improvement, IP protection and security, a full turn-key ASIC can be achieved for $1-5 million, particularly if the design can be built using mature technology nodes.

07/28/2017  Sub-Fab Fault Detection and Classification (FDC) software platforms collect, integrate and analyze operational data.

07/28/2017  In-line metrology methods used during extreme wafer thinning process pathfinding and development are introduced.

07/27/2017  Solid State Technology will be conducting a new survey will take aim at understanding what this evolution means to the semicon-ductor manufacturing industry supply chain in terms of the technology that will be needed.

07/27/2017  Using scanning capacitance microscopy with a Park Systems atomic force microscope a team at NASA successfully characterized both the spatial variations in capacitance as well as the topography of vacuum-channel nanoelectronic transistors.

07/27/2017  As 3D NAND becomes the mainstream technology, its challenging roadmap poses opportunities for continued innovation.