12/20/2018  Agreement expands 15-year R&D partnership to define leadership roadmap for semiconductor industry.

12/20/2018  For 7nm node chips, any contaminant can make a chip fail. Microcontamination control is the last line of defense for chipmakers, as even a lot yield in the high 90s percent range can bear chips with long-term reliability issues.

12/20/2018  At SEMICON Japan 2019, SEMI recognized two industry veterans active in the Japan chapter for their longtime contributions to the SEMI International Standards program.

12/19/2018  A research study on low noise and high-performance transistors led by Suprem Das, assistant professor of industrial and manufacturing systems engineering, in collaboration with researchers at Purdue University, was recently published by Physical Review Applied.

12/19/2018  Synopsys, Inc. today announced that the Liberty Technical Advisory Board (LTAB) and Interconnect Modeling Technical Advisory Board (IMTAB) have ratified new modeling constructs to address timing and parasitic extraction challenges at process nodes down to two nanometers.

12/19/2018  The billings figure is 4.2 percent lower than the final October 2018 level of $2.03 billion, and is 5.3 percent lower than the November 2017 billings level of $2.05 billion.

12/18/2018  Contributing to improved user productivity and yield through operational monitoring and analysis for semiconductor manufacturing equipment.

12/18/2018  Researchers at the University of Florida, the U.S. Naval Research Laboratory and Korea University provide a detailed perspective on the properties, capabilities, current limitations and future developments for one of the most promising UWB compounds, gallium oxide.

12/17/2018  JEDEC Solid State Technology Association announced the publication of an update to JESD235 High Bandwidth Memory (HBM) DRAM standard.

12/17/2018  International research team, co-led by UC Riverside physicist, shows how pure graphene efficiently converts light into electricity.

12/17/2018  Using ultrasensitive magnetic probes, researchers unveil a surprising link between emergent magnetism and mechanical pressure in artificially engineered non-magnetic oxide heterostructures.

12/17/2018  Total fab equipment spending in 2019 is projected to drop 8 percent, a sharp reversal from the previously forecast increase of 7 percent as fab investment growth has been revised downward for 2018 to 10 percent from the 14 percent predicted in August.

12/14/2018  RISC-V leader honored for its products, growth and performance by Global Semiconductor Alliance.

12/14/2018  DRAM fastest growing market in four of past six years, demonstrating very cyclical market.

12/13/2018  Leading 200 mm foundry selects SST's SuperFlash technology for 110 nm CMOS process platform.

12/13/2018  ClassOne Technology, global supplier of wet processing equipment for <200mm semiconductor manufacturing, announced the sale of three more tools to the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik (FBH) in Berlin, Germany.

12/13/2018  Micron Technology, Inc., a developer of memory and storage solutions, today announced that its monolithic 12Gb low-power double data rate 4X (LPDDR4X) DRAM has been validated for use in MediaTek's new Helio P90 smartphone platform reference design.

12/12/2018  At Intel “Architecture Day,” top executives, architects and fellows revealed next-generation technologies and discussed progress on a strategy to power an expanding universe of data-intensive workloads for PCs and other smart consumer devices, high-speed networks, ubiquitous artificial intelligence (AI), specialized cloud data centers and autonomous vehicles.

12/12/2018  Now that most companies in our sector analyses have reported their calendar third quarter 2018 financial results, we have final or 3Q'18/2Q'17 growth estimates for the world electronic supply chain.

12/12/2018  The equipment market is expected to contract 4.0 percent in 2019 but grow 20.7 percent to reach $71.9 billion, an all-time high.