07/18/2017  The Semiconductor Industry Association (SIA) announced Mark Durcan, former CEO of Micron Technology, Inc., and a longtime leader in advancing semiconductor technology, has been named the 2017 recipient of SIA's highest honor, the Robert N. Noyce Award.

07/18/2017  The Semiconductor Industry Association today announced the winners of its 2017 University Research Award.

07/18/2017  Rice University researchers turn common insulator into a magnetic semiconductor.

07/18/2017  Record annual ASP growth rates forecast for both memory segments.

07/17/2017  Transistors, as used in billions on every computer chip, are nowadays based on semiconductor-type materials, usually silicon. As the demands for computer chips in laptops, tablets and smartphones continue to rise, new possibilities are being sought out to fabricate them inexpensively, energy-saving and flexibly.

07/17/2017  Scientists from the Moscow Institute of Physics and Technology (MIPT) and the Kotelnikov Institute of Radio Engineering and Electronics (IRE) of the Russian Academy of Sciences (RAS), in collaboration with their colleagues from Finland, have developed a new type of optical fiber that has an extremely large core diameter and preserves the coherent properties of light.

07/14/2017  Integrated solution leverages GF's 22FDX technology to decrease power, area, and cost for NB-IoT and LTE-M applications.

07/14/2017  Semiconductor content expected to reach 28.1% this year, breaking previous high of 25.9% set in 2010.

07/14/2017  Applied Materials, Inc. today recognized 10 companies with Supplier of the Year Awards for their contributions to Applied's success over the past year.

07/13/2017  ASM International introduced the Intrepid ES 300mm epitaxy (epi) tool for advanced-node CMOS logic and memory high-volume production applications.

07/13/2017  Digital disruption begets innovation. Challenges equal opportunities.

07/13/2017  Semiconductor manufacturers use a variety of high global warming potential (GWP) gases to process wafers and to rapidly clean chemical vapor deposition (CVD) tool chambers.

07/13/2017  Global industry R&D hub IMEC defines the “IMEC 7nm-Node” (I7N) for finFETs to have 56 nm Contacted Gate Pitch (CGP) with 40 nm Metal Pitch (MP), and such critical mask layers can be patterned with a single exposure of 0.33 N.A. EUVL as provided by the ASML NXE:3400B tool.

07/13/2017  SEMI announced the recipients of the 2017 SEMI Awards for the Americas.

07/12/2017  SEMI honored four industry leaders for their outstanding accomplishments in developing Standards for the electronics and related industries. The SEMI Standards awards were announced at the SEMI International Standards reception held during SEMICON West 2017.

07/12/2017  Solid State Technology and SEMI today announced the recipient of the 2017 "Best of West" Award -- Microtronic Inc.-- for its EAGLEview 5.

07/12/2017  When it comes to defects and contamination in the semiconductor manufacturing industry, most people tend to think of small, sub-nm defects at the transistor level. As important as those are, there are plenty of things that can go wrong and be seen at the macro level.

07/12/2017  In order to increase device performance, the semiconductor industry has slowly been implementing many new materials.

07/12/2017  Worldwide sales of new semiconductor manufacturing equipment are projected to increase 19.8 percent to total $49.4 billion in 2017, marking the first time that the semiconductor equipment market has exceeded the market high of $47.7 billion set in 2000.

07/12/2017  Keynote speakers Terry Higashi of Tokyo Electron Ltd. and Tom Caulfield of GlobalFoundries took the stage at the Yerba Buena Theater Tuesday morning to predict major changes in the goals and operations of the semiconductor industry.