05/23/2017  The 63rd annual IEEE International Electron Devices Meeting (IEDM), to be held at the Hilton San Francisco Union Square hotel December 2-6, 2017, has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

05/23/2017  North America-based manufacturers of semiconductor equipment posted $2.17 billion in billings worldwide in April 2017 (three-month average basis), according to the April Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

05/23/2017  GLOBALFOUNDRIES and the Chengdu municipality today announced an investment to spur innovation in China's semiconductor industry.

05/22/2017  SEMI today announced its plans to deliver specialized programs at SEMICON West 2017 (July 11-13 at Moscone Center in San Francisco, Calif.) in partnership with IEEE (Institute of Electrical and Electronics Engineers), Society of Automotive Engineers International (SAE), and imec.

05/22/2017  Materials scientists in Japan have developed a new diamond transistor fabrication process that promises to advance the development of more robust and energy-efficient electronics.

05/22/2017  As China embarks on the Made in China 2025 plan with electronics and semiconductor technology as one of the Top 10 focus areas, China's semiconductor industry has an unprecedented growth opportunity.

05/15/2017  Lam Research today announced that Dr. Young Bum Koh has joined the company's board of directors effective as of May 10, 2017.

05/15/2017  Worldwide semiconductor revenue totaled $343.5 billion in 2016, a 2.6 percent increase from 2015 revenue of $334.9 billion, according to final results by Gartner, Inc.

05/15/2017  ON Semiconductor Corporation announced that it is has been named the winner of the Gold Stevie Award for Large Manufacturing Company of the Year in The 15th Annual American Business Awards (ABAs).

05/12/2017  Racyics GmbH announced today it has launched makeChip, an design service platform, developed using GLOBALFOUNDRIES' 22FDX process technology and supported by Cadence.

05/12/2017  Renesas Electronics Corporation announced it will consolidate its subsidiary Renesas System Design, Co., Ltd. through an absorption-type merger.

05/12/2017  As computer chips become smaller, faster and more powerful, their insulating layers must also be much more robust -- currently a limiting factor for semiconductor technology. A collaborative University of Kentucky-Texas A&M University research team says this new phase of hafnia is an order of magnitude better at withstanding applied fields.

05/11/2017  Soitec, a designer and manufacturer of semiconductor materials for the electronics industry, has appointed Stephen Lin to the newly created position of vice president of strategic business development in China, a key region for the company's future growth plans.

05/11/2017  WIN Semiconductors Corp has completed phase 2 expansion at its newest wafer fab, Fab C.

05/11/2017  Synopsys, Inc. today announced that its IC Validator was successfully deployed on some of the industry's largest and most advanced designs to accelerate design rule checking (DRC) closure.

05/10/2017  Berkeley Lab researchers create polarization gradient, boost temperature span of ubiquitous material.

05/10/2017  Semiconductor Manufacturing International Corporation announces the appointment of Dr. Haijun Zhao as CEO replacing Dr. Tzu-Yin Chiu, who will continue to serve as Vice Chairman and Non-Executive Director of the Board and guide the Company's future strategic direction.

05/10/2017  SEMI today announced that SEMICON West (July 11-13 in San Francisco, Calif.) experience packages are now available for purchase, allowing attendees to choose the programs and events most relevant to their interests.

05/09/2017  UnitySC today announced multiple orders from a leading integrated device manufacturer (IDM) for its modular 4See Series automated defect inspection platform.

05/09/2017  Graphene is considered as one of the most promising new materials. However, the systematic insertion of chemically bound atoms and molecules to control its properties is still a major challenge. Now, for the first time, scientists of the Friedrich-Alexander-Universität Erlangen-Nürnberg, the University of Vienna, the Freie Universität Berlin and the University Yachay Tech in Ecuador succeeded in precisely verifying the spectral fingerprint of such compounds in both theory and experiment.