Semiconductors

SEMICONDUCTORS ARTICLES



Imec scientist awarded ERC Advanced Grant to develop material stacks for video-rate holography

03/22/2017  Imec announces that Jan Genoe, one of its distinguished scientists, has been awarded an ERC Advanced Grant.

Architecture innovation in the DRAM industry: How it affects firms’ sustainable competence

03/20/2017  The technology leader in the DRAM industry has a greater advantage in terms of market share and profit.

Unexpected, star-spangled find may lead to advanced electronics

03/20/2017  For several years, a team of researchers at The University of Texas at Dallas has investigated various materials in search of those whose electrical properties might make them suitable for small, energy-efficient transistors to power next-generation electronic devices.

Peregrine Semiconductor acquires Arctic Sand Technologies

03/20/2017  Peregrine Semiconductor Corp., a Murata company and the founder of RF SOI (silicon on insulator), today announces the acquisition of Arctic Sand Technologies.

SEMI headquarters relocates

03/20/2017  SEMI today announced that it has moved its headquarters office to Milpitas, Calif.

Semiconductor Industry Association announces support of House tax reform blueprint

03/17/2017  The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, this week announced its support for the House "Better Way" corporate tax reform proposal as an appropriate starting point for reform.

North American semiconductor equipment industry posts February 2017 billings

03/17/2017  North America-based manufacturers of semiconductor equipment posted $1.97 billion in billings worldwide in February 2017 (three-month average basis), according to the February Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

U.S. companies still hold largest share of fabless company IC sales

03/16/2017  Largest fabless IC marketshare increase has come from Chinese suppliers, who now hold a 10% share.

AIM Photonics welcomes Coventor as newest member

03/16/2017  US-backed initiative taps process modeling specialist to enable manufacturing of high-yield, high-performance integrated photonic designs.

Synopsys' IC Compiler II certified for TSMC's 12nm process technology

03/16/2017  Synopsys, Inc. today announced that TSMC has certified the complete suite of products in the Synopsys Galaxy Design Platform for the most current version of 12nm FinFET process technology.

Electro-optical switch transmits data at record-low temperatures

03/16/2017  A silicon optical switch newly developed at Sandia National Laboratories is the first to transmit up to 10 gigabits per second of data at temperatures just a few degrees above absolute zero.

Synopsys and TSMC collaborate to develop interface, analog and foundation IP for 12nm finFET process

03/16/2017  Synopsys, Inc. (Nasdaq: SNPS) today announced its collaboration with TSMC to develop DesignWare Interface, Analog and Foundation IP for TSMC's 12FFC process.

Quantum movement of electrons in atomic layers shows potential of materials for electronics, photonics

03/15/2017  A University of Kansas research team has observed the counterintuitive motion of electrons during experiments in KU's Ultrafast Laser Lab. Because this sort of 'quantum' transport is very efficient, it could play a key role in a new type of manmade material that could be used someday in solar cells and electronics.

SEMI reports 2016 global semiconductor equipment sales of $41.2B

03/14/2017  SEMI today reported that worldwide sales of semiconductor manufacturing equipment totaled $41.24 billion in 2016, representing a year-over-year increase of 13 percent.

The ConFab 2017 announces leading semiconductor industry keynotes

03/14/2017  The ConFab announces keynotes in the May 14-17 event being held at the Hotel del Coronado in San Diego.

Cadence expands capabilities of integrated design and analysis flow for TSMC InFO packaging technology

03/13/2017  Cadence Design Systems, Inc. today announced new optimization capabilities within its holistic, integrated design flow for TSMC's advanced wafer-level Integrated Fan-Out (InFO) packaging technology.

Versum Materials receives TSMC "Excellent Performance Award"

03/13/2017  Versum Materials, Inc. announced today it received the "Excellent Performance Award" by the world's largest dedicated semiconductor foundry, TSMC.

SEMICON China 2017 opens tomorrow in Shanghai

03/13/2017  Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC).

Analog Devices completes acquisition of Linear Technology

03/10/2017  Analog Devices, Inc. today announced the completion of its acquisition of Linear Technology Corporation.

Sandia National Laboratories creates 3-D metasurfaces with optical possibilities

03/10/2017  The new Sandia metamaterials can be fabricated in multiple layers to form complex, three-dimensional meta-atoms that reflect more light than shiny gold surfaces, usually considered the ultimate in infrared reflectivity. The III-V materials also emit photons when excited -- something that silicon, which can reflect, transmit and absorb -- can't do.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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