03/10/2017  Now, University of Pennsylvania engineers have shown a way to make metamaterials with a single inclusion, providing easier fabrication, among other useful features.

03/10/2017  Applied Materials, Inc. today announced Thomas J. Iannotti as chairman of the Board of Directors effective immediately. Mr. Iannotti succeeds Willem P. Roelandts, who has retired from the board.

03/10/2017  Updated forecast shows total semiconductor shipments surpassing one trillion devices in 2018.

03/09/2017  Soitec has announced that the ramp up to high-volume production of 200mm silicon-on-insulator (SOI) wafers has begun at the manufacturing facility of its Chinese partner Shanghai Simgui Technology Co., Ltd.

03/09/2017  Synopsys, Inc. today announced the availability of a key technology in virtual prototyping which enables architecture performance requirements to be easily shared through the supply chain.

03/09/2017  NXP Semiconductors today announced the world's smallest single-chip SoC solution -- the MC9S08SUx microcontroller (MCU) family -- with an integrated 18V-to-5V LDO and MOSFET pre-driver that delivers ultra-high-voltage solution for drones, robots, power tools, DC fan, healthcare and other low-end brushless DC electric motor control (BLDC) applications.

03/09/2017  Russian physicists, with their colleagues from Europe through changing the light parameters, learned to generate quasiparticles - excitons, which were fully controllable and also helped to record information at room temperature.

03/08/2017  New IQ Aligner NT achieves double throughput and alignment accuracy over previous-generation platform; opens up new applications for EVG lithography solutions.

03/08/2017  Leti, a research institute of CEA Tech, today announced it has developed a shield that can help protect electronic devices against physical attacks from the chips’ backside.

03/08/2017  ClassOne Technology, manufacturer of wet processing equipment for 200mm and smaller wafers, announced that Scientech Corporation of Taipei, Taiwan, will become the company’s new representative for China, Taiwan and Southeast Asia, starting immediately.

03/07/2017  The Semiconductor Industry Association (SIA) today announced the addition of two leading U.S. semiconductor companies, Skyworks Solutions, Inc. and Western Digital Corporation, as SIA members.

03/07/2017  In a significant advance, particularly within the microelectronics realm, University of Massachusetts Amherst engineers have established electrical surface treatment of conducting thin films as a physical processing method to reduce surface roughness.

03/07/2017  Radiation hardness of e-mode devices confirm maturity of imec’s 200mm GaN-on-Si platform.

03/07/2017  Today, SEMI announced updates to its World Fab Forecast report, revealing that fab equipment spending is expected to reach an industry all-time record ? more than US$46 billion in 2017.

03/06/2017  Cypress Semiconductor Corp. (Nasdaq: CY) today announced it has sold the subsidiary that owns its semiconductor wafer fabrication facility in Bloomington, Minnesota to SkyWater Technology Foundry for $30 million.

03/06/2017  Year-to-year growth is market's largest since November 2010; month-to-month sales decrease slightly.

03/06/2017  Varying the thickness of crystallizing materials facilitates control over the patterns and properties of crystals.

03/06/2017  Promising alternative for MOSFET in future ultralow power chips.

03/02/2017  Manufacturers, suppliers and academia gather to understand the road ahead.

03/02/2017  Improved characteristics in power electronics and radio applications can be achieved by using a SOI wafer for gallium nitride growth.