03/02/2017  Three of the top 11 companies are expected to increase capex spending by 25% or more.

03/01/2017  Versum Materials, Inc. announced today that it would expand its manufacturing capacity at its Delivery Systems and Service (DS&S) headquarters in Allentown, Pennsylvania.

03/01/2017  Materion Corporation announced today that it has completed the previously announced acquisition of the target materials business of the Heraeus Group.

02/28/2017  Cadence Design Systems, Inc. today announced the Cadence Litho Physical Analyzer (LPA) Production Lithography Unified Solution (PLUS) developed in partnership with ASML, which seamlessly provides foundry-enabled lithography simulation capabilities during chip design implementation and signoff.

02/28/2017  The eBeam Initiative today announced that Semiconductor Manufacturing International Corporation (SMIC)--one of the world's leading global foundries--has joined its ranks.

02/28/2017  Semiconductor Research Corporation today announced that TSMC has signed an agreement to participate in two SRC research initiatives.

02/27/2017  Renesas Electronics Corporation and Intersil Corporation announced the completion of Renesas' acquisition of Intersil Corporation.

02/27/2017  At the SPIE Advanced Lithography conference in San Jose, Calif. (USA), imec and its partners will present a patterning solution for a 42nm-pitch M1 layer and a 32nm-pitch M2 layer in logic design compatible with the foundry N5 requirements.

02/27/2017  The impact of the Internet of Things (IoT) will be on display at SEMICON Southeast Asia, 25-27 April at SPICE in Penang.

02/24/2017  Fabless power semiconductor company Semitrex announced today that it has changed its name to Helix Semiconductors.

02/24/2017  NXP Semiconductors N.V., the world's largest supplier of automotive semiconductors, announced that it has joined the Automotive Information Sharing and Analysis Center (Auto-ISAC).

02/23/2017  Company demonstrates that magnetic-field debris mitigation, a new technology, extends collector mirror lifetime in Pilot light source for EUV lithography mass production plants, a major step towards eliminating bottlenecks.

02/23/2017  KLA-Tencor Corporation today introduced four innovative metrology systems that enable development and high-volume manufacturing of sub-10nm integrated circuit (IC) devices.

02/23/2017  South Korea narrows gap with Taiwan; China shows biggest increase, accounts for nearly 11%.

02/22/2017  Toyohashi University of Technology researchers have developed microhotplates (MHPs), in which an SU-8 photoresist was employed as a supporting material. The MHP can moderate the requirement for the layout design and the process condition of integrated smart gas sensors.

02/22/2017  ClassOne Technology announced a new company-wide initiative to reduce costs of operation (CoO) in copper plating processes.

02/22/2017  North America-based manufacturers of semiconductor equipment posted $1.86 billion in billings worldwide in January 2017 (three-month average basis).

02/21/2017  Scientists combine the ultra-fast with the ultra-small to pioneer microscopy at terahertz frequencies.

02/21/2017  SEMI today announced the appointment of Ajit Manocha as its president and CEO.

02/21/2017  Optimized RF features deliver high-performance solutions for mmWave beam forming applications in 5G smartphones and base stations.