02/21/2017  Mohamed Saleem has joined Brooks Instrument as the company's new chief technology officer (CTO), where he will oversee its California-based technology development center.

02/20/2017  An Steegen reveals some of the secrets of semiconductor scaling – a pipeline full of materials, device architectures and advanced techniques that promise to further extend semiconductor scaling.

02/20/2017  EUV, cobalt contacts, are expected to be introduced at the 7nm node by several semiconductor manufacturers.

02/20/2017  The five hottest areas for semiconductor growth in the coming years are: the Internet of Things (IoT), automotive, 5G, virtual reality/augmented reality (VR/AR), and artificial intelligence (AI). That was the message from Gary Patton, GlobalFoundries’ Chief Technology Officer and Senior VP or worldwide R&D, speaking at SEMI’s 2017 Industry Strategy Symposium in early January.

02/19/2017  At SEMI's Industry Strategy Syposium this year, a merger's and acquisitions panel, moderated by Robert Maire of Semiconductor Advisors, took a look at how the industry might look in the future.

02/17/2017  Engineers at the University of California San Diego have developed a material that could reduce signal losses in photonic devices.

02/17/2017  The explosive growth in demand for internet bandwidth and cloud computing capacity brings a new set of technology challenges and opportunities for the semiconductor supply chain.

02/16/2017  Ultratech, Inc. today announced that it has received a repeat, multiple-system order from a leading semiconductor manufacturer for its advanced packaging AP300 lithography systems.

02/16/2017  Among Top-10 R&D spenders, Intel accounted for 36% of R&D outlays.

02/15/2017  Information transport by spin as an alternative to conventional computing technology.

02/15/2017  Engineering researchers at Michigan State University have developed the first stretchable integrated circuit that is made entirely using an inkjet printer, raising the possibility of inexpensive mass production of smart fabric.

02/14/2017  In a breakthrough for gas sensing, a group of researchers in Germany has developed a buried tunnel junction VCSEL with a single-stage type-II active region to extend the wavelength coverage of electrically pumped VCSELs.

02/14/2017  Semtech Corporation, a supplier of analog and mixed-signal semiconductors, today announced the latest family of load switches in its FemtoSwitch product platform.

02/13/2017  ON Semiconductor today announced its top distribution partners for 2016.

02/13/2017  The company will continue investing in its wafer plants in the United States and Germany, expand its capacity in Singapore, and construct a facility to produce 12-inch wafers in Chengdu, China in order to satisfy Chinese and global demands for the company's 22FDX technology.

02/10/2017  Applied Materials, Inc. announced today that Dr. Om Nalamasu, Senior Vice President and Chief Technology Officer, has been elected to the U.S. National Academy of Engineering (NAE), one of the highest professional honors for engineers.

02/10/2017  The company is investing in its existing leading-edge fabs in the United States and Germany, expanding its footprint in China with a fab in Chengdu, and adding capacity for mainstream technologies in Singapore.

02/10/2017  Researchers in Singapore and China collaborate to create new photodetector based on GdNiO3/Nb-doped SrTiO3 p-n heterojunction.

02/09/2017  Grant A. Pierce, chief executive officer (CEO) of Sonics, Inc. was elected by the Board of Directors of the Electronic System Design Alliance (ESD Alliance) to serve as its chairman.

02/09/2017  Toshiba Corporation today announced that it has started construction of a new semiconductor fabrication facility, Fab 6, and a new R&D center, the Memory R&D Center, at Yokkaichi Operations in Mie prefecture, Japan, the company’s main memory production base.